| Greetings!
During SEMICON West, I ran into an old friend, colleague and Global SMT & Packaging
columnist, Joe Fjelstad. Joe was eager to tell me about a company he had
formed to develop and roll out a new assembly technology. A few days later
he sent me a draft copy of a white paper describing a solderless assembly
technology. It was one of those “wow” moments that excited
me but also left a hollow feeling in the pit of my stomach. This was in
every sense a truly disruptive technology.
Look for a feature article about this new technology from Verdant Technologies
in the September issue of Global SMT & Packaging.
Trevor Galbraith
Editor-in-Chief
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| Download
the August Issue (7.8) |
The August 2007 issue of Global SMT & Packaging magazine focuses on medical
electronics, 3D stacking trends, and liquid tin corrosion in lead-free wave
soldering. Regular EU-edition columnist Bob Willis discusses LEADOUT online
training. North-America-edition columnist Joe Fjelstad talks about IC packaging,
which is nearing its 50 year anniversary. Werner Englemaier continues his column
on solder joint reliability in a lead-free world. Download
now.
|
Achieving
solder joint reliability in a lead-free world, part 2
Werner Engelmaier
Part one of this column with the background and Solution 1 appeared in
the June 2007 issue of GSMT&P. When I started this column, it was meant
as a one-part treatment, but it grew so much it needed to be split into
two.
The large resulting CTE-mismatch between ceramic components and FR-4 PCBs
was dealt with added solder joint heights achievable with high-melting
solder balls and/or solder columns when SnPb-solders were the standard.
This solution option is not available in a Pb-free world because of the
much higher Solidus temperatures of Pb-free solders, such as the various
SAC-alloys. Read
the full column...
This column originally appeared in Global SMT & Packaging 7.7 -
August 2007.
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| Henkel:
Self-aligning Pb-free capable corner support for CSPs |
Developing
Die Attach Materials with Proven Performance
by Michael Buckley
Designing die attach materials for today’s demanding packaging applications
takes more than formulators and analytical equipment. While many in our industry
maintain that certain materials characteristics like viscosity and die shear
are good indicators of performance, the truth is that materials metrics do
not predict in-package performance in most cases. This reality is why Henkel’s
approach to materials development delivers high performance products that
are guaranteed to work – the first time. Read
more...
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What
is LEADOUT online training?
Bob Willis
The electronics industry in Europe has recently experienced one of the
biggest changes since it started around 1960. The combination of the Waste
Electronic & Electrical Equipments (WEEE) and Restriction of Hazardous
Substances Directives (RoHS) required the industry to change from the tin/lead
solder used to join the electronic components to the PCB to a lead-free
solder (LFS).
The main objective of LEADOUT project was to provide technical support
to the SMEs in the European electronics industry production chain during
the introduction of LFS alloys and assist in the implementation of LFS
technology. Read
the full column...
This column originally appeared in Global SMT & Packaging 7.7 -
August 2007.
|
IC
packaging – Nearing 50 years of evolution
Joe Fjelstad
While the glamour of the integrated circuit has diminished little over
the nearly five decades of its existence, it has become increasingly clear
in the last several years that the performance of semiconductor chips is
being gated by the IC package. Once a bit of an ‘ugly duckling’ technology
(in the early history of the IC, the package is given almost no mention),
the IC package is blossoming into a swan and it is now beginning to rival
the very technology that gave it birth in terms of the attention it is
getting. As evidence one can point to the increasing numbers of colleges,
universities and research institutes around the globe that are making a
science out of what was one time somewhat of a craft. Read
the full column...
This column originally appeared in Global SMT & Packaging 7.7 -
August 2007.
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Wave soldering:
Solder mask discoloration
We have found that after selective soldering dark stripes remain (figure
1) on the solder mask for our 8 layer board (2,4mm thickness). Do you
have any explanation or info that might help to solve this problem?
Can you tell us if this is a quality problem? Read
the answer here.
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ICI acquires Advanced
Applied Adhesives
Acquisition expands Electronic Materials Group.
Study verifies conversion
process for leaded components to Pb-free, RoHS compliant
Sanmina-SCI/E-Certa study shows it is possible to re-use Pb components by converting
them to Pb-free for use in consumer grade electronics.
Occam Process webinar
scheduled for September 11th
Verdant Electronics will conduct an informational webinar on Tuesday, September
11th, to introduce its “evolutionary” new technology which integrates
printed circuit board (PCB) fabrication and assembly (PCBA).
Digi-Key signs global
distribution pact with Johanson Technology Incorporated
Featured in Digi-Key’s print and online catalogs and available for purchase
directly from Digi-Key are a variety of JTI’s antennas, baluns, balanced
filters, couplers, diplexers, filters, and filter arrays.
More Industry News...
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Henkel launches
new series of underfills for flip-chip applications
Hysol FP4581 is a high-purity, liquid epoxy encapsulant formulated specifically
for the requirements of high-lead, bumped large die flip chip packages. Hysol
FP4583 is for applications requiring an extremely fine filler.
Endicott Interconnect
offers large, complex, high-density PC board assemblies
EI can provide high-density, double sided, hybrid PC board assemblies (SMT/PTH/press
fit) with an average component count of > 1500, including high-I/O area
array modules (CGA, LGA, PBGA) and dense, high-I/O connectors, in sizes as
large as 32” x 44”.
PROMATION introduces
economical wave unload conveyor
The OUC-500 station has been designed to provide a cost-effective means to
unload PCBs from the wave.
More New Products...
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August 29, 2007
Have something to say?
Global SMT & Packaging is currently accepting submissions
of original, previously unpublished technical articles, industry-related
book reviews, and articles that offer insight into industry trends
and developments. For more information, or to submit a query, contact
Trevor Galbraith at editor@globalsmt.net.
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