Greetings!

Global SMT & Packaging attended Nepcon South China earlier this month. My show report is available on our website.

In recent years China has benefited greatly from the movement of electronics manufacturing from west to east, and China’s position as the leading international market is assured by its sheer population of over 1 billion consumers. However, its position as the world’s leading manufacturing destination is less tenable. There are already signs of some manufacturers of export goods moving production to Vietnam, Thailand, Malaysia and other parts of Asia, as China’s labour pool starts to price itself out of the market.

There is no doubt that global electronics manufacturing will remain a moving target for many years to come.


Trevor Galbraith
Editor-in-Chief


 

 Download the September Issue (6.08)

September is cleaning month, with articles on cleaning lead-free materials by Thomas M. Forsythe and Michael Konrad and an article on atmopheric plasma as a new surface treatment technology for cleaning PCBs. We also cover rework with an article by Al Cabral on achieving improved system-to-system performance across similarly configured rework systems.

Columns in September's issue cover microelectronic miniaturization, challenges in lead-free soldering, solderability testing, and specifying PCBs for lead-free assembly.

We also feature a preview of ATExpo 2006 and an interview with Derek Gaston of Europlacer, plus industry and association news and new product spotlights.

Download now.

 



EFD Soldering Products
 

   
 Featured Article
Update of EU RoHS exemptions as of July 7, 2006
John H. Lau, Agilent Technologies, Inc


In this article the EU (European Union) RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) exemptions will be updated. Emphasis is placed on the exemptions proposed by theelectronic industry and the exemptions granted by the EU Commissioner. Read more...

This article was taken from Global SMT & Packaging Vol. 6 No. 7 - August 2006 

 

 



The leading cleaning chemistry & solutions provider

 

   
 Walt & Jon Custer's Market Update
Fall “busy season” and increased demand from developing nations masks global economic slowdown

Electronic equipment growth will still be reasonable in 2006. However rising interest rates and less disposable income (due to higher energy costs) will limit business and consumer spending leading to a slower expansion in 2007 & 2008.

In the USA electronic equipment orders bounced back slightly in June following a downward correction from the March ‘bubble’. At the OEM level inventories are holding steady for both finished goods and raw materials but strangely are climbing for ‘work-in-process’. Read more...

This article was taken from Global SMT & Packaging Vol.6 No. 8 – September 2006


Assemble it faster, better, for less. Attend ATExpo, September 26-28 in Rosemont, IL. 600 top suppliers and the Electronics Assembly Pavilion, the Midwest’s largest electronics manufacturing showcase. Free keynotes from Dilbert creator, Scott Adams and Robotics Innovator, iRobot. SMTA International Conference. Register today for free exhibit hall admission. Visit www.ATExpo.com for details.
 

 Featured Article
Survey of RFID case studies
François Monette, Cogiscan, Inc.


Few technologies have recently received as much attention as RFID (Radio Frequency IDentification). There are as many different types of RFID technologies as there are different types of barcode readers, labels and data formats. In the maze of technical and marketing information it becomes difficult to understand the real capabilities of different products and to set realistic expectations for any RFID project. Read more...

This article was taken from Global SMT & Packaging Vol. 6 No. 7 - August 2006


Visit GlobalTRONICS 2006

 

 Profile
The Senta Wong story


Senta Wong is regarded by many as one of the founding fathers of the PCB industry. Global SMT & Packaging editor Trevor Galbraith was granted a rare interview with him to chronicle his remarkable career in the electronics industry. Read more...

This article was taken from Global SMT & Packaging Vol. 6 No. 7 - August 2006
 
 Assembly Technology Expo 2006 Preview

This year, ATExpo will feature more than 600 leading suppliers offering hands-on demonstrations on the latest products and technologies, Technology Pavillions dedicated to electronic assembly, flexible automation and wire processing, a fully functional electronics assembly line, and an all-new technical conference with 35 innovative sessions.

The exhibition will be held 26 - 28 September, and the conference will be held 25 - 28 September.

Global SMT & Packaging will be presenting the 2006 Global Technology Awards during the expo.

Below is a highlight of some of the technologies that will be showcased at ATExpo 2006. For Global SMT & Packaging's complete show preview, visit our ATExpo Preview feature.

BPM Microsystems - Booth #5300
BPM Microsystems will highlight its latest manual programming systems, which feature USB 2.0 and support for in-circuit programming, as well the latest addition to its Helix automated device programmer.

