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News of the latest technology you'll be seeing on the show floor.

Cogiscan - Booth #2829
Cogiscan will highlight Smart Traceability solutions and enhanced RFID Smart Feeder technology. Cogiscan's Smart Traceability solutions, which range from low cost barcode solutions to fully automatic RFID systems, allow electronic manuacturers to record and quickly access component, tool, process and PCB traceability data. Cogiscan's improved RFID Smart Feeder technology features a new Infra Red option that accelerates changeovers. The smart feeder system eliminates human intervention associated with scanning barcodes on feeders and feeder locations. Moreover, it can automatically track the exact location of all feeders in mobile trolleys and Smart Shelves, throughout the entire factory. www.cogiscan.com

Tamura - Booth #1145
Tamura H.A. Machinery Inc. will showcase its TAW-33 compact wave soldering system. The system, available in horizontal or vertical styles, is only 1.6 m in length. Innovative operation concepts include the transfer conveyor being divided into two lanes and automated control of the soldering requirements. The system features high-speed heating for the preheater. Power consumption is reduced by 30 percent. As an additional benefit, the system comes standard with the company’s FLIP solder bath for lead-free soldering solutions. www.tamura-ha.com

OK International - Booth #2201
OK International will introduce a precision rework solution for advanced packages and assemblies: Thermal Tweezers Nozzles. These nozzles will reduce thermal stresses placed on PCBs during multiple rework operations for POP Package on package stacked device components, and will deliver significantly better performance than traditional hot air tools and vacuum cups that are not suited for use with multiple stacked components, glob-top encapsulated die, or small devices that are easily damaged by excessive temperature. Using Thermal Tweezers Nozzles, engineers will be able to successfully remove devices such as multiple vertically-stacked ICs without damaging the IC packages and without exposing the PCB to excessive reflow cycles over and above the IPC-recommended maximum of five cycles. www.okinternational.com

EVS International - Booth #2758
EVS International will introduce the EVS 1000 solder recovery system in Sono-Tek’s booth 2758. The EVS 1000 is a smaller, lighter version of the popular EVS 3000/6000, with all of the recovery performance of the standard and lead-free solder units. The smaller size and footprint help reduce the cost, but still provide a capacity of 10lb/5kg of dross, giving a rapid payback and impressive return on capital employed. The EVS 1000 can quickly convert waste dross into pure solder in minutes not hours, while improving the wave solder machine process. This provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders. www.solderrecovery.com

GPD Global - Booth #2037
GPD Global will be releasing an innovative new platform to the entry level market. Powerful capabilities and unique programming will be key features that will stand this system out from the rest. Programming takes a unique twist by interfacing more with the person than with the computer. The system is completely compatible with all current valves and tools offered by GPD Global giving it great dispense capabilities. When the time comes to upgrade to a GPD Global Max Series System the valves and tools can be used, thereby reducing new machine investment. GPD Global will be demonstrating this new platform along with a MiniMax and MicroCell. Learn more.

Henkel - Booth #2001
The materials leader’s complete product offerings for the entire semiconductor packaging and PCB assembly value chains will be on display at the event, and Henkel experts will be on-hand to discuss the company’s latest research and most innovative new material offerings. Henkel’s Multicore® brand of solder products will be one of the main highlights of the exhibit, with lead-free and mixed-metal-optimized solder products along with the company’s award-winning flux solutions on display. In addition to Henkel’s award-winning PCB assembly materials, solutions for advanced packaging manufacture will also be showcased at the APEX event. www.henkelelectronics.com

JNJ Industries - Booth #2824
Lead-free solder pastes are often more difficult than traditional pasted to clean from stencils, boards, and application tools simply due to their flux chemistry. Now, JNJ Industries announces the introduction of Lead-Free Solder Paste Remover, a product specifically designed to tackle the job. The new product is a proprietary blend of aliphatic glycol ethers, isopropyl alcohol and DI Water. JNJ’s Lead-Free Solder Paste Remover is completely RoHS compliant, and can actually be used with any type of solder paste, lead-bearing or lead-free, no-clean and/or water-based. It can be used to clean stencils, screens, misprinted boards, tools, benches, and machinery. It can also be used to clean or remove (uncured) SMT chip bonder type epoxies. www.jnj-industries.com

Eunil - Booth #1051
Eunil H.A. Americas Inc. will highlight its Label Master 1100P label attachment system. Typically, attaching labels to PCBs is both labor-intensive and inconvenient. However, Eunil’s new, fully automated Label Master 1100P system changes this by eliminating the error caused by humans, and increasing both productivity and traceability. Using the label attachment system, SMEMA communication is used to stabilize the PCBs during label placement, as well as both a front stopper and side gauging device in the conveyor. Label Master 1100P can dispense printed labels through the label printer or a pre-printed label on a roll. Labels are placed on the PCB with the use of a robot placement positing system. www.eunil.com

