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Reflow Soldering Defects - Chip Leaching Many chip capacitors and variable resistor still have a silver palladium coating as the solderable surface during assembly. During soldering with tin/lead alloys the coating is readily soluble in the solder in its liquid state. Normally a silver-loaded solder paste or wire is used, which reduces the degree to which the silver plating is leached from the termination. A more common practice is to specify a nickel barrier layer on the parts with a tin/lead solder coating. This prevents the leaching occurring during assembly.
Reflow Soldering Defects:
Text and photos courtesy of Bob Willis |
