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Assembly & Placement Defects -
Paste Pushout
Example of excessive paste push out during through
hole assembly which will prevent any satisfactory joints being
formed. The pin length should be controlled at 1-1.5 mm from the
base of the board. In the example all the paste has been displaced
from the through hole. When reflowed the solder will wet the entire
length of the pin and leave no solder to fill the hole.
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| Figure 1: Excessive paste-pushout during through-hole
assembly. |
Assembly & Placement Defects:
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Paste Pushout | |
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© 2007 Trafalgar Publications
Text and photos courtesy of Bob Willis |