Welcome to Global SMT & Packaging magazine's Show Central: IPC, APEX & Designers Summit 2007 edition

From the show floor

Video interviews:
     Henkel
     Juki
     KIC
     Siemens
     Speedline
Show report
 

What's Happening
Show news
Show preview
Featured events
Defects clinic
 
Attending the show?
Hotel info
Travel info
WI-FI hotspots
Register for the show
 



Featured free forums & events

IPC CCA Golf Tournament
Registration will be held from 10:00am to 11:30am on Sunday, February 18th. Tee off is at 11:30. After the tournament, a reception and dinner will be held.

IPC Designers Day
IPC Designers Day is Monday, Feburary 19, all day (from 8:00am - 5:30pm).

SMT Vision Awards
The SMT Vision Awards will be presented from 6:00pm - 10:00pm on Monday, February 19.

IPC First Timers Welcome Breakfast
Breakfast takes place on the first day of the exposition, Tuesday, February 20, from 7:00am - 8:00am.

Keynote Speeches
Dr. Buzz Aldrin, ShareSpace Foundation – Tuesday, February 20, 8:00am - 9:30am.
Walter Custer, Custer Consulting Group – Wednesday, February 21, 8:00am - 9:30am.
iNEMI Roadmap – Thursday, February 22, 8:00am - 9:30am.
Discovery Channel's Mythbusters – Thursday, February 22, 2:30pm - 3:30pm.

Free Floor Show Welcome Receiption
This welcome reception takes place from 5:00pm to 6:00pm on the opening day of the exposition (Tuesday, February 20).

Free forum: iNEMI: Optimizing Lead Free Processes
Tuesday, 2/20/2007 1:30 PM - 3:00 PM
David Godlewski, iNEMI

The electronics industry has been preparing to go lead free for several years, but the transition to lead free manufacturing is really just beginning. Much work remains to be done to optimize the conversion from eutectic solder and to achieve the same knowledge we have with tin lead processes. This free forum will review some of iNEMI’s lead free projects that focus on lead free processes in areas such as wave soldering, rework, mixed soldering and surface finishes.

Free forum: Technology Roadmapping - A Look Toward the Future
Tuesday, 2/20/2007 3:15 PM - 4:45 PM
John Fisher, Interconnect Technology Analysis, Inc.

Here is a tremendous opportunity for all attendees to learn about the release of the new IPC International Technology Roadmap for 2006/2007. Presentations will highlight the various concepts used for developing the new roadmap and how it mirrors other roadmaps for the semiconductor industry and the OEM customer. We will discuss the paradigm shifts necessary to meet the new criteria for higher bandwidth and restrictive substance regulations. In addition, miniaturization will be a top issue as one of the major performance criteria.

Free forum: The Total Packaging Solution under Jisso
Wednesday, 2/21/2007 9:00 AM - 10:00 AM
Dennis Fritz, MacDermid, Inc.

This session will address the topic of “Jisso,” a Japanese word that represents the total packaging solution for new product development and introduction. The process starts with the original design and incorporates decisions for electronic elements, electronic packaging and modules before moving to the final product and system. The Jisso North America Council (JNAC) is a feeder to the international group that is composed of delegates from Europe and Asia. The presentations will show the data flow between the various experts as they establish new processes, new standards, and methodology to meet the challenges of the future.

Free forum: Supply Chain Management (SCM): Systems and Technologies
Wednesday, 2/21/2007 10:15 AM - 11:45 AM
N.T. 'Bala' Balakrishnan, California State University

Successful Supply Chain Management (SCM) implementation requires state-of-the-art systems and technologies to integrate information and product flows between suppliers and manufacturers. This session describes a successful SCM implementation for a medium-size manufacturing company, quality control issues in supply chains and the deployment of Radio Frequency Identification (RFID) and Voice over Internet Protocol (VoIP) technologies to leverage the power of SCM.

Free forum: Asian Developed and Implemented Technologies and Business Practices You May Have Missed: Equipment, Materials, and Manufacturing Processes
Wednesday, 2/21/2007 1:30 PM - 3:30 PM
Gene Weiner, Weiner & Associates, Inc.

A diverse group of successful senior executives from Asia to the East Coast will present business practices, technologies, production, asset shifts, packaging, equipment, materials, assembly and fabrication in a program that covers Japan, China and the rest of Asia in a way never before made available in the U.S. Managers and decision makers in virtually every phase of the interconnect industry will benefit from attending this well organized session.

Free forum: Advanced Technology Strategy Roundtable
Thursday, 2/22/2007 9:00 AM - 11:45 AM
John Fisher, Interconnect Technology Analysis, Inc.; Dieter Bergman, IPC

In this interactive roundtable, we will discuss future ideas and methods being proposed by various suppliers and technologists to design, fabricate, assemble, and test the products of the future. How will your company position itself in the future? The panel of experts will generate intriguing ideas for determining company strategy now and for the long term. Everyone is invited to participate and encouraged to bring your issues for discussion.