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Solder paste scooping is occurs when the squeegee blade enters into the stencil aperture and removes paste from the center of the print. This is caused by high print pressure and can be exaggerated by rubber blades and large stencil apertures.

Figure 1: Scooping shown on a 1206 pad.

Figure 1 shows scooping on a 1206 pad, which is flat and the ideal surface to print onto for SMT applications. This type of defect should not occur on parts like this.

Damaged Stencils	Stencil Blockage	Paste Misalignment	Smudged Paste	Poor Definition
Incomplete Prints	Residues	Bleeds	Ears	Scooping
Shorts	Slump	PIHR Printing