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Greetings!
The big news this month is the Solectron acquisition by Flextronics
for $3.6 billion. The moved confused a lot of industry insiders who have
been asking why one low-cost manufacturer would merge with another.
Here’s why. Flextronics are restructuring into approximately six
different market segments, serving aerospace, telecoms, industrial, medical,
automotive, computing and consumer. They already have a strong foothold
in consumer and telecoms. Solectron buys instant market
share in the industrial and medical sectors and strengthens others.
The trick will be in how fast Flextronics can integrate Solectron into
their culture, systems and infrastructure. With the current speed of change
in the electronics industry, Flex won’t be able to withstand a prolonged
integration period.
Trevor Galbraith
Editor-in-Chief
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EFD Soldering Products
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| Download
the June Issue (7.6) |
Our June issue revisits the rising cost of tin, offers advanced coating technologies
for lead-free solders and presents iNEMI's updates on tin whisker recommendations.
June also features a SEMICON West preview, show reports on Nepcons UK,
Shanghai and Korea, along with an interview with DEK's John Hartner and a special
technology focus on JUKI's new OPASS technology. Don't miss the regular columns,
industry and association news and new products spotlight as well. Download
now.
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Kyzen Electronic Cleaning Chemistries
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Global impact
of the accelerating cost increase of metals
by Bruce S. Moloznik & Mitch Holtzer,
Cookson Electronics; Stan Rothschild, Metallic Resources Inc.;
Doug Dixon, Henkel Technologies; and Ross Berntson, Indium Corp
The price of tin has always exhibited volatility, but since 2003 the
price has remained in a range of $6,000 to $9,000 per metric ton. In
the last 6 months, however, the price of tin has increased over 40 percent
and the price continues to climb. The participating members of the IPC
Solder Products Value Council1 are compelled to clearly articulate the
current situation regarding the global supply and demand of two crucial
metallic elements to the electronics industry. The cost of tin and silver
have reached 19-year highs and it is important for our industry to understand
the implications of this kind of cost increase on the supply of solder
alloys. Read
the full article...
This article was taken from Global SMT & Packaging Vol. 7 No.
5 - May 2007 |
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Don't
miss this totally electronics focused event
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| Walt & Jon Custer's Market Update |
‘Perfect
Storm’ zaps 1Q’07 global electronics sales
After a strong finish last year, the global electronics industry definitely
cooled in early 2007. A combination of slower economic growth, normal seasonality,
February’s Chinese New Year shutdown, the delay and then tepid sales
of Vista PCs and the resulting excess component inventories combined to cause
our anticipated ‘soft landing’ to look more like crash – especially
in SE Asia. Read
the full column...
This column was taken from Global SMT & Packaging Vol. 7, No.
6 – June 2007
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IPC Midwest: September
26-28, Shaumburg, Illinois, USA
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Reliability
of tacky fluxes in varying soldering applications
by Brian Smith, Jennifer Allen and John Tuccy, Kester
The use of tacky fluxes is common throughout the industry in
applications such as ball attach, BGA repair and hand soldering.
These applications employ different heating profiles, meaning
that the fluxes are required to endure a wide range of time and
temperature conditions while not compromising long-term reliability.
Tacky fluxes are generally made from the same types of materials
that comprise standard solder paste products designed for typical
SMT applications. Therefore, the processability and reliability
of tacky fluxes that are subjected to a standard SMT reflow profile
are well understood. However, when the same tacky flux is subjected
to a shorter heating cycle, such as a hand soldering application,
it is not necessarily known if the flux residues will have the
same reliability as expected when subjected to the typical SMT
reflow profile. This paper examines the long-term reliability
of no-clean tacky fluxes when subjected to a variety of processing
conditions. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 5 - May 2007
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Are you measuring
the true temperature with your thermocouple?
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Faster Quality
Control with X-ray Computed Tomography
X-ray inspection is a quality control tool that not only leaves the
product intact but is also considerably faster than destructive testing.
But some of today's inspection challenges will require more than conventional
X-ray inspection, especially when inspecting microassemblies with complex
three-dimensional structures. True 3D x-ray computed tomography can
greatly benefit quality inspection: Time-saving and cost effective,
CT systems like the phoenix|x-ray v|tome|x can create a 3D model in
less than an hour, which can then be virtually sectioned. Find out
how 3D x-ray can benefit your company's bottom line... Read
more...
