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Autumn is here, and so is the new Global SMT & Packaging media kit. 2007 will see Global SMT & Packaging continuing to grow. Our North American and European distribution will increase to twelve issues per year and we've added industry shows to our special distribution list. Download the 2007 media kit from our site. I hope I get the chance to see many of you who are attending ATE 2006 next week at the show. Global SMT & Packaging will be conducting select video interviews on the show floor as well as filming the 2006 Global Technology Awards ceremony, which will be held during the show.
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  September is cleaning month, with articles on cleaning lead-free materials by Thomas M. Forsythe and Michael Konrad and an article on atmopheric plasma as a new surface treatment technology for cleaning PCBs. We also cover rework with an article by Al Cabral on achieving improved system-to-system performance across similarly configured rework systems. Columns in September's issue cover microelectronic miniaturization, challenges in lead-free soldering, solderability testing, and specifying PCBs for lead-free assembly. We also feature a preview of ATExpo 2006 and an interview with Derek Gaston of Europlacer, plus industry and association news and new product spotlights.
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Joe Fjelstad
 This column originally appeared in Global SMT & Packaging issue 6.7, August 2006 |
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Fairy tales do come true: an SnPb paste capable of Pb-free temps Just as Cinderella’s 12:00 deadline turned her coach into a pumpkin
in the famed children’s fairy tale, at midnight on June 30th all electronics
manufacturing will magically transform to lead-free. Well, not quite. But,
the anticipatory build-up to the RoHS deadline would certainly lead one to
believe that was the case. Quite the opposite is true and, in fact, there are
many products that will be exempt from the legislation – at least in
the short-term – meaning that numerous electronics firms will still be
running tin-lead processes. The big question, though, is how these companies
will cope with the inevitable interaction of lead-free terminated components
and board finishes within a SnPb process. Will they scour the kingdom in search
of elusive tin-lead terminated devices? Doubtful. Read more... |
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Dongkai Shangguan
 A more fundamental question, however, is ‘know-what’ and ‘know-when’, or the question of ‘do things right’ versus ‘do the right things at the right time’. ‘Know-what’ and ‘know-when’ are often... Read the full column This column originally appeared in Global SMT & Packaging issue 6.7, August 2006 |
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Bob Willis
 Basically I would suggest the following is a reasonable course of action for any company to adopt. I do not believe that any company adopting a similar approach would have many problems with the lead-free authorities, or as I call them the lead-free police. Read the full column
This column originally appeared in Global SMT & Packaging issue 6.7, August
2006 |
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Indium Corporation’s
blog recognized in blogging publication Candidates sought for IPC Board of Directors Transition Automation, Inc. to exhibit advanced self-cleaning squeegee systems
at Bias Show in Milan Kester to showcase
Ultrapure® K100LD at Mexitrónica 2006 |
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 Inovaxe introduces innovative solution for supply chain management - the
INOCART handling system SiliconPipe announces new interconnector design tool Clean precision in volatile dispensing situations
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%BASIC:FORWARDLINK% |
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Over the past 10 years, ESSEMTEC has invested a great deal of time and money into the FLX line.
We believe that the market is moving more and more towards high flexibility with fast set up, easy-to-use operating systems and traceability ¾ all of which are important to give smaller companies a growth path for future growth.
At ESSEMTEC, we feel we are the company to lead the way in this area. Our FLX series offers the largest board size and the most feeders in the industry while still offering a small footprint and a fair price with Swiss quality. Come see the FLX machine in action and watch it building boards on the EASI line at the ATE show in IL. Our booth number is 5701. For more information, call 1-888-ESSEMTEC or e-mail sales@essemtec-usa.com.
See us at
Assembly Tech Expo
booth #5701.
Two more reasons to rely on Juki Automation Systems
Plus, Lowest-Cost-of-Ownership
The Lowest Cost of Ownership - Period
Reflow oven energy savings documented at 15%.
Read the full report from tier one EMS company at www.kicthermal.com
The Only Lead-Free Alloy that Diminishes the 5 D ’s
1. Lowest Dissolution of Copper
Prevents Copper Erosion, Reduces Pot Maintenance and Increases Reliability
2. Low Dullness
Produces Shiny, Smooth Solder Joints
3. Low Defects
Bridge-Free with Excellent Top-Side Fillets
4. Low Dross
Anti-Drossing Additive Results in 20% Less Dross than Untreated Sn63Pb37
5. Low Dollars
Silver-Free Alloy is Approximately 50% Lower Cost than SAC305
For more information, visit Kester Ultrapure® K100LD
Have something to say?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
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