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Our North American & European editions come out 12 times a year.

Each issue features solution-led technical articles and columns.

Our China edition is published six times per year and features the best of the European & North American content plus regular columns of local interest.

Jon Custer-Topai and Walt Custer bring the latest business intelligence to every issue of the magazine.

Joe Fjelstad's 'Small Matters' columns are always enjoyable and educational.

Bob Willis's columns focus on rework, repair and lead-free issues, particularly in relation to defects and process problems.

'Mr. Reliability' (Werner Engelmaier) brings his 38 years of experience to bear in his columns.

Wu Yiping has been a regular columnist for our China edition for several years.

Four editions for global reach, local feel
With North American, European, and Chinese editions, Global SMT & Packaging magazine reaches 40,000 senior managers, engineers, and scientists involved in electronics manufacturing worldwide. In 2008, we add a fourth print magazine edition: Korea.

GS&P delivers ‘best-in-class’ technical articles that provide real manufacturing solutions as well as case studies, interviews, expert columns, trade show previews and recaps, and regional news ensure that subscribers read the magazine—and see your ads—every issue.

GS&P crosses borders, cultures and time zones. Published as a European and North American edition 12 times per year and bimonthly in Chinese, each regional edition carries local industry and association news plus columns from local experts, giving the magazine a local identity.

January: Bump inspection, die bonding, flip chip, lead-free solders, MEMs, cleaning

February: Stencil printing, selective soldering, component design, boundary scan, wafer bumping

January/February (China): Global Technology Awards, dispensing, inspection, lead-free solder, rework

March: Dispensing, chip scale packaging, stacked die packaging, 0201 placement, board contamination, ESD control

April: Process management software, rework equipment, advanced substrates, 3D circuits, sensors

March/April (China): Adhesives, cleaning, pick & place, printing, thermal profiling

May: WEEE & RoHS, manufacturing software, depaneling and routing equipment, handling systems, reflow ovens, wire bonding

June: Cleaning, conformal coatings, MEMs, bond testing, VOC free fluxes, 3D inspection, socket testing

May/June (China): Component placement, device programming, feeders, wafer bumping, conformal coatings

July: Wave soldering, fuel cells, vision systems, bump inspection, flip chip

August: Component placement, device programming, optoelectronics, conductive adhesives, thermal control, BGA

September: PCB manufacturing, wave soldering, x-ray inspection, encapsulents, system on chip

October: Lead-free solders, AOI, odd form placement, chip-on-board, vision systems

September/October (China): BGAs, MCMs, cleaning, reflow/profiling, wave soldering

November: In-circuit test, systems integration software, underfills, thick film technology, thermal profiling

December: Rework and repair, thermal interface materials, low volume/high mix equipment, die bonders, ATE

November/December (China): Advanced substrates, handling, software, underfills, hand soldering

(Note: Ad materials deadline for each month is the 15th of the previous month.)

Meet our regular columnists
Walt Custer & Jon Custer-Topai
Every edition of Global SMT & Packaging carries the latest business intelligence from Custer Consulting Inc. Walt is a world expert and former firector of marketing for Morton International. Jon is vice president of Custer Consulting.

Werner Engelmaier
With over 38 years experience in electronic packaging and interconnection technology, Werner is known as ‘Mr. Reliability’. He is president of Engelmaier Associates, providing consulting services on reliability, manufacturing & processing aspects of packaging and interconnection technology.

Joe Fjelstad
Joe Fjelstad is one of America’s brightest and innovative engineering scientists. A co-founder of Teserra Inc., and author of books on flexible circuits and chip scale packaging, Joe is currently a director of Siliconpipe Inc, a company involved in providing ‘the last mile’ in internet
cabling.

Bob Willis
As one of the world’s leading trainers of SMT engineers and chairman of the SMART Group in the UK, Bob Willis operates at the very heart of the electronics manufacturing industry in western Europe.His
column focuses on rework, repair, and lead-free issues.

Wu Yiping
Professor Wu Yiping is head of the electronics engineering department at City University of Hong Kong and also heads the Department of Materials at Huazhong University of
Science & Technology.

Additional distribution
Global SMT & Packaging magazine will be distributed at the following shows: