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Greetings!
The iPhone is set to bring a
whole new level of functionality to the cellphone market. With touchscreens,
easy to download music videos and map technologies, the iPhone is certain
to be in hot demand with gadget freaks and trendies alike. Another attraction
is that it is thin and, as E. Jan Vardeman (Techsearch International
Inc.) said in recent presentations, “Thin is In” – not
because the form factors demand it to be thin, but because consumers
want it to be.
All this is driving the race for new 3D packaging technologies. The time
to market for many new packaging technologies is happening at a blistering
pace. Wafer thinning, stacked die and a variety of other system-in-package
(SiP) configurations are being rushed through development to satisfy the
consumer demand.
Trevor Galbraith
Editor-in-Chief
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EFD Soldering Products
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| Download
the July Issue (7.7) |
The July 2007 issue of Global SMT & Packaging magazine focuses on medical
electronics, 3D stacking trends, and liquid tin corrosion in lead-free wave
soldering. Regular EU-edition columnist Bob Willis discusses LEADOUT online
training. North-America-edition columnist Joe Fjelstad talks about IC packaging,
which is nearing its 50 year anniversary. Werner Englemaier continues his column
on solder joint reliability in a lead-free world. Download
now.
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IPC Midwest: September
26-28, Shaumburg, Illinois, USA
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Advanced coating
technologies for lead-free solders
by Bill Boyd
As industry moves to lead-free soldering, tin has replaced lead in
a majority of the new solder formulas and also in component coatings
and leads. A major concern is the propensity of tin to produce filament
growth, or ‘tin whiskers.’ This growth greatly affects
the integrity of electronic assemblies. For years, tin coatings have
been dipped or plated with lead-formulated coatings to reduce this
risk. That is no longer viable. Therefore, many manufacturers are turning
to conformal coatings as a method to reduce whisker growth, both from
tin-plated components and tin-based solders, to acceptable minimums.
However, this can add process steps, including intricate masking and
attention to ensuring that all points both above and beneath soldered
devices are completely coated.
This paper will address the basics of the tin whisker problem, review
how conformal coatings offer a viable solution, and present the latest
in system technologies designed to apply coatings. Read
the full article...
This article was taken from Global SMT & Packaging Vol. 7 No.
6 - June 2007
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Don't
miss this totally electronics focused event
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| Walt & Jon Custer's Market Update |
Mid-year
perspective:
Soft demand early, flat mid-year, growth returning in late 2007
With all the major OEMs now having reported their 1Q’07 results, we
see that sales rose about 7%, profits increased 23% and inventories rose
9% compared to first quarter 2006. However, compared to the fourth quarter
of 2006, the ratio of inventories/sales rose noticeably in 1Q’07. When
inventories are high in the face of weakening end market demand, new component
orders are trimmed. Read
the full column...
This column was taken from Global SMT & Packaging Vol. 7, No.
7 – July 2007
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Is tin heading
for a crisis?
by Peter Kettle, ITRI
Tin prices have risen sharply after two decades of depression.
This article provides background facts and figures on recent
market developments in tin and argues that the rise in tin prices
will provide long-term benefits for tin users, by stimulating
investment in sustainable supply. The recent actions by the Indonesian,
Chinese and other governments to enforce tighter regulation of
small scale mining is part of a transition to a much healthier
tin supply chain. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 6 - June 2007
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Phoenix x-ray
advertorial goes here
Advertorial here. Read
more...
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John Hartner
Interview
DEK Printing Machines has dominated the printing industry for the
best part of 30 years. Through the many revolutions that have epitomized
the electronics manufacturing industry, DEK has always positioned itself
at the leading edge of the product performance curve. Trevor Galbraith
talked with DEK CEO John Hartner about product development, competition
and going forward into 2008. Read
more...
This article was taken from Global SMT & Packaging Vol. 7 No.
6 - June 2007
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iNEMI Updates
Tin Whisker Recommendations
by Joe Smetana
The Tin Whisker User Group of the International Electronics
Manufacturing Initiative (iNEMI) released a major update of its
publication “Recommendations on Lead-Free Finishes for
Components Used in High-Reliability Products” at the end
of last year. This latest revision includes significant changes
to some of the group’s previous recommendations as well
as addition of new recommendations regarding such issues as corrosion,
bias, use of tin over brass or tin over steel, circuit board
assembly, and non-columnar grain structure. They have also expanded
their discussion of bright tin, making formal recommendations
regarding its use. This article discusses some of the more significant
updates/revisions. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 6 - June 2007
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Semiconductor
materials expected to reach record revenues in 2007
Coming off its third consecutive record breaking year, the global semiconductor
materials market is expected to grow over 10 percent in 2007, and is
forecasted to grow another 10 percent in 2008 according to SEMI’s
latest materials forecast.
Kester’s
Kurt Rajewski promoted to global product manager
Kurt will report directly to Roger Savage, president/CEO of Kester, and
will be responsible for all aspects of product line management, including
product marketing, pricing, new product development coordination and promotions.
High-speed bondtesting
guidebook available from Dage
The Dage high-speed bondtesting guidebook provides valuable information
that can be used as a teaching aid and reference guide for anyone undertaking
reliability testing of BGA and CSP solder ball interconnections.
Speedline to
Present Webinar on Tombstoning and Mid-Chip Solder Balls
A webcast will be offered on reduction/elimination of two common SMT defects,
tombstoning and mid-chip solder balls on Thursday, August 16
Digi-Key Inks
Distribution Agreement with Fluke Corporation
Among the Fluke products stocked by Digi-Key are multimeters, thermometers
and insulation resistance testers.
Joe Fjelstad
joins Mirror Semiconductor Technical Advisory Board
Joseph C. Fjelstad, Circuit Packaging Author, Inventor and Integrated Circuit
Packaging Expert has became the newest member of Mirror Semiconductor’s
Technical Advisory Board.
Brian Smith
Promoted to Global Product Manager at Kester
Brian will be responsible for all aspects of product line management, including
product marketing, pricing, new product development coordination and promotion.
More Industry News...
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Speedline “Streams” Ahead
with New SmartStream™ Dispense Technology
This innovative method offers distinct advantages through its use of positive
displacement technology to optimize volume repeatability and maximize material
flow rates, resulting in an extremely fast and accurate alternative to jetting.
Glenbrook launches
JewelBox 70T real-time x-ray video recorder
Recorder allows users to observe and record device deployment, internal
motion.
Dage introduces
2nd generation cold bump pull for High-Speed Bondtester
Especially important is the transition speed, the point at which the
dominant failure mode changes from ductile failure to brittle fracture
or pad lift.
Thermo Fisher
Scientific Launches Third Generation Handheld NITON XRF Analyzers
New NITON XL3 700 Series XRF Analyzers Provide Much Faster Testing
Speed and Dramatically Improved Analytical Performance Over Prior Generation
Technology
More New Products...
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a colleague
Global SMT & Packaging magazine
email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com
Trafalgar Publications Limited
65 High Street
Glastonbury, Somerset
BA6 9DS United Kingdom
Stop receiving Global SMT & Packaging digital
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July 18, 2007
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Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Trevor Galbraith at editor@globalsmt.net.
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