Cookson Electronics - Booth #5732
Cookson Electronics’ new ALPHA® OM-338 PT lead-free solder paste delivers best-in-class pintestability.

 

CyberOptics - Booth #5939
CyberOptics Corporation will display SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system.

Dage Precision Industries - Booth #5606
Dage Precision Industries will showcase two of its newest developments in x-ray inspection technology. On display will be the Dage XiDAT XD7600NT digital x-ray inspection system and the new computerized tomography (CT) option.

ESSEMTEC - Booth #5701
ESSEMTEC will introduce SP900 Automatic In-line Printer within the EASi Line and display the FLX2010-LCV flexible pick-and-place system for high-mix production.

 

Eunil - Booth #5018
Eunil H.A. Americas Inc. will showcase ELM-700A Laser Marking System and the ELC-200 Label Print and Attach System.

 

Finetech - Booth #5004
Finetech will exhibit the Fineplacer® CRS 10, a compact rework system.

 

Henkel - Booth #5056
Reworkable CSP/BGA underfill provides enhanced drop-test reliability.

 

Heraeus - Booth #5504
Heraeus TF series of fluxes for chip and ball attach is highly versatile.

 

 

Indium Corporation - Booth #5231
Indium Corporation will feature ultra-low-voiding solder paste.

Juki - Booth #5034
Juki Corporation will highlight the FX-1RL high-speed chip shooter.

Kester - Booth #5236
Kester a will display UltraPure® K100LD, a lead-free bar solder alloy for the electronics industry.

KIC - Booth #5207
KIC will highlight a new profiler kit.

 

Kyzen - Booth #5138
Kyzen Corporation will exhibit the lead-free solutions AQUANOX A4520 and A4630.

 

Mirtec - Booth #5020
The MV-3L is the “World's First” five camera desktop AOI system.
 

 

MVP - Booth #5506
Machine Vision Products (MVP) will demonstrate its latest AOI technology on both in-line and tabletop systems at ATExpo.

 

Siemens- Booth #5030
Siemens Electronics Assembly Systems, a division of Siemens Energy & Automation, Inc., will introduce the new Siplace D-series platform.

Practical Components - Booth #6022
New at this year’s ATE show and exclusively from Practical Components will be the new state-of-the-art Amkor Technology PoP (PSvfBGA), a stackable very thin fine-pitch BGA package.

Speedline Technologies - Booth #5702 & EASi Line
Speedline Technologies’ popular MPM AccuFlex stencil printer will be showcased as part of the live, working electronics assembly line at the center of this year’s Assembly Technology Expo.

Tamura H.A. Machinery - Booth #5018
Tamura H.A. Machinery Inc. will display the HC33-32KLF2 local N2 inclined wave soldering system.

Transition Automation - Booth #5218
Transition Automation, Inc. will showcase advanced squeegee products.

VJ Electronix - Booth #5840
VJ Electronix will display Summit 2200 Advanced Rework Station in booth 5840.


  

 Industry News

Nortec AMI establishing North American Division
Nortec Inc, has been created to provide a direct link between the North American marketplace and the company’s headquarters in Israel. Rick Howe to take on role as president.


Philips Consumer Electronics approves the use of Cookson's ALPHA® Vaculoy® SACX™
The approval adds to the momentum that SACX™ lead-free wave solder alloy is achieving in the highly competitive lead-free alloy market.

Nepcon Shenzhen turns up the heat
Business was booming in Shenzhen last week at the annual Nepcon South China exhibition with a number of multi-million dollar orders confirmed.

Flextronics licenses Tessera's new wafer-level assembly technology
Agreement with world's largest manufacturer of camera models expands Tessera's presence in cell phones.

More Industry News...
  

 New Products Spotlight

Flexible dispense tips access hard-to-reach areas
EFD's Ultra® PP dispense tips won’t scratch delicate surfaces.

BPM Microsystems adds serialization support for FX4 and FX2 socket modules
This serialization feature was integrated with the release of BPWin 4.62 to accommodate the increased demand for Enhanced 7th Generation device programming technology.

Lead free solder paste addresses first pass yield and rework rate concerns
Cookson Electronics' new ALPHA OM-350 lead-free solder paste delivers high first pass yield and low rework rates.

More New Products...
 