Indium Corporation - Booth #1727
Indium Corporation’s Indium3.2 Pb-Free Water-Soluble Solder Paste increases finished goods reliability with a unique chemistry that enhances the cleanability of the flux residues after high-temperature Pb-Free reflow, without sacrificing the long stencil life and robust printing process. In addition, Indium3.2’s high humidity resistance saves money by minimizing solder paste waste. www.indium.com/pbfree/solderpastes.php

GOEPEL electronic - Booth #1565
GOEPEL electronic will present new innovations for its Extended JTAG/Boundary Scan solutions based on its unrivalled hardware architecture SCANFLEX®, introduced in early 2005. In particular, the revolutionary innovation VarioCore™, a technology for the flexible configuration of I/O modules, will change the Boundary Scan world decisively. VarioCore™ allows the dynamic reconfiguration of SCANFLEX I/O modules with special Intellectual Property (IP) in order to support a wide range of test capabilities in the same hardware set-up. www.goepel.com

IDENTCO International - Booth #1455
To effectively demonstrate the customer-friendly use of its micro-miniature polyimide and polyester labels as small as .118” x .118” (3mm x 3mm.), IDENTCO International is showing the AccuPlace “Ævo” print and apply machine at this year's APEX. he AccuPlace Ævo is an easy-to-operate, highly accurate and low-maintenance solution to increase productivity in labeling applications. www.identco.com

Unovis - Booth #2301
Unovis Solutions has chosen Apex 2007 to introduce new capability to its low-cost assembly cell, the Unovis Polaris Jr.. Traditionally used as a final-assembly and/or test cell, the introduction of odd form placement capability on the Unovis Polaris Jr. can dramatically increase overall production efficiency by providing pick-and-place capability when and where it is needed. The Polaris Jr. is designed to enhance line utilization and provide incrementally scaleable capacity to existing lines or as part of new installations. The Polaris Jr is the smart alternative to dedicated, complex assembly cells that create bottlenecks and prevent line optimization as products change. www.unovis-solutions.com

Datacon - Booth #3015
Datacon, the world’s leading supplier of advanced-packaging equipment, presents its 2200 Die Bonder family for the first time at APEX: the 2200 evo, which signifies a revolution in multichip die bonding. The new bonder generation 2200 evo was developed on the basis of the proven 2200 platform and represents a milestone in the field of advanced packaging. The 2200 evo is not just intended for die attach, but is also a fully-fledged flip-chip bonder. www.datacon.at

Electrolube - Booth #2707
UK manufacturer Electrolube will exhibit a range of high performance electro-chemicals for electronics and industrial manufacturing at APEX this year. Amongst many products on show, Electrolube will give a US premiere to the new Universal Remover, ARW500, accompanied by ARW300 Aerowipes. Both products are water based and completely non hazardous. www.electrolube.com

Elektrobit - Booth 1847
Elektrobit will be exhibiting a wide range of JOT Automation and test equipment at APEX, booth 1847. Visitors to the booth will have the opportunity to view the capabilities of an automation line featuring a Bare Board Unstacker. Segmented Coveyor, and High Speed Router. All of Elektrobit’s material handling equipment is compatible with Lead-free production and is manufactured from Lead-free components. www.elektrobit.com

Tekena - Booth 461
Tekena USA will display the Teknek range of high performance Clean Machines for yield improvement, in SMT and PCB production. Established in 1984 Teknek has over 13,000 installations worldwide and are world leaders in contact cleaning. www.teknek.com

X-Tek - Booth 2237
The X-Tek Group, one of the world’s leading manufacturers of real-time microfocus X-ray systems, will demonstrate a powerful new 3D imaging capability, Computerized Tomography (CT) to the industry leading Revolution system at APEX. The CT capability from X-Tek has recently received extensive global recognition. X-Tek pioneered a powerful new X-ray source which enabled an international team of researchers to reveal the true purpose of one of the most technically advanced artifacts from the Greek Classical world, the Antikythera Mechanism. www.xtekxray.com

PROMATION - Booth #1003
PROMATION, Inc., will introduce SMWS-700, a new economical felt belt work station. . This 36" long work station may be placed side by side to create a multi-station, progressive assembly environment.