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Bjorn Dahl
Interview
KIC’s thermal profiling products have become omnipresent in
the EMS industry, and have been compared with such household names
as Intel for their famous ‘KIC on Board’ logo that appears
on most reflow ovens. The company’s president, Bjorn Dahle, remains
as active as ever and launched two exciting new products at APEX in
February. Trevor Galbraith caught up with him to find out where he
is driving the KIC machine. Read
more...
This article was taken from Global SMT & Packaging Vol. 7 No.
5 - May 2007
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Measuring true
temperature in lead-free assembly
by Yoshinobu Anbe, Phil Harrison
Lead-free legislation is now law in Europe and China, forcing
most manufacturers to move to lead-free manufacturing to comply
with the legislation, or simply to avoid the rising cost of traditional
SnPb components. The majority of printed circuit assemblies use
SAC alloys that require reflow temperatures around 240°C
and peak temperatures of 260°C.
These higher reflow temperatures have created a narrower process
window and an increased need for more accurate temperature measurement
data. This article analyzes different thermocouple products and
their suitability for modern lead-free manufacturing. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 5 - May 2007
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Managing distributed
development & NPI across global supply chains
by Jan Keijzer and Gerard Elema, Adeon Technologies BV
This paper discusses the requirement for an engineering collaboration
application software platform for the electronics and mechatronics
industries to provide technology that allows users to work in
a secure, global network from one single GUI. A common, unified
interface allows seamless communication within design teams and
suppliers, manufacturers, and other partners. The system provides
a unique solution for engineering collaboration and is revolutionizing
the manner in which supply chains manage their data streams. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 5 - May 2007
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Digi-Key Corporation
and Free2move ink global distribution agreement
Digi-Key is stocking Free2move’s high performance Bluetooth™ modules
for surface mounting with built-in software for data and audio communication.
Dage appoints
Electronic Assembly Products as new sales representative
Electronic Assembly Products, Inc. will represent Dage's digital x-ray
inspection systems and bond test equipment throughout Colorado, Utah and
Costa Rica.
Elektrobit
sells production solutions business to Rohwedder AG
The production solutions products and product brands (such as JOT Automation)
are included in the transaction.
Höllmüller
to acquire RENA
Both companies will continue to operate on the market under their own company
names.
Flextronics
to acquire Solectron
Combination creates global EMS company with more than $30 billion (USD)
in annual revenue.
Speedline to
present webinar on printing solder paste for flip chip bumps
The free one-hour webcast is scheduled for July 19, 2007 at 11:00am.
Henkel Electronics
Group partners with Blue Thunder Technologies
Blue Thunder Technologies will now carry Multicore and Hysol products manufactured
by Loctite, a Henkel Electronics Group brand.
More Industry News...
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BVX-200 fume extraction
system uses brushless motor technology
Enhanncements to the BVX-200 promise longer operating lifetime and improved
extraction performance.
Water soluble
solder paste for ultra-high reliability lead-free assembly applications
ALPHA WS-819 water-soluble, lead-free solder paste delivers excellent printing
characteristics over a wide range of humidity (50% +/- 15%) conditions,
while offering excellent cleanability and resistance to voiding.
MyData's new Agilis
stick magazine
The ASM improves overall productivity and will be introduced as the
new stick feeding solution for all new MyData machines.
New 2-axis optical
and video measuring system
Comprehensive video tools are accessed by a video dedicated microprocessor
QC300 employing the latest touchscreen technology.
Low cost boundary
scan controller enables reliable TAP access over greater distances
During the Boundary Scan Days® in Jena/Germany, GOEPEL electronic introduced
the ScanBooster/USB-FXT as an additional high-performance but low cost
controller.
More New Products...
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Forward to
a colleague
Global SMT & Packaging magazine
email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com
Trafalgar Publications Limited
65 High Street
Glastonbury, Somerset
BA6 9DS United Kingdom
Stop receiving Global SMT & Packaging digital
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June 14 , 2007
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Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Trevor Galbraith at editor@globalsmt.net.
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