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the September Issue (7.9) |
The September issue of Global SMT & Packaging introduces a ground-breaking
new technology from Verdant Electronics, iNEMI's exploration of process optimization
for wave soldering operations, x-ray considerations for the production floor,
package-on-package (PoP) process development and reliability evaluation and
more. Download
now.
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Obtaining
and controlling reflow oven cooling rates
Fred Dimock, Rob DiMatteo
The implementation of lead free solder has forced solder suppliers, component
manufacturers, board providers, reflow process engineers and standards
groups to look at all aspects of the reflow profile. One area that is
receiving increased attention is the cooling rate. Some studies show that
the shear strength of tin-silver-copper (SAC) solder is slightly lower
than eutectic lead solder and that smaller grains obtained by faster cooling
can regain some of the strength. On the other hand, large BGAs advocate
slower cooling rates to minimize shearing.
The affect of these studies has placed additional stress on reflow process
engineer's being asked to produce profiles near the edges of and beyond
the capability of some reflow ovens. This paper will cover the control
parameters and modifications that can be made to reflow ovens to explore
increased and decreased cooling rates. Read
more...
This article was published in Global SMT & Packaging 7.8, August
2007.
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| Regular
column: Bob Willis |
Process
defects can be a thing of the past
SMTA International and Productronica will both be offering the 'Process
Advice and Lead-Free Defect Clinic.' Hosted by Global SMT & Packaging
magazine and sponsored by Baler Zinn, Thermo Scientific and DAGE, we hope
to make your production trouble free. Basically, during the two shows
we will be offering free advice on production problems, specification
issues and solutions on testing. Just bring your problem board assemblies
and let us take a look for you. You could also win interactive CD-ROMs
on lead-free and a copy of Practical Guide to X-Ray Inspection from the
SMTA Bookstore.
Lets take a look at some recent issues we have examined for clinic visitors
and customers. Read
more...
This column appeared in Global SMT & Packaging 7.8, August 2007.
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Successful
Expansion of SCH Technologies
Reputed by the electronics industry as providing a first class service as
a subcontract conformal coating provider, this South Yorkshire based company
is growing from strength to strength.
SMART
Group 'Lead-Free Defect Guide' available FREE!
At Munich Show Productronica,
Hall A4 Booth 303,
November 13th - 16th 2007
Pioneering
nanomaterials R&D recognised with 'start up' award
Surrey NanoSystems triumphed in the 'Start-up and University Collaboration'
category, at The Engineer Technology and Innovation Awards, organized by
The Engineer magazine.
Welcome
to Mentor Graphics' Solutions Expo
Mentor Graphics is hosting this year's Solutions Expo on 17th October in
the Heritage Motor Centre, Gaydon, Warwickshire.
South
Yorkshire electronics firm continues to expand
Arrow Technical Services has announced it has created five new engineering
jobs and a sales executive position.
Kestrel
International Circuits Expands Sales Team
Clive formerly with Daleba Circuits entered the PCB industry as an engineer
in 1986 before moving on to a number of key management roles.
Speedline
to Present Webinar on Upstream Defect Inspection
When: Thursday, October 18, 2007
Time: 11:00 am Eastern time (The presentation lasts one hour)
More
industry news...
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Solder Paste
Slump
Solder slump is fairly uncommon today with so many well-developed paste
products on the market. Slumping can occur when the ambient temperature
in the workplace increases, which may happen during the summer periods
when air conditioning is not available in the factory. Read
more here
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01005
components: Siplace X4 beats the competition
01005 components are the smallest available today.
Rommel
Conveyoring from Contax Increases Capacity for Zirkon
As a result of the Rommel equipment, and other upgrades, the production
capacity of the line has now been doubled.
SiscanT
C3: Top speed in 3-D inspection
The Siscan C3 sensor - highest speed with most precise measurement.
ARM
selects XJTAG for RealView development tools debug and test
"After evaluating the different competitive options, we selected the XJTAG
boundary scan system due to its power, performance, versatility and cost effectiveness."
New
power and data interface for Siplace X feeders makes external feeder operation
easy
The SSE consists of an aluminum frame that holds the X feeder module. Internal
electronics provide power and communication.
More
new products ...
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2007 September
Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Jade Po Kellard at jkellard@globalsmt.net.
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