SMWS-700 provides a variable speed, progressive line flow assembly solution. The optional Touch Panel controller can provide time selectable Start and Stop sequencing. The variable speed controller allows for distance control during the selected time periods. www.pro-mation-inc.com

Photo Stencil - Booth #2729
Photo Stencil will be exhibiting at the conference at booth #2729. Coleman and Mike Burgess, vice president of Photo Stencil, will both be available at the booth to answer questions or for in-depth technical discussions. Additonally, Dr. Bill Coleman, vice president of technology, will present ‘Lead-Free Intrusive Reflow’, an alternative to lead-free wave soldering. This process will be discussed in detail in a poster presentation by Coleman and co-author George Oxx of Solectron, North Carolina, on Wednesday, February 21, from 3:30pm-4:30pm. www.photostencil.com

Schleuniger - Booth #2013
Schleuniger’s UniStrip 2600 semi-automatic programmable wire stripping machine was designed to process many unique applications and cable types, including discrete wire up to 6 AWG (16 mm²), power cords (even multiple conductors with different lengths in one cycle), multi-conductor cables, flat cables, sensor cables, and others. The UniStrip 2600 is fully electric and features strong, quiet drives and fast cycle times. www.schleuniger-na.com

Dynatech - Booth #1801
The newest member of the SM Series component placement platforms extends the range with 24” x 20” (610mm x 510mm) large board capability. Increased throughout of 21,000 CPH, and faster PCB transfer speeds make the SM321 the right choice for placing components from 0201 chips up to 55mm2 devices. All SM Series component placement systems support the SM Series slim format feeders, which handle standard EIA 481 tape sizes. Optional SM Series Intelligent Feeders help providing traceability of components and inventory management. The SM Series products is part of the complete line of Samsung SMT assembly products including screen printers, placement systems and reflow ovens available from Dynatech Technology. www.dynatechsmt.com

ScanCAD International - Booth #2043
Inspect stencils, screens/artwork, boards and components and correct mismatches before production starts with ScanINSPECT VPI, an innovative process control tool that qualifies each step of the assembly and fabrication process before production. This stand-alone system couples a high resolution, color flatbed scanner with a NIST certified glass calibration plate to provide a platform that verifies all of the process components before they reach the manufacturing floor. ScanINSPECT VPI is part of a series of process control and monitoring products that combine with a Windows-based computer to minimize the training needed to keep processes under control. www.ScanCAD.com

Exerra - Booth #1978/1980
The eP30 series screen printers combine a mono-block casting and a two-stage, servo-driven granite table with a digital, servo-controlled drive system for unparalleled speed and accuracy. Add 2D&D™ Print Quality Inspection with Stencil Inspection, a triple-section PCB transport system and programmable squeegee pressure control for managing every detail of your paste printing process. www.exerra.net

HEPCO - Booth #2329
The new LeadHound© II features a RoHS/WEEE Pass-Fail Mode that automatically tests both plastics and metals in as little as 15 seconds to allow operators with minimal training to effectively screen items. Using (XRF) technology, LeadHound detects the presence of restricted elements, in a safe working environment, providing the ppm or percentage of each element found in a tested item. Use IEC screening guidelines or user-defined parameters to determine RoHS compliance or if soldering materials or components comply with military and avionics specifications. www.hepcoblue.com

Global Ionix - Booth #316
In order to help printed circuit board companies who are seeking to reduce their pollution control costs, Global Ionix will be presenting its new patented IONIX RE technology during IPC show. The IONIX Rotating Electrode is a new metal recovery technology that significantly decreases sludge production and allows easy recovery of valuable metals. www.globalionix.com

Hesse & Knipps - Booth #1871
Hesse & Knipps, Inc., fully-owned subsidiary of German-based Hesse & Knipps Semiconductor Equipment GmbH, will display the new generation BONDJET BJ920 heavy wire bonder for the first time in the Americas.

The BONDJET BJ920 offers the highest speed and accuracy, and the largest work area available in a heavy wire bonder, in addition to several features only available in the BONDJET BJ920 that will greatly enhance user productivity. www.hesse-knipps.com

P. Kay Metal - Booth #1065
P. Kay Metal, Inc., Los Angeles, CA will be demonstrating its new revolutionary solder process enhancing product, MS2™ Molten Solder Surfactant. MS2 is a liquid that is simply applied to the surface of the molten solder and does not mix with the alloy but stays on the surface as a surfactant. It provides three significant advantages for electronic assembly manufacturers: 1) it enhances the quality of the solder joint, reducing solder process related defects, 2) it eliminates dross in the soldering process resulting in significant cost savings, and 3) it greatly reduces the volume of the using facility’s hazardous waste. Many customers have experienced significant defect reduction and improved quality with the use of MS2. www.pkaymetal.com

