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Wave Soldering Defects - Lifted Resist
Figure 1 shows a very obvious example
of resist lifting from the surface of the board after soldering.
Quite
simply
this
is
due to incorrect specification of the printed board. Tin/lead should
not be used under resist on professional circuit boards. As the
tin/lead moves into a liquid phase it expands and may cause loss
of adhesion between the solder and the resist. If the resist is
brittle or thin it will separate as shown in Figure 1. It is
possible to use tin/lead if the thickness of the coating is less
than 3-5µm as there will be very little movement during wave or
reflow soldering.
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| Figure 1: The resist lifting here is due to incorrect
specification of the PCB. |
Wave Soldering Defects:
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Lifted Resist |
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