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Assembly & Placement Defects - Paste Pushout

Example of excessive paste push out during through hole assembly which will prevent any satisfactory joints being formed. The pin length should be controlled at 1-1.5 mm from the base of the board. In the example all the paste has been displaced from the through hole. When reflowed the solder will wet the entire length of the pin and leave no solder to fill the hole.

Figure 1: Excessive paste-pushout during through-hole assembly.


Assembly & Placement Defects:

Paste Pushout

 

© 2007 Trafalgar Publications
Text and photos courtesy of Bob Willis