Siemens - Booth #2737
Siemens Automation and Drives (A&D), Electronics Assembly Systems is happy to announce that the Siplace portfolio has been newly expanded to include an AOI system acquired from Opto-Control. This AOI system will be demonstrated for the first time at the APEX Trade Show. Siemens recognizes to ensure the highest possible quality, process controls and automated inspection is becoming increasingly more important in electronics manufacturing. This inspection system is fully automated and features the latest 3-D sensor technology to detect any solder or placement flaw with exceptional speed. The newly expanded Siplace portfolio now combines AOI systems with the market-leading Siemens SMT placement machines, enabling the high process reliability requirements in electronics manufacturing to be implemented even better than before. www.automation.siemens.com

Speedline Technologies - Booth #1853
In addition to the new Camalot FX-D dispensing system and Electrovert OmniFlex 7 reflow oven, Speedline Technologies will introduce the Electrovert VectraES™ wave soldering system. Apex 2007 will also host a preview of a new, innovative Jetting Technology that, when combined with the XyflexPro+ and its advanced linear drive system, sets new standards for speed and accuracy in the industry. Also on display will be Electrovert’s award-winning Aquastorm aqueous cleaning system, featuring new configurations to meet the challenges of lead-free cleaning and drying. Finally, Speedline will display several exciting new options for the award-winning MPM Accela printing system. www.speedlinetech.com

FINETECH - Booth #2715
FINETECH has formed a new technical partnership with Technical Product Trade (TPT) located in Wessling, Germany to offer manual and semiautomatic wire bonders in the North American market, and the company will display two dual-head wire bonders during APEX 2007.

The bonders are capable of wedge and ball bonding in one machine simply by changing the bond tool and selecting the appropriate mode via software. Conversion between ball and wedge bonding takes less than three minutes. These bench-top systems are ideal for small production, prototyping and R&D environments. www.finetechusa.com

Asymtek Booth # 3037
Asymtek, leader in dispensing technology and pioneer in jetting technology, introduces the SC-400 PreciseCoat™ Conformal Coating Jet. The SC-400 brings the benefits of jetting and needle dispensing to conformal coating. Designed to apply coating materials to highly selective areas, the SC-400 Jet reaches locations not accessible by other applicators. It is ideal for coating small substrates or substrates with high-component density and tight tolerances between coated and uncoated materials. The SC-400 is designed to be used on Asymtek’s award winning Century™ Series conformal coating systems. www.asymtek.com

FocalSpot - Booth #2909
FocalSpot's Verifier HR is a portable high-resolution; high-magnification x-ray system designed to address a broad range of failure analysis, quality inspection and measurement applications. While the VIPx Image Processor provides a rich Windows™ based toolbox of image enhancement/filtering, analysis/measurement and reporting tools. Together, these complementary products offer an affordable solution for virtually any quality inspection application. Systems start under $65K USD with deliveries in 3 to 4 weeks ARO. Detailed specifications and a data sheet can be at www.focalspot.com/inspection.htm.

Speedprint Technologies - Booth #1123
Speedprint Technology Ltd., a division of Blakell Europlacer Group, will showcase the SP200avi inline stencil printer. SP200avi is a revolutionary addition to the Speedprint range of stencil printers. Designed for medium and high throughput, high-mix applications, the 23" inline stencil printer delivers outstanding performance and value. The system uses a unique, patent protected “look down, look down” approach to vision alignment where twin roving cameras mounted on independent X-Y gantries ensure accurate and repeatable precision alignment using fiducial marks or PCB/stencil features. Its unique "paste on stencil" inspection feature enables users to determine if there is adequate paste on the stencil before running the print cycle. www.speedprint-tech.com

AMTECH - Booth #1817
LF-4300 lead-free solder paste is now available with a matching core wire, offering true multi-process capabilities, a no-clean and water washable formula all-in-one

AMTECH LF-4300 lead-free solder paste, the first no-clean formula that’s also water washable using standard aqueous cleaning systems without any saponification, is now available in a matching core wire to create a comprehensive solution for automated and hand assembly operations. LF-4300 solder paste delivers up to 12-hour stencil life and 24-hour abandonment time. It’s also low voiding, with no mid-chip beading or tombstoning to reduce board scrap and rework. www.amtechsolder.com

CyberOptics - Booth #2561
CyberOptics Corporation will highlight its Flex UltraTM automated optical inspection (AOI) platform. The platform consists of the flagship Flex Ultra AOI system as well as the new Flex Ultra HR, which will make its U.S. debut at APEX. Both systems will be on display for demonstration during the show.

Flex Ultra is the award winning enhanced resolution AOI system with inspection performance for 0201 components and larger. As one of the highest-speed inspection systems in the industry, Flex Ultra is ideal for assembly lines producing automotive, memory, and notebook PCBs.

