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Figure 1 shows a microsection taken though a joint area shows the complete separation of the joint from the pad. In this example, the nickel plating on the copper pad has failed. The soldering operation was completely successful. The surface of the pad was not correctly cleaned prior to the plating operation.

The void in the microsection did not contribute to the solder joint failure.

Figure 1: Complete separation of the joint from the pad.

Chip Leaching	Component Cracking	Cracked Joint	Crystallized Joints	Failure to Reflow
Joint Failure	Joint Voiding	Lifted Component	Open Joints	PCB Measelling
Plastic Coplanarity	Plastic Softening	Poor Pad Wetting	Poor Solderability & Wetting	Solder Beading
Solder Short	Solder Wicking