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All high pin count components should meet the minimum quality standard of JEDEC, the industry specification for this type of component. The leads should all be on one plane or within +/- 0.002". If the parts when supplied are like the example, which is clearly outside this specification, they should be rejected.

Figure 1: This part is clearly outside the JEDEC specification.

The most common cause of lead position problems is during handling between the manufacturer to the end user or from a distributor. The problem is also often seen in contract manufacture where a customer insists on sourcing the parts adding another link in the chain.

Chip Leaching	Component Cracking	Cracked Joint	Crystallized Joints	Failure to Reflow
Joint Failure	Joint Voiding	Lifted Component	Open Joints	PCB Measelling
Plastic Coplanarity	Plastic Softening	Poor Pad Wetting	Poor Solderability & Wetting	Solder Beading
Solder Short	Solder Wicking