The new Flex Ultra HR is the latest development for this high-performance AOI platform and is capable of inspecting down to 01005 components. With 5.0 megapixel camera technology, the system also offers users a 40 percent improvement in imaging resolution over the Flex Ultra. www.cyberoptics.com

Thermo Fisher Scientific - Booth #1670
Thermo Scientific, part of Thermo Fisher Scientific,
announces its new NITON XLt 797X with revolutionary small-spot focus capability. Featuring a significantly smaller X-ray analysis area - more than 20 times smaller than that of any portable XRF (X-ray Fluorescence) analyzer - Thermo Scientific NITON Analyzers has incorporated new proprietary X-ray tube technology along with an internal color video camera into its popular portable NITON XLt 797 instrument. The new NITON XLt 797X with small-spot focus technology is ideal for identifying, accurately analyzing, and recording the analytical results of small components - something previously only achievable with bench-top XRF analyzers. www.thermo.com/niton

Smart Sonic Corporation - Booth #2659
Smart Sonic Corporation's new Multi-tech Ultrasonic Stencil Cleaner provides the assembler complete flexibility to use either no-rinse or fresh water rinse technology for cleaning SMT stencils, misprinted PCBs, pallets, oven radiators and other related tooling without additional cost or floor space dedication.

By integrating the necessary equipment and tooling for using both technologies into one machine, the Multi-tech Ultrasonic Stencil Cleaner provides the user with unlimited flexibility in choosing the proper chemistry for the ever-changing cleaning and environmental applications. www.smartsonic.com

Innov-X Systems - Booth #845
The Innov-X Systems handheld XRF analyzer is an optimal, non-destructive, point-and-shoot screening method to manage the incredible challenges of RoHS Compliance, especially with non-homogeneous materials and/or high-volume operations. Innov-X Systems handheld XRF analyzer screening allows necessary laboratory testing to be performed in a focused, productive way. Innov-X Systems? handheld XRF analyzers can easily be used by everyone along the supply chain, as well as by regulators. Its use is like casting a wide net to get the greatest value for testing dollars. www.innov-x-sys.com

Heraeus - Booth #1927
Heraeus will showcase its expanded, lead-free no-clean solder pastes. The Heraeus F640 series promotes wetting and minimizes defects with tin/silver/copper alloy soldering. The line has a wide processing window to compensate for process variations in printing and soldering. It provides industry-leading wetting on a variety of surfaces and leaves behind a clear residue, reducing processing costs and saving time. With exceptional print-to-print consistency, the F640 series can be reflowed in air or nitrogen environments. More info

Glenbrook - Booth #1716
Glenbrook Technologies introduces the compact new JewelBox 70T real-time x-ray inspection system with Digital Video Recording. Users can to observe and record the internal movements of devices as they deploy, to help ensure product quality. Glenbrook’s DVR software streams full-sized grayscale images to disk in real time for recording. Full-screen color graphics may be captured, with annotations added to single frames. www.glenbrooktech.com

EFD Solder Paste Group - Booth #2828
EFD introduces a turnkey solution to replace inconsistent manual wire soldering processes.

The ProcessMate 3000 is a precision positioning system used to control solder paste dispensing and reflow. This benchtop soldering station accurately dispenses the right amount of SolderPlus® Solder Paste with a plug-and-play hot air system for reflow.

The soldering station also eliminates operator variability, reduces rework and scrap, increases productivity, and improves production yields without special training required for operation. www.efdsolder.com

HumiSeal - Booth #2205
HumiSeal® will introduce their new UV40 UV curable conformal coating with a performance range that exceeds existing UV curable products. UV40 is ideal for high volume users, such as automotive and consumer electronics manufacturers, who want the rapid cure speed of UV products but still require the processing ease of their current coatings. Innovative UV40 maintains the speed of cure and environment-friendly chemistry required for today’s electronic fabrication and offers advantages not found in existing UV curable products.

UV40 provides excellent adhesion to many commonly used solder resists and high resistance to a wide range of solvents. It also provides higher insulation resistance and has a truly reliable moisture-activated secondary cure mechanism. UV40 does not become brittle at lower ranges. www.humiseal.com

Ultrasonic Systems, Inc. - Booth #1761
Ultrasonic Systems, Inc. will be exhibiting the enhanced Prism Selective Coating System at Apex. The Prism System features enhanced software, new offline programming capability and increased speed and throughput.

The Prism System also features 90 Degree Pneumatic Rotate of the coating head for faster cycles times. All of these new functionalities will be demonstrated at USI’s booth at Apex. www.ultraspray.com



 

phoenix|x-ray Systems + Services - Booth #2159
phoenix|x-ray Systems + Services introduced a new, high-resolution computed tomography X-ray analysis system in a compact package, the nanotom®. The nanotom® is a 160 kV nanofocusTM computed tomography system that is tailored completely for the special needs of material science, micro mechanics, electronics and biological applications.