 Our New Look Gets Your Message Out There

The Global SMT & Packaging newsletter now offers better advertising opportunities than ever before--place a large banner ad at the top or bottom of the newsletter, run advertising banners in multiple slots between the articles, or run an information text + image sidebar ad down our right-hand column. We bring up-to-the minute news and information to over 30,000 industry professionals every month. Contact your local advertising rep (listed at right) to see how we can include your message in upcoming newsletters.
 



%BASIC:FORWARDLINK%

Global SMT & Packaging magazine

email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com

Trafalgar Publications Limited
65 High Street
Glastonbury, Somerset
BA6 9DS United Kingdom

%BASIC:UNSUBLINK%


     
Issue 2006.08 / Sept 12, 2006

Inside...

Download the September issue
EU RoHS exemptions
Custers' Market Update
Survey of RFID case studies
Profile: Senta Wong (WKK)

ATE 2006 Preview
Industry News
New Products Spotlight
%BASIC:FORWARDLINK%
 



Electronic Manufacturing Exchange #37

Multi-Million Dollar Auction of Quality Test & Measurement and SMT/PCB Equipment.

Surplus Assets from Nokia & Tyco Electronics.

Online Auction Date:
September 20, 2006, 12AM PT
Bid live at www.dovebid.com

Featured Items:
Over 700 Lots of Chip Mounters, Feeders, PCB Chip Placers, Component Placement Machines, Pick-N-Place Machines, Screen Printers, (300+) Test Equipment, and Much More.
   





Reflow oven energy savings documented at 15%.

Read the full report from tier one EMS company at www.kicthermal.com

 

Two more reasons to rely on Juki Automation Systems

Plus, Lowest-Cost-of-Ownership

Whether you need batch, semi-automatic or high speed automated selective soldering, leaded or lead-free, Juki has the right system with the Lowest-Cost-of-Ownership. Learn why...


The Lowest Cost of Ownership - Period




The Only Lead-Free Alloy that Diminishes the 5 D ’s

1. Lowest Dissolution of Copper
Prevents Copper Erosion, Reduces Pot Maintenance and Increases Reliability

2. Low Dullness
Produces Shiny, Smooth Solder Joints

3. Low Defects
Bridge-Free with Excellent Top-Side Fillets

4. Low Dross
Anti-Drossing Additive Results in 20% Less Dross than Untreated Sn63Pb37

5. Low Dollars
Silver-Free Alloy is Approximately 50% Lower Cost than SAC305

For more information, visit Kester Ultrapure® K100LD


The ultimate in flux meets the ultimate in customized technical support.

Your resources just got bigger. Heraeus offers unrivaled technical support plus an expanded product line which includes our new line of TF Series Fluxes. These high-performance fluxes are for ball and chip attach. They are compatible with a wide range of underfills and available for high speed printing, standard printing and dispense applications.

Learn more at: www.4cmd.com




Over the last few years, ESSEMTEC has invested in R&D on all of its equipment. One specific area is Reflow.

Popular opinion is you need a large oven; say 7 to 14 zones to perform lead free soldering.

This is not necessarily correct. Lead free soldering can be accomplished with a single zone oven with the correct temperature profile.

The decision of how many zones you require depends on your production throughput requirements.

The solder paste manufacture specification sheet dictates your belt speed (Heated tunnel length / time in the oven). A longer oven provides you with a higher belt speed for a higher throughput.

With all the concern with the lead free compliance on your production floor, make sure you purchase an oven that suits your needs. Essemtec has the right oven to suit your specific needs. Call us.

See us at
Assembly Tech Expo
booth #5701.






Have something to say?

Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.


Global SMT & Packaging

E-mail: news@globalsmt.net
Website: www.globalsmt.net

Editorial Staff

Editor-in-Chief
Trevor Galbraith
Tel: +44 020 7871 7305 (EU)
Tel: +1 239 567 9736 (US)

China Regional Editor
Lu Shuzhen
Tel: +86 (351) 652 3813

Managing Editor
Heather Lackey
Tel: +1 (828) 278 0192

Circulation and Subscriptions
Tel: +44 (0)1458 832137
subscriptions@globalsmt.net

Typesetting & Design

Matt Hirst

Advertising
Europe
David Garnsworthy
Tel: +44 (0)1458 833207

United States - East Coast

Ron Friedman
Tel: (860) 232 8337

United States - Mid West
Bob Casey
Tel: +1 (847) 223-5225

United States - West Coast

Liz Richards
Tel: +1 (815) 363 3497

China
Crystal Luo
Tel: +86 (21) 54181366