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We finished up the October issue just after getting back from this year's Assembly Technology Expo, at which we presented the winners of the 2006 Global Technology Awards with their trophies. The ceremony and winner interviews are available as an online video, as are four interviews I conducted during the show. Even more video interviews are scheduled to take place during IPC/APEX early next year.
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  October's technical features kick off with John Lau's comparison of EU and China RoHS. William Coleman and Michael Burgess talk about step stencils. Michael Kochanowski and Brian Toleno explain the use of corner glue epoxies to improve BGA shock and bend performance. In this month's columns, Werner Engelmaier discusses printed circuit board reliability, Joe Fjelstad talks printed circuits, and Bob Willis tells us about the LEADOUT photolibrary. The issue also features an interview with CyberOptics' Dr. Steven R. Case, a product focus on ICON's fully automatic stencil printer, industry & association news and our usual new products feature. Download now.
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Thomas M. Forsythe, Kyzen Corporation
 This article was taken from Global SMT & Packaging Vol. 6 No. 8 - September 2006
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 Based upon a composite of 61 large, global OEMs, 2Q’06 electronic
equipment revenues increased 8% vs. the same quarter in 2005.
The largest end markets (personal computers and mobile phones) continued
to grow but at a slower pace. Developing nations drove 2Q’06 cell
phone increases. However as OEM sales continued to grow, inventories
increased to worrisome levels for component distributors, semiconductor
makers and EMS companies. OEMs have clearly shifted the inventory burden
to their suppliers). Read
more...
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Michael T. Konrad, Aqueous Technologies, Inc.
 The first thing one must consider is whether or not to clean. Is the
flux left on the board after reflow inert? Is the appearance of the
assembly important to the end-user? Will there be liability issues
if the board fails due to the presence of flux residues? How important
is the assembly’s reliability? Read
more... |
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 This article was taken from Global SMT & Packaging Vol. 6 No. 8 - September 2006 |
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Rework
system-to-system performance characterization
Al Cabral, VJ Electronix, Inc..
 This article was taken from Global SMT & Packaging Vol. 6 No. 8 - September 2006 | |
Digikey and SMSC sign global distribution agreement CyberOptics Semiconductor to demonstrate WaferSense at Semicon Japan Kyzen to exhibit at MALATEC 2000 Central Switzerland Enterprise Award: Rank 4 for ESSEMTEC | |
 KIC announces
PDA version of its popular KIC 24/7 Remote Process Monitor Asymtek’s
PreciseCoat Jet delivers conformal coating into tight spaces EFD's ProcessMate 3000 linear axis workstation | |
The Global SMT & Packaging newsletter now offers better advertising opportunities than ever before--place a large banner ad at the top or bottom of the newsletter, run advertising banners in multiple slots between the articles, or run an information text + image sidebar ad down our right-hand column. We bring up-to-the minute news and information to over 30,000 industry professionals every month. Contact your local advertising rep (listed at right) to see how we can include your message in upcoming newsletters.
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Reflow oven energy savings documented at 15%.
Read the full report from tier one EMS company at www.kicthermal.com
Two more reasons to rely on Juki Automation Systems
Plus, Lowest-Cost-of-Ownership
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3. Low Defects
Bridge-Free with Excellent Top-Side Fillets
4. Low Dross
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Silver-Free Alloy is Approximately 50% Lower Cost than SAC305
For
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The ultimate in flux meets the ultimate in customized technical support.
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Learn more at: www.4cmd.com
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Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
Global SMT & Packaging
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