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Greetings!
My recent travels took me to New Delhi, India where the drive from
the airport was right out of a Discovery Channel documentary. Cows majestically
wandered around the roads while the level of poverty leaves you feeling humbled
at your good fortune. Was this really the country that has the fourth largest mobile phone population in the world and is growing
at an aggressive 10% per annum?
The answer is yes! The burgeoning middle class who have
benefited from jobs in the call centres and software development
companies are now hungry for the trappings of a modern, western
lifestyle, creating a market boom that mimics China.
My overriding impression is that India now has the bit between its
teeth and it’s running hard. It therefore gave me great pleasure
to confirm our agreement with our new partner, Comnet Publishers
Pvt. Ltd. who will publish a website and newsletter edition of Global
SMT & Packaging for the India market.
These will complement
our other local language editions that are now live in Hungary,
Japan and China. If you would like to subscribe to any of these newsletters,
please visit our website at www.globalsmt.net.
Trevor Galbraith
Editor-in-Chief
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EFD Soldering Products
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| Download
the January Issue (7.1) |
Our first issue of the year gives you "Ten Lessons Learned in Cleaning Pb-Free
Flux Residues", guidlines for "Characterizing Mechanical Stress", information
about "Low-Warpage Molding Compound Development for Array Packages", and a
reality check on XRF. It also carries our IPC Printed Circuits Expo / APEX
/ Designers Summit preview. The issue's Business Feature asks if lean manufacturing
really saves money.
Also in this issue: an interview with Henkel's Pat Tripple,
a review of the MAP 2006 and IWLPC 2006 conferences, a 2006 status & 2007
outlook by Walt & Jon Custer, information on specifying reliable PCBs for lead-free
solder assembly, and a column on lead-free solder alloys. Download
now.
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Take the ALPHA SACX challenge
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‘Delidding’ ICs
to verify chip authenticity
Joel Deutsch
Rampant counterfeiting in regions such as Asia has made strict research into
the documentation and authenticity of chips an essential prerequisite for
accepting ICs for integration into manufactured products. E-Certa uses a
patent-pending ‘delidding’ process to examine a chip’s
internal structure and uses a metallurgical microscope to perform a complete
sweep of the sample IC from micromillimeter to micromillimeter, capturing
chip images and performing research to ensure that the logo on the chip is
authentic. Read
the full article...
This article was taken from Global SMT & Packaging Vol. 6 No. 10
- November/December 2006 |
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The leading cleaning chemistry & solutions provider
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| | | Walt & Jon Custer's Market Update |
2006 Status & 2007
Outlook
(Plus a few words about Munich’s electronica Trade Fair)
3Q global revenues, net income and inventories by equipment sector
Based upon 3Q’06 financial data from a broad range of companies in
the global electronics ‘food chain', we now have an
updated, quantitative picture of 2006 business conditions. Composite sales,
net income and inventories of 61 large OEMs serving all market sectors show
that 3Q’06 OEM revenues rose 11% vs. the same quarter in 2005. Net
income rose 15% and inventories 16%. The ratio of inventories to sales remained
relatively flat for OEMs, EMS companies and component distributors but semiconductor
manufactures (dominated by Intel) maintained their large
inventory bulge.
Read
the full column...
This article was taken from Global SMT & Packaging Vol. 7, No.
1 – January 2007
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Inventory
management: combining business intelligence & material handling hardware
Bob Douglas
Most business intelligence (BI) tools and supply chain management (SCM)
applications address inventory issues from either a software perspective
or a material handling perspective; however there is nothing on the market
that binds both hardware and software solutions together to form a complete
end-to-end solution for managing inventory. For example, SCM applications
typically require that the user enter either shrink or scrap factors
into the system. This injects inaccuracies that have an accumulating
effect over time. The difficulty lies in the complexity of moving inventory
through a variety of stages through the production process where there
are no transactional requirements or no validation of transactions that
take place. Read
the full article...
This article was taken from Global SMT & Packaging Vol. 6 No. 10
- November/December 2006
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Pierre de Villemejane
Interview
On Wednesday, November 8th the industry was rocked by yet another surprise
acquisition. Speedline was acquired by ITW (Illinois Tool Works) from
its owners KPS Special Situation Funds. Trevor Galbraith asks Pierre
de Villemejane about what this means for the future of Speedline. Read
more...
This article was taken from Global SMT & Packaging Vol. 6 No.
10 - November/December 2006
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Tin-copper
based solder options for lead-free assembly
Peter Biocca
Tin-silver-copper has received much publicity in recent years as the
lead-free solder of choice. The IPC Solder Value Product Council SAC305
(Sn96.5 Ag3.0 Cu0.5) was endorsed by as the preferred option for SMT
assembly, and most assemblers have transitioned to this alloy for their
solder paste requirements. However, due to the 3.0% silver content,
the SAC305 is expensive when compared to traditional Sn63Pb37. For this
reason, many wave assemblers are opting for less costly options, such
as tin-copper based solders, for their wave, selective and dip tinning
operations. Read
more...
This article was taken from Global SMT & Packaging Vol.
6 No. 10 - November/December 2006
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Innov-X Systems
receives investment from Summit Partners
Manufacturer of elemental analyzers is poised to continue rapid growth. Digi-Key
pens global distribution agreement with Excelsys Technologies Ltd
This new distribution agreement with Excelsys will allow Digi-Key to
provide its customers with custom power solutions without the standard
lead-time of a custom supply.
Kyzen’s
Tom Forsythe to present at SMART Group cleaning workshop
The Cleaning Electronics Assemblies in the 21st Century Workshop, is
scheduled to take place Tuesday, February 27, 2007, in Livingston, UK.
More Industry News...
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Control Micro Systems introduces next generation PCB laser marking system
Control Micro Systems, Inc. announces the introduction of the latest generation
of its printed circuit board laser markers, the Gen4 product line.
Latest Agilent
software release adds new automated x-ray inspection capabilities
Agilent Technologies Inc. announced that it has shipped its 8.4 software release
with enhanced capabilities for the Medalist 5DX Automated X-ray Inspection (AXI)
system. Tessera introduces SHELLCASE RT wafer-level chip-size packaging
The platform provides key new benefits, including reduced thickness,
high yield, and superior reliability
More New Products...
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January 11, 2007
The Only Lead-Free Alloy that Diminishes the
5 D ’s
1. Lowest dissolution of copper
2. Low dullness
3. Low defects
4. Low dross
5. Low dollars
For more information, visit
Kester
Ultrapure® K100LD
Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Trevor Galbraith at editor@globalsmt.net.
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