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Stencil, Solder Paste & Printing Defects - PIHR
Printing
Solder paste printing for through-hole reflow soldering
is an evolving process. The key is to obtain the correct volume of paste
to meet the minimum requirement of IPC 610. Although the strength of
the through-hole connection is not in doubt, the ideal situation for
the joint is to look exactly like a manual or wave solder connection.
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| Figure 1: A square print on the pins would allow increased
solder volume. |
A 100% fill is achievable if
the volume of paste is correctly applied. The holddown features on the bottom
of the image have been printed with paste in the holes with a cross-hair
aperture in the stencil to limit flow through and place paste in the hole
and not on the surface of the pad. The connector body sits on the surface
of the pad. Paste in this area could cause solder balls under the connector
body after reflow.
Figure 2 shows a close up view of poor solder
coverage on the surface of through hole pads after pin in hole
reflow (PIHR) assembly.
This can
be a function of the solderability of the basic board but is more
likely on
the base of the board to be insufficient paste pushed through or
available in the hole. Tests have shown that the strength of the
joints are not
affected but it would make visual inspection difficult. Examination
of the paste volume will be required and possible modification
of the stencil
design.
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| Figure 2: An example of poor wetting. |
Split print solder paste design
for pin in hole reflow as shown in Figure 3 would appear to be a good
idea as it allows the operator to see the hole for manual insertion
of the leaded connector. Unfortunately
it often does not work as the paste fails to wet the pads causing separation
and solder balls. It is possible to print a paste deposit leaving a
slight nick in the print to help guide the operator for lead insertion.
DEK Printing
Machines have some process guidelines for this technique that may be
beneficial.
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| Figure 3: There are better options than the split prints
shown here. |
More Stencil, Solder Paste & Printing Defects:
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Smudged Paste | |
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PIHR Printing | | |
© 2007 Trafalgar Publications
Text and photos courtesy of Bob Willis |