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Greetings!
In case you cannot make it to LA for the IPC Expo, APEX and Designer's
Summit, be sure to watch the show highlights on our Show Report, which
will be on our website by Friday,
February 23rd. There you will see and hear about all the latest cool
new products
that
could make your life that little bit easier!
Trevor Galbraith
Editor-in-Chief
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EFD Soldering Products
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| Download
the February Issue (7.2) |
Issue 7.2 is packed with technical articles & columns. Read about validating
SAC305 and SnCu-based solders at the contract assembler level. Learn how selective
soldering can improve your process. Explore an evaluation of wafer bumping
stencils. Learn how to integrate strategic alliances in product development
and manufacturing--and much more. This is also our APEX show issue, with all
the info you need for getting around the IPC Expo, APEX and Designer's Summit. Download
now.
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Take the ALPHA SACX
challenge
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Ten lessons
learned in cleaning Pb-free flux residues
Mike Bixenman, Erik Miller and Fernando Rueda, Kyzen Corporation
When industry announced the intention to eliminate lead (Pb) from the soldering
process, a number of experiments were performed to test the cleaning efficacy
of Pb-free soldering materials. The cleaning data, from over 75 Pb-free solder
pastes, suggested different residue types that were more difficult to clean
than standard eutectic Sn/Pb. As Pb-free materials evolved, innovative-engineered
flux compositions addressed many of the soldering problems by improving wetting,
solder joint appearance, flux residue content and visual appearance. Solder
paste manufacturer innovations continue to improve flux compositions leading
to better wetting, tack life, printability and void-free solder joints. Cleaning
efficacy of the Pb-free solder flux residues continue to vary widely from
materials offered by the different soldering materials companies. Read
the full article...
This article was taken from Global SMT & Packaging Vol. 7 No. 1
- January 2007 |
| | | Walt & Jon Custer's Market Update |
2007 Looking Better
Than Previously Expected!
Electronic equipment – growth in most regions
In spite of a 4Q’06 slowdown in personal computer production (due to
a delay in Microsoft Vista and microprocessor shortages in Asia), global
electronic equipment demand remained reasonably strong at year-end 2006.
Consumer electronics and demand from developing nations were key drivers.
And, with Vista now to be released in 1Q’07, the PC purchases postponed
in the fourth quarter should soon be realized.
In the USA electronic equipment sales and orders rebounded in November
after a sharp October decline. All end markets recovered. In Europe communications
equipment base station demand slumped while other market segments held
steady while in Japan there
appears to be some recovery after a multiyear decline
Read
the full column...
This column was taken from Global SMT & Packaging Vol. 7, No.
2– February 2007
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Characterizing
mechanical stress caused by packaging processes
Soeren Hirsch, Soeren Majcherek and Bertram Schmidt, Institute of
Micro and Sensor Systems, Otto-von-Guericke-University Magdeburg
This paper reports on a method for estimating and minimizing mechanical
stress on MEMS sensor and actuator structures that is caused by the packaging
processes. Finite element method simulation was used to calculate the
stress profile with different packaging materials and different packaging
geometries. After simulation, a silicon test chip was fabricated to validate
the simulation results. A network of piezo-resistive solid state resistors
created by diffusion was used to measure the surface tension pattern
between adjacent membranes. The sheet resistance was measured using a
high precision modular resistance meter. Read
the full article...
This article was taken from Global SMT & Packaging Vol. 7 No.
1 - January 2007
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Pat Trippel
Interview
Electronics materials manufacturers need to stay close to their customers,
both technically and geographically. Global SMT & Packaging editor
Trevor Galbraith spoke to Henkel electronics group president Pat Trippel
about the constant challenges facing materials suppliers in a fast-paced
manufacturing world. Read
more...
This interview was taken from Global SMT & Packaging Vol. 7 No.
1 - January 2007
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Low-warpage
molding compound development for array packages
Irving Y. Chien, Jack Zhang, Lou Rector and Michael Tod
Due to the singulation and soldering processes required during package
assembly, device warpage after molding is a critical issue for array
packages. Warpage is greatly affected by package geometries, such as
dimensions of the matrix block, pad, die, and passive components, as
well as the molding compound properties. One set of molding compound
properties may generate very low warpage in one array package, but unacceptable
warpage in another. To achieve minimum warpage in all geometry variations,
molding compound properties have to be tuned for each package. For this
paper, modifications to a successful molding compound A (MC A) were
performed systematically. The curing shrinkage and Tg of the molding
compounds were adjusted, while other major properties kept consistent.
Warpage of array blocks/strips built with modified molding compounds
was measured by a shadow Moiré method to correlate warpage with
molding compound properties. Finite element analysis (FEA) was performed
to predict and correlate the effects of mold compound properties on
warpage. Read
more...
This article was taken from Global SMT & Packaging Vol.
7 No. 1 - January 2007
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Ovation Products wins second VISION award
Ovation Products has been awarded a SMT VISION Award in the category of
Dispensing Equipment for its Smart-stencil ™ technology.
Aqueous Technologies wins second 2007 VISION award
Aqueous Technologies Corporation has been awarded an SMT VISION Award
in the category of Cleaning Equipment for its innovative SMT1000-QUAD
multi-batch automatic deflusing system.
Speedline to present seven technical papers at APEX
Speedline Technologies, Inc. will take a leading role at the APEX 2007
Technical Conference, presenting seven papers
Asymtek’s
conformal coating technology adds reliability to medical electronics
Protects circuitry in implantable devices such as pacemakers.
VJ Electronix acquires Precision Manufacturing Tools
VJ Electronix will move manufacturing, primary engineering and customer
support for these models to its Littleton, MA facility.
More Industry News...
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New cleaner for assemblies with sensitive metal alloys
Due to its mild formulation, VIGON® A 250 shows excellent material compatibility
with sensitive metal alloys especially for long exposure times.
PPD-130 allows precision dispensing of dangerous or topic substances
I&J Fisnar's peristaltic pump dispenser provides accurate and repeatable
deposits while maintaining a clean and safe bench environment. New MV-7L inline AOI system provides the 'third dimension in inspection
capability'
Fully configured,
MIRTEC's new MV-7L provides one top down camera and four
side view cameras.
EFD introduces new radial spinner system
New system enables manufacturers to apply consistent amounts of adhesives,
lubricants and other production fluids inside cylindrical parts between 0.4" and
5" in diameter.
DEK Cyclone™ high
performance understencil cleaning
DEK’s Cyclone precision cleaning technology cuts total cleaning time
to under half that required by conventional cleaning systems and delivers
rapid
cassette-based paper changeover in less than 20 seconds.
More New Products...
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February 14, 2007
The Only Lead-Free Alloy that Diminishes the
5 D ’s
1. Lowest dissolution of copper
2. Low dullness
3. Low defects
4. Low dross
5. Low dollars
For more information, visit
Kester
Ultrapure® K100LD
Over the past 10 years, ESSEMTEC has
invested a great deal of time and money into the FLX line.
We believe that the market
is moving more and more towards high flexibility with fast set
up, easy-to-use operating systems and traceability ¾ all
of which are important to give smaller companies a growth path
for future growth.
At ESSEMTEC,
we feel we are the company to lead the way in this area. Our FLX
series offers the largest board size and the most feeders in the
industry while still offering a small footprint and a fair price
with Swiss quality. Come see the FLX machine in action and watch
it building boards on the EASI line at the ATE show in IL. Our
booth number is 5701. For more information, call 1-888-ESSEMTEC
or e-mail sales@essemtec-usa.com.
See us at
APEX
booth #2259.
Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Trevor Galbraith at editor@globalsmt.net.
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