The very compact system consists of a granite based CT-construction with a 160 kV high-power nanofocusTM X-ray tube of phoenix|x-ray and a special digital detector to reach a voxel resolution down to 500 nm (0,5 µm). The fully digital detector has 5 Megapixel resolution and a measurement range expansion for the highest possible resolution. www.phoenix-xray.com
 

Qualitek International - Booth #2137
Qualitek International, Inc. has developed a no clean lead free solder wire that will not spatter when used properly. The unique fluxing system has been designed for high temperature lead free alloys. The fluxing activity levels promote fast wetting action and maximum wetting spread. A wide variety of diameters ranging from .010” - .125” are available. Spool sizes from 1/2lb. – 20lb. Dispenser packs. NC600 conforms to J-SDT-004 REL0. Rohs compliant. www.qualitek.com
 

Ovation Products - Booth #1765
Ovation Products, innovator and manufacturer of award winning Grid-lok automatic SMT tooling, will introduce the Magna-Print universal SMT squeegee system. The Magna-Print system consists of a patent-pending universal fit squeegee holder, infinitely adjustable paste deflectors and corresponding blades to accommodate any PCB size. The quick-change blade holder is equipped with an arrangement of magnets and other features that assist in the firm holding of the blades, thus eliminating the need for tools and loose hardware involved in blade change. Blades are changed in seconds without removing the holders from the machine.

The absence of the conventional blade clamping hardware means that there are no crevasses in which solder paste can accumulate and harden. This easy cleaning feature of the holder is further enhanced by the “no-stick” coating, making it essential for lead-free environments where there are threats of cross-contamination between assembly lines. www.grid-lok.com
 

Kester - Booth #1542
Kester’s booth will be the best source for lead-free information at APEX. Kester will be featuring numerous products from its Lead-Free Solutions (products and services) portfolio to help companies in the transition to lead-free. Among products being featured will be low-cost Ultrapure K100LD lead-free bar solder alloy and its low-cost Ultrapure K100 lead-free bar solder alloy, along with Kester’s technical services to help manufacturers assemble lead-free. K100LD is a patent-pending, low-cost alternative to traditional lead-free alloys. The bar solder offers the lowest copper dissolution of any lead-free bar on the market, even amongst all common alloys, including Sn63, SAC305 and other lead-free options. www.kester.com

Aqueous Technologies - Booth #1109
Aqueous Technologies Corporation will premier the C3 Cleanliness Tester. The C3--Critical Cleanliness Control-- ionic cleanliness tester is unique from other contamination testers on the market. It is the first tester to examine contamination in a localized area of a PCB assembly. By looking at a localized area of 0.1 in², the C3 ionic cleanliness tester provides immediate feedback as to whether or not the area is ionically “clean” or “dirty.” The localized testing format of the C3 allows users to look at specific components or areas of circuitry that are particularly sensitive and prone to performance issues. C3 is the only cleanliness testing method capable of determining where a contaminant is, the level of contamination and what the contamination is. www.aqueoustech.com
 

Cookson Electronics – Booth #2419
Cookson Electronics Assembly Materials’ new ALPHA AutoClean 40 Semi-Aqueous Electronics Cleaner formulated for the efficient removal of pre and post soldering flux residues from flux spray equipment, ovens, pallets, carriers, jigs and printed circuit assemblies. This product is a carefully researched, mildly alkaline (pH value of <12) blend of synergistic surfactants and emulsifiers that ensures excellent cleaning and inhibition of the re-deposition of dissolved soils.

ALPHA AutoClean 40 is more effective than IPA and more versatile than solvent-based cleaners or saponifiers for equipment maintenance and board cleaning. It is biodegradable and non-flammable, and contains no CFCs, chlorinated solvents or acids. www.alphametals.com

DEK – Booth #2047
DEK’s Cyclone precision cleaning technology enables the fast and thorough cleaning of advanced stencils, cutting total cleaning time to under half that required by conventional cleaning systems and delivering rapid cassette-based paper changeover in under 20 seconds. Cyclone’s speed and resource efficiency deliver advanced stencil cleaning that maximizes pre-placement yield and uptime. The technology’s five stage cleaning head provides a progressive and thorough stencil cleaning, with a single wet oscillating stroke combining with the five leading edges to dislodge and remove remaining solder paste residue from the stencil apertures. This procedure is followed by a return high-flow vacuum stroke using all 4 vacuum vents. Cyclone’s multiple action cleaning process completely eliminates the need for a conventional third pass, further enhancing productivity and throughput. www.dek.com

