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Video Newscast - June 26, 2008

This week on GSP Video News:
Hartner to head SMEMA Council; competition turns up the heat on Nokia; what's new at National Electronics Week; Foxconn lands the iPhone 3G contract; Foxconn not a high tech enterprise in China?; EBSO releases new ceramic singulating machine; JTAG breaks barrier between functional test & boundary scan; SEMI teams up with Messe Muenchen at Intersolar. Watch the news now.
Breaking News
BPM Appoints Distributor for Eastern Europe
Friday, 04 July 2008
BPM is proud to announce that it has formally named Etek Europe Ltd. as its distributor for Eastern Europe including the Czech Republic, Hungary, Romania, Bulgaria and Poland.
 
Hybrid solar cell researchers order advanced sputtering tool for NanoWire preparation
Friday, 04 July 2008

A Gamma sputtering system from Surrey NanoSystems has been ordered by Ludwig-Maximilians University, to support research into hybrid solar cells* tool will create high-efficiency interconnection templates for organic materials

 
Altium joins European fight against piracy
Friday, 04 July 2008
Altium extends its support to the BSA in Europe
 
Metrologic Builds on Acquisition of Hand Held Products, Adds Global Expertise, Technology
Friday, 04 July 2008
Honeywell acquires Metrologic Instruments; Expands growing laser, Imaging and enterprise mobility business
 
Call for Papers: European Electronics Assembly Reliability Summit
Friday, 04 July 2008
Soldertec Global and Global SMT & Packaging magazine are delighted to announce a European and international conference on reliability in electronic assemblies.
 
NEW Show Dailies available for download
Thursday, 03 July 2008

The Show Floor Daily magazines that were available each day of the recent National Electronics Week show are now free PDF downloads.

 
JTAG/Boundary Scan platform SCANFLEX® incorporates new PXI controllers for critical applications
Thursday, 03 July 2008
Goepel electronic introduced at NEW a new series of PXI-Bus based controllers for its revolutionary Boundary Scan hardware platform SCANFLEX® - SFX/PXI1149/C4-FXT.
 
Dage to exhibit Quick View CT inspection system at Semicon West
Thursday, 03 July 2008
Also shown will be the new XD7600NTHP digital x-ray inspection system with a high-power tube offering 10 watts of power and sub-micron feature recognition.
 
Solving Counterfeit Components - The Problem, Identification & Testing Workshop
Thursday, 03 July 2008

Wednesday 10th September St Albans, Hertfordshire
Workshop starts at 10.00am with coffee from 9.30am. The event should conclude at 4.30pm
Book now as places limited to first 30 www.smartgroup.org/pdf/contcomponents.pdf

 
Polar Instruments introduces Speedstack Impedance Coupon Generator
Thursday, 03 July 2008
•  Significantly reduces impedance coupon design time and errors
•  Compatible with Speedstack PCB stackup systems
•  User-selectable probe style and coupon formats
•  Automatically produces extended RS274x Gerber files for panelisation
 
Daleba strengthens technical & quality teams in China
Thursday, 03 July 2008
Andrew Grisbrooke, Director of the TCL GroupHighly respected across the UK, Europe and America, Daleba offers its customers more than the average value added re-seller or PCB broker.
 
New GM for UK Sales at Electrolube
Wednesday, 02 July 2008
New GM for UK Sales at Electrolube - Robert Crosby-ClarkeElectrolube, the electro-chemicals manufacturer, is delighted to announce the promotion of Robert Crosby-Clarke to General Manager of UK Sales.
 
New range of small sized Colour STN displays - for low-cost migration from mono to colour
Wednesday, 02 July 2008
New 2.2-, 2.8- and 2.9-inch CSTN displays from Anders Electronics help solve commercial and technical challenges for designers upgrading from mono to colour
 
Henkel & Leading Shanghai-Region Academia form Joint Electronics Research & Failure Analysis Center
Wednesday, 02 July 2008

(pictured from left to right)  Dr. Tom Lim, Director of Shanghai R&D Center of Henkel Corporate Research;  Mr Faruk Arig, President of Henkel China; Mr. Wangmin, Vice Principal of Shanghai University; and, Mr. Johan Liu, Professor of Shanghai University, China and Professor of Chalmers University of Technology, Sweden sign the official agreement for the new Shanghai Region Joint Electronics Research & Failure Analysis Center.The official signing ceremony marking the commencement of the partnership took place on June 10, 2008 at Henkel Asia-Pacific and China Headquarters in Shanghai, China.

 
Mid-Term Industry Forecast Seminar
Wednesday, 02 July 2008

July 22, 2008
Hilton Kensington, London, England
10:30 Start (Registration From 10:00) & 16:00 Finish, Lunch Included
Nearest Tube Station: Holland Park (7 Mins Walk)

 
Ramtron Energy announcced that UK-based Energy Optimizers has designed Ramtron's F-RAM memory device
Wednesday, 02 July 2008

Energy Optimizers selects Ramtron’s nonvolatile F-RAM memory for Plogg wireless energy management plugs
F-RAM’s high endurance required for frequent data logging in smart power meter that manages energy consumption

 
Wolfson attains ISO 9001 certification at its engineering centre in High Wycombe
Tuesday, 01 July 2008
Expanding Wolfson’s culture of quality company-wide
 
IPC MIDWEST KEYNOTE TO UNLOCK SECRETS OF THE FUTURE OF INDYCARS
Tuesday, 01 July 2008
Daly’s keynote address at IPC Midwest will span his fascinating and inspiring life and provide a very special insider’s look into how electronics holds the key to the checkered flag in racing.
 
Fastening solutions breaks the 500 barrier
Tuesday, 01 July 2008
Interest in new fastener applications means that people somewhere are putting things together!
 
New Brady APAC Total Label Applicator In-line System
Tuesday, 01 July 2008
The system offers a precision label applicator solution that can accurately and consistently print and apply the smallest of labels as a complete inline solution to improve product traceability processes across industry.
 
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Featured Interview

Interview - Tetsuro Nishimura - Nihon Superior

Nihon Superior is one of Japan’s leading solder brands. They are inventors of the now famous SN100C lead-free solder, which is used by many of the major OEMs and EMS companies around the world.

 

Lead-Free Matters

Ball grid array & lead-free assembly defects, part 1

Over the last few years I have been asked to examine many different ball grid array (BGA) defects from assembly and on field failures here are a selection of the defects and some of the popular causes.
BOB WILLIS

 

 

Global Business

Market Report: 2007 Looking Better Than Previously Expected!

In spite of a 4Q’06 slowdown in personal computer production (due to a delay in Microsoft Vista and microprocessor shortages in Asia), global electronic equipment demand remained reasonably strong at year-end 2006.

 

Industry Blogs

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