 |
|
Have you been to our website lately? We've updated to an entirely new, easier-to-navigate design. If your company provides products or services for the electronics manufacturing and/or advanced packaging industry, be sure to get your company listed in our Industry Directory free. Simply register on the site, then click the Directory link at the top menu and "Submit a Listing". Expect to see even more great features coming to the site in upcoming weeks and months.
| |
  The May issue of Global SMT & Packaging features a review round-up of just about all the major lead-free publications available, plus three great feature articles—"IC package qualification testing for lead-free soldering" by Vern Solberg, "Thermal process optimization provides reduced energy consumption" by Piotr Kanica, and "High performance flip-chip packages with copper pillar bumping" by Joachim Kloeser and Ernst Wiessbach—and new material from our regular columnists. Also don't miss the SMT/Hybrid/Packaging 2006 preview in the EU edition!
| |
Robert V. Avila
 .... Read more... This article was taken from Global SMT & Packaging Vol.6 No. 4 – April 2006 |
|
 This article was taken from Global SMT & Packaging Vol.6 No. 5 – May 2006 | |
| | |
George A. Toskey
 This article was taken from Global SMT & Packaging Vol.6 No. 4 – April 2006 |
|
 Entries are invited from all equipment, materials and EMS companies. The competition is open to all sizes of companies. Winning companies will be rewarded with a prestigious crystal award. They will also benefit from exposure in Global SMT & Packaging magazine, Global SMT & Packaging's website and the Global Technology Award website. All winners will receive an "award winner" logo to use in their marketing materials and an "award winner" poster for diplay at exhibitions or your facility. Learn more about the awards and how you can enter your company's products or services in twenty categories. |
|
 This article was taken from Global SMT & Packaging Vol.6 No. 4 – April 2006 |
|
Kester and Vitronics Soltec team to Host a Series of Free Lead-Free RoHS assembly seminars Tyco Electronics designs custom RFID assembly system for Graphic Solutions International Henkel lead-free solder paste receives top honors | |
 ALPHA® OM-338 PT is targeted to both EMS and OEM customers using in line circuit testing. Read more...  EVS International announces EVS 3000 and EVS 6000 solder recovery system
 Aqueous Technologies presents Simple Green Stencil and Misprint Cleaner Barcode product traceability available for OmniExcel® reflow soldering systems | |
The Global SMT & Packaging newsletter now offers better advertising opportunities than ever before--place a large banner ad at the top or bottom of the newsletter, run advertising banners in multiple slots between the articles, or run an information text + image sidebar ad down our right-hand column. We bring up-to-the minute news and information to over 30,000 industry professionals every month. Contact your local advertising rep (listed at right) to see how we can include your message in upcoming newsletters.
| |
|
|
Two more reasons to rely on Juki Automation Systems
Plus, Lowest-Cost-of-Ownership
The Lowest Cost of Ownership - Period
Over the last few years, ESSEMTEC has invested in R&D on all of its equipment. One specific area is Reflow.
Popular opinion is you need a large oven; say 7 to 14 zones to perform lead free soldering.
This is not necessarily correct. Lead free soldering can be accomplished with a single zone oven with the correct temperature profile.
The decision of how many zones you require depends on your production throughput requirements.
The solder paste manufacture specification sheet dictates your belt speed (Heated tunnel length / time in the oven). A longer oven provides you with a higher belt speed for a higher throughput.
With all the concern with the lead free compliance on your production floor, make sure you purchase an oven that suits your needs. Essemtec has the right oven to suit your specific needs. Call us.
Free Technical Lead-Free Seminars in June
TIME IS RUNNING OUT!
We would like you to attend Kester and Vitronics Soltec’s Free Technical Lead-Free Seminars in June. You will receive Kester and Vitronics Soltec’s latest lead-free processing information along with case studies to help companies overcome any production difficulties they may be encountering. These seminars are technical in nature and free of commercialism.
Take advantage of this great opportunity to assemble for one day with us to learn and get last minute advice on anything pertaining to Lead-Free Assembly before the July 1st deadline.
Seminar Dates & Locations
June 7th, Chicago Area
June 14th, California Orange County Area
June 21st, Boston Area
For more information...
Have something to say?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
Global SMT & Packaging
E-mail: news@globalsmt.net
Website: www.globalsmt.net
Editorial Staff
Trevor Galbraith
Tel: +44 020 7871 7305 (EU)
Tel: +1 239 567 9736 (US)
China Regional Editor
Lu Shuzhen
Tel: +86 (351) 652 3813
Managing Editor
Heather Lackey
Tel: +1 (828) 278 0192
Circulation and Subscriptions
Tel: +44 (0)1458 832137
subscriptions@globalsmt.net
Typesetting & Design
Matt Hirst
Advertising
David Garnsworthy
Tel: +44 (0)1458 833207
United States - East Coast
Ron Friedman
Tel: (860) 232 8337
United States - Mid West
Bob Casey
Tel: +1 (847) 223-5225
United States - West Coast
Liz Richards
Tel: +1 (815) 363 3497
China
Crystal Luo
Tel: +86 (21) 54181366