Henkel – Booth #2001
Loctite® 3536 delivers improved reliability for today’s advanced CSP and BGA packages. The material is designed to quickly fill the space beneath the CSP and BGA packages and cures rapidly at low temperature, which minimizes thermal stress to other components on the PCB and allows for in-line curing to increase device throughput. When fully cured, Loctite 3536 delivers excellent protection for solder joints against mechanical stress such as shock, drop and vibration in hand-held devices and testing confirms its superiority over competitive materials when subjected to these stresses. In addition, testing of the material to JEDEC drop test standards on 0.4mm and 0.5mm Pb-free devices has shown that Loctite 3536 offers five times the reliability over non-underfilled Pb-free devices. www.henkel.com

BPM Microsystems – Booth #2223
Automating the device programming cycle has always been the preference in electronics manufacturing, but until now, the cost of this equipment was difficult to economically justify. With the introduction of BPM Microsystems’ Helix programming system, device programming customers can get the quality of automated device handling at a lower price point than traditionally available. As a desktop automated system, the Helix comes standard with two precision-designed tray input and output handling systems with a reject location. The new system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BPM Microsystems automated line. The pressure plates are exchangeable between the two units. www.bpmmicro.com

Kyzen Corp. – Booth #1401
Kzyen Corporation will introduce AQUANOX A4625B, an MEA-free aqueous blend specifically designed for optimum effectiveness in batch washers. This easy-to-use cleaning material will remove flux residues and contaminants associated with most electronics assembly processes while being environmentally friendly. A4625B is used at low concentrations for optimum cleaning efficiency without damaging delicate substrates. www.kyzen.com

VJ Electronix – Booth #2637
VJ Electronix will display the Summit 2200 Advanced Rework Station. Summit 2200 is engineered for the most demanding lead-free processes. Using many of the award winning and proven Summit 1800 components and processes, the 2200’s advanced features include a new automated site prep (scavenging) system, automatic and vision-assisted placement, wide area profile storage compatibility, a new bottom heater and motorized table, and new integrated technical documentation. www.vjelectronix.com

KIC – Booth #1528
KIC will introduce KIC Vision, an automatic profiling system. This low-cost system is designed for those customers that want to eliminate the manual tasks associated with periodic profiling for their reflow ovens. Although such profiling has been important for production quality as well as process documentation, many electronics manufacturers are burdened by the negative effects of such manual tasks. These negatives include interruption to the production flow, expense in terms of labor and material (profilers, thermocouples, “golden boards,” etc.), error-prone measurements, and the fact that infrequent profiling makes for poor quality control. www.kicthermal.com

Milara – Booth #1971
Milara will showcase its new SemiTouch Auto Vision alignment batch stencil printer (STAV). The STAV printer features a maximum print area of 16 x 20", stencil frame size up to 29 x 29", and board sizes from 2 x 2" to 16 x 23" with servo-controlled, fully programmable X, Y, and Theta automatic vision alignment. The STAV is also equipped with new bottom-side tooling support using Grid-Lok™ or others. With universal Vibraserve® vibration squeegee heads, the printer is a must-have for any company’s production line. Additionally, it offers users run-time diagnostics, message feedback and advanced safety features. Currently, the system is targeted to the SMT industry with semiconductor applications scheduled for the near future. www.milarasmt.com

Inovaxe – Booth #1672
Inovaxe will highlight its INOCART Material Handling System and INOKIT Software. These products are designed to drastically improve inventory accuracy and reduce material handling labor cost. INOCART, combined with INOKIT software, revolutionizes the process of kitting and reloading SMT lines. INOCART is a custom configurable material handling solution that allows numerous package types to be stored in a secure, controlled manner, whether that be reels, tubes, feeders or PCBs. The cart and software combine to result in increased inventory accuracy and a quick return on investment. www.inovaxe.com

Micro Care – Booth #1140
Micro Care introduces the company’s new entry for the photonics and fiber optics markets, the Precision Optical Cleaner. This unique formulation is plastic-safe, nonflammable, fast-drying and non-corrosive. It removes water-spots, buffing compounds, dust, lint and fingerprint oils, and is safe on lenses, mirrors, fiber optic connectors, diffraction gratings, computer displays, cell phones and any transparent plastic. Packaged in TravelSAFE™ mini-pump containers, the product is not hazardous, which lowers shipping costs and eliminates hazmat hassles. Available from Micro Care distributors worldwide, Precision Optical Cleaner is available in packaging from 3 oz (85 g) mini-pumps to 500 lbs (220 kilo) drums. www.microcare.com

JUKI Automation Systems – Booth #2437
Juki Corporation will showcase the KE-2070 High-Speed Chip Shooter. The successor to the KE-2050, the KE-2070 is a sixth generation high-speed modular chip shooter.
Built upon the one-piece SuperCast™ single casting base that includes the Y beams, KE-2070 is designed with speed, accuracy and reliability in mind. Combined with the new LNC-60 high-resolution laser centering system and an improved magnascale resolution down to 1 µm, KE-2070 is 25 percent more accurate than previous models capable of placing down to 01005 components. www.jas-smt.com

