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Wave Soldering Defects - Outgassing
Outgassing is still a common problem associated
with wave and hand soldering. Basically when a board is soldered
any moisture in the board close to the hole is heated and turned
to vapor. If there is thin plating or voids in the plating,
gassing can come through the plated hole wall. If solder is present
in the hole, this will produce voids in the solder as it solidifies.
The voids may appear as small holes in the surface of the joint,
as shown in Figure 1, or much larger cavities.
Having
the correct copper plating thickness in the through holes is
the key. A minimum
of 25µm of copper should be present on the surface of the hole
walls.
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| Figure 1: Voids caused by outgassing. |
We recently received a defect question
related to outgassing:
I'm getting solder balls on the top side of the board after
wave solder (same thing also happens at rework on solder fountain).
I'm using a SAC405 alloy. Have tried different fluxes, different preheats.
Have run the boards in 2 different factories with same results. Electrovert
wave solder being used. Getting some bottom-side solder balls as well,
but that's manageable. Topside solder balls can be seen by prying off
the topside connectors.
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| Figure 2: Reader-submitted photo showing a small cluster
of solder balls on the top side of the board after wave solder. |
Can
be either a single stray solder ball, or a small cluster of balls as
shown in the photo (Figure 2). Get the same results when trying to
rework a connector as well. Problem is not isolated to any one particular
connector. Solder fountain used for rework is Airvac PCBRM14. Get the
same results a rework. Have tried different flux applications, and
using more/less flux without change in the process. Any ideas?
Bob Willis answers: Based on the image (Figure
2) and your description of the trials you have run, the problem can
only be outgassing from the through hole. This can be related to the
flux outgassing as the board goes over the solder wave. From what you've
said of your trials, this would be less likely to occur if there were
no volatile material left in the through hole. Having experienced a
similar problem working with the introduction of VOC material for a
customer, I've found that this is possible. There is a lot of volatile
material from these water based materials.
If it is outgassing from the boards, this may be possible
as you said you see this issue on the other wave soldering systems,
fluxes and the rework stations that would not normally have pre-heat.
Have you tested the boards with the outgassing test? Try this test
with the procedure found here.
If you look at the my video clips they show us testing both
good and bad boards using the test method I have provided. Its simple, cheap
and not destructive to test boards.
www.bobwillis.co.uk/videoclips/outgassing01.wmv
www.bobwillis.co.uk/videoclips/outgassing02.wmv
Most common reasons or solutions:
- Poor pre heat process when using VOC free fluxes leads to spitting of
very fine solder balls.
- This plating of less that 20um in the through hole or where the surface
of the hole is so poor the plating does not cover broken glass bundles
leading to gassing.
- In the old days you could have outgassing from the plating on pins but
not to the degree shown.
Wave Soldering Defects:
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Outgassing | |
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