Newsletter 2006.Oct.02

Hello!

2007 fast approaches--before you know it, the IPC/APEX/Designers Summit conference and exposition will be kicking off. Global SMT & Packaging has set up a "Show Central" mini site offering pre-show information and previews, show reports during the show and interviews from the show floor afterward.

Add Show Central to your favorites and check back frequently to stay on top of IPC/APEX/Designers Summit: Global SMT & Packaging's Show Central

Trevor Galbraith
Editor-in-Chief

Download the October Issue (6.09)

October's technical features kick off with John Lau's comparison of EU and China RoHS. William Coleman and Michael Burgess talk about step stencils. Michael Kochanowski and Brian Toleno explain the use of corner glue epoxies to improve BGA shock and bend performance. In this month's columns, Werner Engelmaier discusses printed circuit board reliability, Joe Fjelstad talks printed circuits, and Bob Willis tells us about the LEADOUT photolibrary. The issue also features an interview with CyberOptics' Dr. Steven R. Case, a product focus on ICON's fully automatic stencil printer, industry & association news and our usual new products feature. Download now.

Featured Column

Challenges in Lead-Free Soldering
Dongkai Shangguan

As we enter the post-July 1, 2006 era, most of the large PCBA factories in the world are running lead-free soldering. However, challenges remain, and process optimization is essential, particularly for soldering and rework of large, thick boards. Read the full column

This column originally appeared in Global SMT & Packaging issue 6.8, September 2006

Henkel: SnPb paste capable of Pb-free temps

RoHS Compliance and Pb-free Capability: One in the Same?
by Kevin Curran, the electronics group of Henkell

Absolutely not. Though many in the industry would lead you to believe that a RoHS compliant product ensures lead-free process capability, in fact, nothing could be further from the truth. RoHS compliance simply means that a product or a material does not contain any of the hazardous substances banned under the legislation. But, just because a material is free of the RoHS list of excluded substances, doesn’t mean it can withstand processing at the elevated temperatures of lead-free. There are countless examples of compliance versus capability but, in this case, we’ll take a look at surface mount adhesives (SMAs). Read more...

Featured Column

PCB Solderability Assessment – The Industry Standard
Bob Willis

Solderability testing has become more common in the industry, particularly to assess components and printed board surface finishes during the transition to lead-free manufacture. The wetting balance is the standard method of test and provides the repeatability that other methods do not. The wetting balance is the more professional way of assessing the performance of printed boards finishes, but has not been used that extensively in the assembly or fabrication industry due to the cost of the system. Read the full column

This column originally appeared in Global SMT & Packaging issue 6.8, September 2006

New show for electronics production: SWEPEX

Featured Column

How to Specify Reliable PCBs for Lead-Free Solder Assembly
Werner Engelmaier

The threat to the reliability of printed circuit boards (PCBs) and their survival during the assembly process comes primarily from one source—the temperatures required during the soldering processes for the assembly of the components onto the PCB. These reliability threats were first discussed in this column in the October 2001 [GSMT&P 1.3] issue and more recently, with emphasis on the high lead-free soldering process temperatures, in the September 2005 [GSMT&P 5.8] and August 2006 [GSMT&P 6.8] issues. Read the full column

This column originally appeared in Global SMT & Packaging issue 6.8, September 2006

Featured Column

Microelectronic miniaturization… past, present and future
Joe Fjelstad

Nobel laureate Dr. Richard Feynman is revered by physicists the world over for his contributions to quantum mechanics, and he endeared himself to many nonscientists by his extraordinary ability to make simple and comprehensible matters that might otherwise seem too complex for the average person to grasp. One of the most inspired demonstrations of this ability was during the hearings after the Challenger disaster when Feynman shattered an O-ring made of the same material used on the shuttle’s booster rockets after dipping it in ice water to reduce its temperature to one equivalent to that experienced by the Challenger’s boosters on the day of the tragedy. However, it is a prescient talk Dr. Feynman gave in late 1959, at a meeting of the American Physical Society at California Institute of Technology that truly stands out for the electronics industry. The talk was titled: “There’s Plenty of Room at the Bottom”1, and it is broadly recognized as a talk that crystallized thinking relative to the future of product miniaturization. Read the full column

This column originally appeared in Global SMT & Packaging issue 6.8, September 2006

Industry News

Digi-Key and Comchip ink global distribution agreement
Comchip Technology Corporation designs and manufactures switching, Schottky and Zener diodes as well as transient voltage suppressors (TVSs), transistors, ESD suppressors and more.

Transition Automation, Inc. to exhibit advanced Squeegee Systems at Matelec 2006 in Madrid, Spain
The show is Spain’s largest Electronics Technology and Production Show, and is occurring October 24 through 28 at Ifema – Parque Ferial Jauan Carlos I, Madrid, Spain.

CyberOptics Semiconductor to showcase new products at SEMICON Japan 2006
It will also show its industry leading reflective wafer mapping sensors at the exhibition in booth 7B-404.

More Industry News...

New Products Spotlight

Dispensing workstation applies same amount every time, for higher output with less rework
EFD's Ultra 2400 dispensing workstation removes all guesswork and variability from the fluid dispensing process

PROMATION provides low-cost post-AOI sorting solution
PROMATION announces that it can provide numerous versions of equipment for post-AOI sorting and rework.

OK International launches high power, mainstream market soldering system
Characterised by an innovative power coil assembly, advanced tip geometry and an extended easy access tip range, the PS-800E features a larger conductive area for more efficient thermal energy transfer.

More New Products...

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email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com

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November 3, 2006

Inside...

Download the October issue
Column: Dongkai Shangguan
Henkel: RoHS compliance
Column: Bob Willis
New show: SWEPEX
Column: Werner Engelmaier
Column: Joe Fjelstad
Industry News
New Products Spotlight
Forward to a colleague

Two more reasons to rely on Juki Automation Systems

Plus, Lowest-Cost-of-Ownership

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The Lowest Cost of Ownership - Period

Reflow oven energy savings documented at 15%.

Read the full report from tier one EMS company at www.kicthermal.com

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Prevents Copper Erosion, Reduces Pot Maintenance and Increases Reliability

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Produces Shiny, Smooth Solder Joints

3. Low Defects
Bridge-Free with Excellent Top-Side Fillets

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Anti-Drossing Additive Results in 20% Less Dross than Untreated Sn63Pb37

5. Low Dollars
Silver-Free Alloy is Approximately 50% Lower Cost than SAC305

For more information, visit Kester Ultrapure® K100LD

Have something to say?

Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.

Global SMT & Packaging

E-mail: news@globalsmt.net
Website: www.globalsmt.net

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