Show news

Dr. Craig Hillman to present at IPC Printed Circuits Expo, APEX & The Designer’s Summit
Seminar to focus on failure and root cause analysis in lead-free electronics. Dr. Craig Hillman, CEO and managing partner of DfR Solutions, will present an all-day seminar February 18 at the IPC Conference. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Speedline to present seven technical papers at APEX
Speedline Technologies, Inc. will take a leading role at the APEX 2007 Technical Conference, presenting seven papers. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Cobar's Ineke Tiggelen-Aarden to present paper at APEX 2007
neke Tiggelen-Aarden, Technical Director for Cobar Europe BV, will present a paper, Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results in Technical Session S25, New Developments in Solder Paste, at APEX 2007 in Los Angeles. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Photo Stencil to present paper at APEX
Photo Stencil, provider of premium stencils and additional high-end tooling for the SMT assembly industry, will present a paper at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Michael Sivigny to present alternative to outsourcing at APEX 2007 conference
Is there a better way – an alternative – to outsourcing PCB assembly to the Far East? CeTaQ America’s general manager, Michael Sivigny, believes so. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Free forums offer 7 more reasons to attend IPC Printed Circuts Expo, APEX and the Designers Summit
Forum topics range from optimizing lead free processes and reliability to insight into supply chain management and technology roadmapping. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

iNEMI previews highlights of 2007 Roadmap at IPC Printed Circuits Expo, APEX and Designers Summit
The iNEMI Roadmap will be featured in a conference keynote session at 8:00 a.m. on Thursday, February 22. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

IPC 50 year anniversary website celebrates auld lang syne
The 50th anniversary site also has links to information on the celebratory events that will take place at IPC Printed Circuits Expo®, APEX® and the Designers Summit, February 20-22, 2007. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

IPC plans 50th anniversary reception and dinner
The pinnacle of events marking IPC’s 50th Anniversary celebration will be a nostalgic 50th Anniversary reception and dinner on Tuesday, February 20, 2007, in conjunction with IPC’s February tradeshows in Los Angeles, California. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

“CEO to CEO Benchmarking” at IPC’s EMS management council meeting
Aptly put, “It’s CEO to CEO benchmarking,” asserts Leo Reynolds, president and CEO, Electronic Systems, Inc., in reference to IPC’s EMS Management Council Meeting, February 19, 2007, in Los Angeles, Calif. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Technology, High Speed and Living Without Lead
IPC – Association Connecting Electronics Industries® and its Designers Council are pleased to announce the Designers Summit, February 15-22, 2007, in Los Angeles, Calif., targeted specifically for printed circuit board (PCB) designers. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

PCB executive management meeting focuses on the heart of PCB issues for industry leaders
On the heels of a positive year of industry success, PCB executives will convene at the IPC PCB Executive Management Meeting, February 19, 2007 in Los Angeles, Calif., to meet with other industry leaders and plan for continued momentum and growth. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Need-to-know imperative permeates technical conference sessions at IPC/APEX/DS 2007
Tin whiskers, materials and regulatory issues, assembly reliability and embedded passives are just a handful of the critical topics that will take main stage at the Technical Conference sessions of IPC Printed Circuits Expo, APEX and the Designers Summit 2007, February 20 - 22, in Los Angeles, Cali. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Defect Clinic solves mysteries at IPC Printed Circuits Expo®, APEX® and the Designers Summit 2007
With a twist on the old whodunits, the clinic will provide the opportunity for attendees to get free and unbiased help and advice on vexing board assembly and process mysteries. Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

IPC offers professional development workshops at IPC/APEX/Designers Summit 2007
Key topics will be advanced technology, lead free reliability and RoHS compliance.
“The program has been designed to bring an in-depth look at the critical issues challenging our industry,” says Jean Hebeisen, IPC director of professional development. “Lead free and complying with the WEEE/RoHS directives certainly continue to be hot topics, but attendees also need to know the current thinking on advanced technology, embedded components, design, quality, reliability and testing, and more.” Read the full news item on the Global SMT & Packaging magazine site. (Opens a new window.)

Registration is now open
Online registration for the conference and exhibition is now open. Admission to the Exhibit Hall is FREE to everyone who pre-registers. (Admission to the Exhibit Hall is $26 for those who register on-site.) Early registration is open until January 23, 2007. For those attending the conferences and/or technical courses, register early to save an additional 20%. Group discounts are also available. Visit the show's registration page for more information.

Process Advice and Defect Clinic to be held at the show
Bring your defects and process problems to the show to receive free, unbiased assistance. The Process Advice & Defect Clinic will be run by Bob Willis and is sponsored by Global SMT & Packaging magazine and IPC—Association Connecting Electronics Industries. More information.