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With the increase in pin in hole reflow assembly, we see a number of new defects occurring. In this example solder paste has been displaced by the connector pin insertion. During reflow it will cause solder balling to occur; this is demonstrated on the CD video clip. Either the paste print design has been done incorrectly or the connector does not have the correct standoff feet.

Figure 1: Here, solder paste has been displaced by the connector pin insertion.

All components for pin in hole reflow (PIHR) should have a standoff to prevent this problem occurring. The stand off feet should not contact the paste deposit on the surface of the board.

Component Movement	Cracked Component	Incorrect Placement	Misplaced Lead	Misplaced Component
Paste Displacement	Paste Pushout