RMD Instruments – Booth #1052
Devoted to the development of new radiation detector and systems technology, RMD Instruments LLC announces that it will premier the LeadTracer-RoHS XRF system at the upcoming APEX 2007 trade show and exhibition. The LeadTracer-RoHS XRF system is a major innovation and advancement of the XRF analysis technology. The LeadTracer-RoHS is the only XRF system that is designed specifically for the electronic industry to provide fast, accurate, and portable screening capability to meet RoHS directives. www.rmd-leadtracer.com

Essemtec – Booth #2259
ESSEMTEC’s SP003 semiautomatic stencil printer is now available as SP003-ML-V with vision for faster control and alignment correction. SP003-ML-V features new trans-stencil vision, and offers users reliable and precise printing, a motorized print head, and vertical stencil separation. Additionally, the low-maintenance printer can accommodate stencils or screens up to 23 x 23". Quality of stencil printing is crucial for product quality. SP003-ML-V achieves precise printing by controlling all important print parameters including squeegee pressure, angle of squeegee, print speed, stencil position and stencil separation after printing. With the new trans-stencil vision, print alignment is even easier to control. www.essemtec.com

Practical Components – Booth #2565
Practical Components Inc will have a range of products and resources available, including exciting new products such as Amkor Technology’s breakthrough PoP (package on package stacked daisychain), the PC200 PoP test board and kit, the Dual Row MLF® from Amkor Technology, and the PC2006 AIM print test board and kit. In addition to showing mechanical samples for Amkor Technology and components from most other leading SMD manufacturers including FlipChip International, Practical Dummy Components will be displaying solder training kits and PCB training and test boards. www.practicalcomponents.com

 

A.C.E. - Booth #1613
A.C.E. Production Technologies introduces its latest advance in selective soldering equipment, the KISS 104 automated large-format selective soldering system. The SMEMA-compatible KISS 104 offers all of the popular features found in the KISS 101 and 102 systems, but in a larger format to handle larger PCB’s and panelized boards, and in-line integration capability. The fully programmable KISS 104 uses the proven ‘traveling mini–solder wave. This system overcomes the limitations of operator-dependent soldering with a truly flexible molten solder delivery system. It is designed to deliver repeatable soldering performance without the expense of robotic selective soldering machines. www.ace-protech.com

WARCO / WARRENDER will feature CHEMAG™ thermoplastic filtration systems constructed in robust thermoplastics, providing years of trouble free service. CHEMAG™ has been specified in the PCB industry for over 20 years. Available designs now include high performance pleated, conventional cartridge, or horizontal disc. CHEMTREX™ pleated filter technology meets precise process requirements, including critical multi-layer board production, with absolute Beta ratings down to 0.45 microns. Maintain critical bath turnover rates at low micron ratings for maximizing production yields, while reducing maintenance and disposal costs. www.warrender.com

Some of 2007's exhibitors include
Aqueous Technologies Corp, Booth 1109
Asymtek, Booth 3037
BPM Microsystems, Booth 2223
Custer Consulting Group, Booth 1030
CyberOptics Corporation, Booth 2561
Dage Precision Industries, Booth 2601
DoveBid, Inc., Booth 913
ELECTROBIT/JOT Automation, Booth 1847
Enercon Industries, Booth 904
Essemtec USA, Booth 2259
Europlacer North America, Booth 1123
Everett Charles Technologies, Booth 1623
Finetech, Booth 2715
Glenbrook Technologies, Booth 1716
Henkel Corporation, Booth 2001
Heraeus, Booth 1927
I&J Fisnar, Booth 1377
IMAPS, Booth 1872
Indium Corporation, Booth 1727
Inovaxe Corporation, Booth 1672
Juki Automation, Booth 2437
Kester, Booth 1542
KIC, Booth 1528
Kyzen Corporation, Booth 1401
Micro Care Corp, Booth 1140
MIRTEC, Booth 2651
Ovation Products, Booth 1765
Panasonic Factory Solutions Company of America, Booth 2521
phoenix | x-ray Systems + Services, Inc., Booth 2159
Photo Stencil, Booth 2729
Pillarhouse USA, Inc., Booth 1101
SEHO North America, Booth 3727
Siemens Electronics Assembly Systems, Booth 2737
Sony Manufacturing Systems America, Booth 1915
Speedline Technologies, Booth 1853
Tamura H.A. Machinery, Booth 1145
Transition Automation, Booth 1536
Tyco Electronics, Booth 2951
V.J. Electronix, Booth 2673