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Stencil, Solder Paste & Printing Defects - Solder
Paste Bleeds
The example in Figure 1 is fairly unusual, but is an excellent
example of paste particle bleed due to printer board vacuum on
the printer. Basically, during printing some engineers use a vacuum
to hold
boards flat. When
the stencil is sitting on the surface of the board, any gap can
be a path for paste bleed. The paste is literally sucked off the
surface of
the pad.
 |
| Figure 1: During vacuum hold-down, a gap caused this
bleed. |
Normally, if this is a bleed issue, the same type of fault
will be seen on repeated boards, but be careful during assessment--under
stencil paste contamination can produce the same type of defect.
More Stencil, Solder Paste & Printing Defects:
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Bleeds | | |
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© 2007 Trafalgar Publications
Text and photos courtesy of Bob Willis |