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Guest Editorial by Peter Marshall
 My
first time working on an exhibition stand at a UK Nepcon show, as a mere
boy of 10+ something, was in 1974. 18,000 engineers passed through the
halls and warrens of the Metropol in Brighton to view predominantly PCB
manufacturing technology, an array of manual assembly tools plus a few
automatic insertion machines chomping away in the background. How times
have changed to Nepcon 2007 in Birmingham where 2,500 new generation engineers
visited a show now dedicated to SMT with little sign of any PCB manufacturing
and only a handful of lead forming tools. This "new" SMT technology is
nearing its 30th birthday and is now considered a mature technology. From
the rear window sticker culture of 1984 "Surface Mounters do it on Top",
it's a simple process just 3 steps Print / Place / Reflow. When you get
it right the process runs like a dream, get it wrong and you have a bag
full of bits with no hope of economical recovery.
Read
the rest of Peter's editorial at Global SMT & Packaging - UK/Ireland.
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| Regular
column: Bob Willis |
SMART Group launches
"Lead-Free Process Defect Guide" at Nepcon Electronics
With the introduction of lead-free assembly to meet the requirements
of the RoHS Directive in Europe, engineers have experienced a new range
of defects during different stages in manufacture. Some of the defects
are completely new, others are reoccurrences of past issues. Fortunately
some are simply cosmetic and not liable to affect the reliability of products.
Read
more ...
This column was originally published in Global SMT & Packaging
Vol. 7 No. 5 - May 2007.
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Are you measuring
the true temperature with your thermocouple?
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Advanced coating
techniques for lead-free solders
 As
industry moves to lead-free soldering, tin has replaced lead in a majority
of the new solder formulas and also in component coatings and leads.
Read
more ...
This article was originally published in Global SMT & Packaging
Vol. 7 No. 5 - May 2007.
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Speedline
to Present Webinar on Tombstoning and Mid-Chip Solder Balls
A webcast will be offered on reduction/elimination of two common SMT defects,
tombstoning and mid-chip solder balls
Date : Thursday, August 16, 2007, commences at 11:00 am Eastern time; lasts one
hour.
Full-day
seminar in Livingston on "Improving Product Reliability"
On Tuesday 11 September SMART Group Scotland is holding a full-day
seminar in Livingston on "Improving Product Reliability".
Royal
Visit Recognises Dage Achievements
A visit by Her Royal Highness The Princes Royal to the Dage HQ based
in Aylesbury UK on Friday 29th June.
New
Exhibition Director for Nepcon UK
Reed Exhibitions looks to industry with appointment of new Director
for Industrial Group and shares ABC Audit figures for 2007 event.
Barric
Launches Surface Mount Rework and Repair Lab
"The new test and rework lab has been an essential investment that we
have had to make in order to stay at the forefront of electronic manufacturing," said
Mike Bayley, director of business development at Barric.
More
industry news...
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| Troubleshoot
your defects |
Solve your
printing, assembly, reflow & wave soldering defects
Introducing the new, free Global SMT & Packaging online
Defect Troubleshooter. Browse the defects and solutions in our defect
library for one similar to yours or submit your defects--free--for an explanation
of possible causes and fixes. Defect causes and solutions are provided
by Bob Willis, process engineering consultant and instructor and technical
director of SMART Group. Visit
the Defect Troubleshooter.
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Dage
introduces 2nd generation cold bump pull for High-Speed Bondtester
Especially important is the transition speed, the point at which the dominant
failure mode changes from ductile failure to brittle fracture or pad lift.
Speedline
"Streams" Ahead with New SmartStreamT Dispense Technology
This innovative
method offers distinct advantages through its use of positive displacement
technology to optimize volume repeatability and maximize material flow
rates, resulting in an extremely fast and accurate alternative to jetting.
Orbotech
Advances Solder Paste Inspection Capabilities with Enhanced AOI Solution
Symbion P36 Plus features Orbotech's unique POPT (Parallel Optical Path) 3-D
and 2-D detection technology and easy Wizard & GoT operation for 100% volumetric
solder paste inspection accuracy at ultra fast speed.
More
new products ...
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2007 July
The Only Lead-Free Alloy
that Diminishes the 5 D ’s
1. Lowest
dissolution of copper
2. Low dullness
3. Low defects
4. Low dross
5. Low dollars
For more information, visit
Kester
Ultrapure® K100LD
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Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Jade Po Kellard at jkellard@globalsmt.net.
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