This page
sponsored by
 |
Wave Soldering Defects - Lifted Pads
Lifted pads are rarely seen on plated through
hole boards but can occur on single-sided boards during assembly.
The example in Figure 1 occurred directly after wave soldering
when the assembly was being handled. The adhesion of the copper
foil
decreases
as
the surface heats up so directly after soldering the copper adhesion
can be low. Any handling or force applied to the components can
cause lifting of the pads. Care needs to be taken when lifting
boards from the conveyor or out of pallets as often large components
are often used by operators as handles.
 |
| Figure 1: This lifted pad occurred during handling,
right after wave soldering. |
Wave Soldering Defects:
| | | | |
| | | 
Lifted Pads | |
| | | | |
| | | | |
| | | | |
|
