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The SOT23s in Figure 1 became deformed when the peak temperature of the device was exceeded. Although this device is generally well specified, some suppliers use plastic materials that will not stand higher rework temperatures. At standard reflow temperature there should not be a problem. Always read the supplier's guidelines and avoid multiple sourcing of parts.

Figure 1: Deformed SOT23 components.

Chip Leaching	Component Cracking	Cracked Joint	Crystallized Joints	Failure to Reflow
Joint Failure	Joint Voiding	Lifted Component	Open Joints	PCB Measelling
Plastic Coplanarity	Plastic Softening	Poor Pad Wetting	Poor Solderability & Wetting	Solder Beading
Solder Short	Solder Wicking