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Stencil, Solder Paste & Printing Defects - Solder Paste Bleeds

The example in Figure 1 is fairly unusual, but is an excellent example of paste particle bleed due to printer board vacuum on the printer. Basically, during printing some engineers use a vacuum to hold boards flat. When the stencil is sitting on the surface of the board, any gap can be a path for paste bleed. The paste is literally sucked off the surface of the pad.

Figure 1: During vacuum hold-down, a gap caused this bleed.

Normally, if this is a bleed issue, the same type of fault will be seen on repeated boards, but be careful during assessment--under stencil paste contamination can produce the same type of defect.


More Stencil, Solder Paste & Printing Defects:

Bleeds

© 2007 Trafalgar Publications
Text and photos courtesy of Bob Willis