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Global SMT & Packaging is fortunate to have a number of excellent columnists each issue. This year we're bringing these columnists into the spotlight. Our new Columns Focus newsletter also includes the latest industry news and a preview of the next issue of Global SMT & Packaging. Enjoy!
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  Don't miss the feature article on the future of electronics: printed electronics. In "Printing the Electronic Future", Dr. Peter Harrop talks about how companies such as Omron, Sony, and Aveao have already put printed electronics to use--and just how much printed electronics will be involved with RFID by 2016. Also: Alec J. Babiarz talks about advances in jetting small dots of high viscosity fluid. Download now.
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Dongkai Shangguan, Flextronics
 This column was taken from Global SMT & Packaging Vol.6 No. 2 - February 2006 |
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Joe Fjelstad, Silicon Pipe, Inc.
This column was taken from Global SMT & Packaging Vol.6 No. 2 - February 2006 |
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When the electronics industry first began to discuss the mandatory move to lead-free manufacturing, it was widely believed that the transition would also enable more reliable solder joints. Bulk testing of tin-silver-copper systems showed increased strength, which should deliver joints with higher strength –most notably creep strength-- as compared to SnPb solder joints. However, with certain package types, lead-free assemblies seem to be more vulnerable to failures. To find out why, one must examine why a solder joint fails and then analyze how to amend the problem. Read more... |
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Alan Rae, Nanodynamics, Inc
 the evolution of a well-developed technology into the future and identifying gaps and challenges to its future development. The ITRS roadmap identified some time ago that following the Moore’s law path would lead us into areas where quantum effects would render silicon devices inoperable due to excessive current ‘leakage’ and other effects sometime beyond 2015.... Read more... This column was taken from Global SMT & Packaging Vol.6 No. 2 - February 2006 |
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Lead-Free Experts To Deliver Solutions at SEMICON ESSEMTEC to Display FLX2010-LCV at Southcon 2006 Dr. Ning-Cheng Lee to Emphasize Reliability at Intel Lead-Free Symposium SMT/HYBRID/PACKAGING 2006 International Trade Fair and Conference |
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Revlolutionary Thermally Conductive Adhesive from Henkel Promation Releases Small Footprint Line Loading NAND Flash Options Available With Latest BPWin Release
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• Fact and fiction in lead-free soldering • Maximizing the 'value add' of the electronic materials partner • Single ball reballing and repair of BGA components • Plus new columns by Walt Custer, Joe Fjelstad, Bob Willis, and Dongkai Shangguan, industry news, new products and more.
Look for your digital or print issue in April. |
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Inside... |
Ultrapure® K100
A Low-Cost Lead-Free Solder Bar
Ultrapure® K100 is Kester's answer to the market's need for a low-cost, lead-free solder alloy with high reliability and shiny joints. K100 is a near-eutectic Tin/Copper alloy with metallic dopants to control the grain structure, reduce dross, provide excellent hole-fill, and lower dissolution of metals into the solder pot.
Your Immediate Benefits!
- Lower costs than typical lead-free alloys, such as SAC305
- Smooth, shiny surface without shrinkage effects
- Excellent wetting and hole-fill properties
- Reduced dissolution of copper from boards and components into solder pot
- Low drossing rate
For more information, visit Kester Ultrapure® K100
Get it in print!
Guarantee your monthly copy (10 issues) of Global SMT & Packaging with our Winter 2006 Special Offer.
From January to March, new readers will receive a 25% discount off our listed prices, plus a FREE copy of the Lead Free Guide and CD-ROM.
Our Price: $225.00
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Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
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