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SEMICON heats up...
At SEMICON West this year the buzz was all about solar manufacturing.
This industry is predicted to explode over the next few years and there
are significant opportunities for suppliers and manufacturers of solar
panels alike. On the supplier side, the winners are going to be manufacturers
of printers and ovens. Every solar panel line needs three printers
to deposit various coatings and three ovens to cure them.
Trevor Galbraith
Editor-in-Chief
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| Download
the July Issue (7.7) |
The July 2007 issue of Global SMT & Packaging magazine focuses on medical
electronics, 3D stacking trends, and liquid tin corrosion in lead-free wave
soldering. Regular EU-edition columnist Bob Willis discusses LEADOUT online
training. North-America-edition columnist Joe Fjelstad talks about IC packaging,
which is nearing its 50 year anniversary. Werner Englemaier continues his column
on solder joint reliability in a lead-free world. Download
now.
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MIDs in our midst
– Molded Interconnect Devices offer unique advantages and
opportunities
The exact origin of the concept of a molded printed circuit in terms of
time and place is uncertain; however, it is clear that one early patent,
issued to Rogers Corporation1 in 1961, did define a molded, three dimensional
circuit board. The patent was filed in 1956, so that year represents a
possible time marker for a conceptual genesis. Even with that early date,
broad scale attempts to market the idea to electronic product developers
weren’t made until almost a quarter century later, in the late 1970s
and early 1980s. At the time, there were compelling arguments being made
in favor of molded circuit technology. Read
the full column...
This column originally appeared in Global SMT & Packaging 7.6 -
June 2007.
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| Henkel:
Self-aligning Pb-free capable corner support for CSPs |
Need a fast,
simple BGA and CSP support alternative?
Get the Edge from Henkel.
by Brian Toleno
Widespread use of BGA and CSP devices in combination with their finer pitches
has
created the need to provide additional package protection to ensure long-term
reliability
and good in-field performance. This, of course, is what the latest underfill
technology
has been designed to do – deliver the stress reduction required and,
thus, improve the
reliability of the device. Though first generation underfills were engineered
to
accommodate for coefficient of thermal expansion (CTE) differences between
the
substrate and the device, technology advancement and new package development
have
yielded additional uses for modern underfill systems. Specifically, handheld
and mobile
products that are subjected to higher levels of stress from drop, shock and
vibration,
benefit greatly from underfill support. Read
more...
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Achieving solder
joint reliability in a lead-free world, part 1
Werner Engelmaier
I have addressed various aspects of reliability with lead-free (LF) solder
joints in columns appearing in previous issues of GSMT&P.
The LF aspect discussed here came about because of a recent consulting
engagement.
For some reasons, not to be discussed here, some electronics users are
requiring ceramic components. The large resulting CTE mismatch between
the ceramic component and the FR-4 PCB had been overcome with added solder
joint heights achievable with high-melting solder balls and/or solder columns
when SnPb-solders were the standard. This solution option is not available
in a Pb-free world because of the much higher solidus temperatures of Pb-free
solders. Read
the full column...
This column originally appeared in Global SMT & Packaging 7.6 -
June 2007.
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Your questions
answered at SMT Nuremberg 2007
Bob Willis
Mesago and Global SMT & Packaging magazine provided a special visitor
attraction at this year’s SMT Nuremberg Exhibition in sun-drenched
Germany. Your Global columnist organised and ran this special feature for
three days of the show, offering advice and answering questions on production
problems, including lead-free and RoHS, to visitors. ERSA, Germany, was
kind enough to provide inspection equipment to use during the three days
of the exhibition.
Here are some of the interesting process issues discussed and some of
the general answers given during the show. Read
the full column...
This column originally appeared in Global SMT & Packaging 7.6 -
June 2007.
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| Troubleshoot
your defects |
Solve your
printing, assembly, reflow & wave soldering defects
Introducing the new, free Global SMT & Packaging online
Defect Troubleshooter. Browse the defects and solutions in our defect
library for one similar to yours or submit your defects--free--for an explanation
of possible causes and fixes. Defect causes and solutions are provided
by Bob Willis, process engineering consultant and instructor and technical
director of SMART Group. Visit
the Defect Troubleshooter.
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Axiom Electronics,
ECD collaborate on thermal profiling
The companies are working closely together to increase product quality and reliability.
 EMS Village
at Productronica 2007 will demonstrate how far this key industry sector
has developed
In 2006, sales in the European EMS market increased from 21.4 billion US
dollars (2005) to 25.1 billion US dollars.
New end-user
markets drive semiconductor market growth
The increasing sales of consumer electronics, communication technology,
and automobiles, especially in the Asia market, drive the discrete power
semiconductor market. All of these applications combined contribute more
than half of the discrete power revenues.
PC market
on track in 2007
Shipments expected to hit 11.2 percent growth target for the year.
Digi-Key Corporation
and Radios, Inc. forge agreement for global distribution
Radios, Inc. products stocked by Digi-Key include its transmitter and receiver
modules as well as handheld transmitters and development kits.
Military certification
for HumiSeal’s UV40 range
This latest round of certification means that the company now offers the
widest range of Military and UL (Underwriters Laboratories) certified products
in the industry across all of the chemistry types.
 DEK names
new business manager for Western region
DEK continues to strengthen its Americas business team, today announcing
the appointment of Mr. Aram Kardjian to the position of Western regional
business manager.
Kyzen named
First Finalist in Advanced Packaging Award program
Kyzen Corporation's Micronox MX2302 semi-aqueous cleaning solvent was named
First Finalist in the category of Environmentally Friendly Materials.
EMS and ODM
convergence: Where lies the future?
The electronics contract manufacturing market continues to evolve as electronics
manufacturing service (EMS) providers and original design manufacturers
(ODMs) diversify and seek new markets.
Ovation Products
wins Advanced Packaging award
Ovation's Smart-stencil technology won in the category of dispensing, encapsulation,
molding and underfill equipment and materials.
Aqueous Technologies
wins Advanced Packaging award
Aqueous Technologies Corporation has been awarded an Advanced
Packaging Award in the category of environmentally friendly materials.
More Industry News...
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|
 Speedline introduces
the Momentum™, its next generation printer
This general purpose printer features a number of technologically advanced
features common with their flagship machine, the Accela, at a price point that
is geared toward the mid-market segment.
 Essemtec introduces
new batch printer with shuttle system
The SP600 combines the convenience of a batch printer with the advantages of
a fully automatic system.
Inovaxe Adds
Software Functionality to INOCART Material Handling Systems
Inovaxe Adds Software Functionality to INOCART Material Handling Systems
- with each INOCART purchase, effective August 1, 2007.
Juki to offer
three-year parts warranty on new systems
Juki Automation Systems, representing Juki Corporation in the Americas, to
offer full three-year parts warranty on all new systems sold in the Americas.
More New Products...
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July 31, 2007
Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Trevor Galbraith at editor@globalsmt.net.
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