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Last month's newsletter stated that the RoHS deadline had been extended in the UK (wouldn't that be something?). It is, however, WEEE that has been extended, until January 2007. Thank you to the readers who caught that slip! Between last month's newsletter and now, APEX happened. Held in Anaheim, California this time around, we certainly felt some of that 'Disney' magic rubbing off at the show as exhibitors experienced a level of business they'd thought had all but deserted U.S. shores. Look for a round-up of the innovations unveiled at APEX in the March issue of Global SMT & Packaging magazine, available for download below.
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  Don't miss the feature article on the future of electronics: printed electronics. In "Printing the Electronic Future", Dr. Peter Harrop talks about how companies such as Omron, Sony, and Aveao have already put printed electronics to use--and just how much printed electronics will be involved with RFID by 2016. Also: Alec J. Babiarz talks about advances in jetting small dots of high viscosity fluid. Download now.
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Peter Biocca
 The last year has been a great year for lead-free and RoHS information, and the numerous conferences, seminars, papers, technical articles and web-casts have been a little overwhelming. A substantial amount of very good information is now available to the assembler wishing to transition. This was not the case a year ago when solder alloy confusion still reigned. This article reviews the current status of lead-free and gives.... Read more... This article was taken from Global SMT & Packaging Vol.6 No. 2 – February 2006 |
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Some deceleration and bumpy times likely in 2006
 we begin to get a good picture of how the end markets performed as 2005 closed. Using quarterly composites of revenue, net income and inventory for representative companies in each sector, it is clear that 2005 finished quite strongly. Instruments and control equipment saw sales grow 10% in 4Q'05 vs. the same quarter in 2004. Communications equipment performance was also heartening. The 'top 6' telecom companies grew almost 11% annually although growth slowed slightly to 9% in the fourth quarter. Wireless-focused companies did the best.... Read more... This article was taken from Global SMT & Packaging Vol.6 No. 3 – March 2006 | |
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Joe Belmonte and Srinivasa Aravamudhan
 The use of such a miniature component presents several significant challenges solder paste printing.... Read more... This article was taken from Global SMT & Packaging Vol.6 No. 2 – February 2006 |
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 Read more... This article was taken from Global SMT & Packaging Vol.6 No. 2 – February 2006 |
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Aqueous Technologies Appoints Florida Representative Pertti Korhonen Appointed CEO of Elektrobit Group Kyzen to Exhibit at Carolinas Chapter IMAPS Symposium | |
 Essemtec will highlight the FLX2010-LCV flexible pick-and-place system for high-mix production in its Florida representative Kurt Whitlock Associates' booth, which is located at 413-415 at the Southcon exhibition and conference, scheduled to take place March 7 to 9, 2006, at the Orange County Convention Center in Orlando, Fla. Read more... BP Microsystems Adds Support for VSP Devices RVSI Inspection Introduces Vision System for Defect Inspection New VectraElite Wave Soldering System | |
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| Inside... |
Two more reasons to rely on Juki Automation Systems
Plus, Lowest-Cost-of-Ownership
The Lowest Cost of Ownership - Period
Over the last few years, ESSEMTEC has invested in R&D on all of its equipment. One specific area is Reflow.
Popular opinion is you need a large oven; say 7 to 14 zones to perform lead free soldering.
This is not necessarily correct. Lead free soldering can be accomplished with a single zone oven with the correct temperature profile.
The decision of how many zones you require depends on your production throughput requirements.
The solder paste manufacture specification sheet dictates your belt speed (Heated tunnel length / time in the oven). A longer oven provides you with a higher belt speed for a higher throughput.
With all the concern with the lead free compliance on your production floor, make sure you purchase an oven that suits your needs. Essemtec has the right oven to suit your specific needs. Call us.
Must See Kester Activities at APEX 2006
Kester cares about its customers and lead-free RoHS implementation. It is because of this that we have dedicated our booth 1085 at APEX to be Best Lead-Free RoHS information Center. It's the one booth at APEX designed to get you all the latest implementation information at one place. Please click on the button below to learn more about Kester's activities at APEX 2006 or visit Kester at www.kester.com.
![[ click here to view ]](http://content.041072.com/b_view_orb.gif)
Get it in print!
Guarantee your monthly copy (10 issues) of Global SMT & Packaging with our Winter 2006 Special Offer.
From January to March, new readers will receive a 25% discount off our listed prices, plus a FREE copy of the Lead Free Guide and CD-ROM.
Our Price: $225.00
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Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
Global SMT & Packaging
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