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This type of joint formation is often seen on LCCC (leadless ceramic chip carriers) and is a surface effect on the solder joint. It may be caused by the joint remaining in the liquid phase for too long with no flux on the surface. This then causes the rough surface to appear. It does not effect the joint quality and is considered a cosmetic defect.

Figure 1: Crystallized joints on an LCCC.

Chip Leaching	Component Cracking	Cracked Joint	Crystallized Joints	Failure to Reflow
Joint Failure	Joint Voiding	Lifted Component	Open Joints	PCB Measelling
Plastic Coplanarity	Plastic Softening	Poor Pad Wetting	Poor Solderability & Wetting	Solder Beading
Solder Short	Solder Wicking