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This issue of Global SMT & Packaging electronic edition brings you some of our featured columns. Find information on IC packaging innovations, care of Joe Fjelstad, read more on real-life lead-free processing issues from Alan Rae, and learn about the LEADOUT benchmarking project from Bob Willis. As always, you'll also find the latest industry news and product announcements.
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  How much more or less effective is Sn/Ag/Cu solder paste than Sn/Pb when it comes to the self-alignment of misplaced fine pitch components? How significantly can cleanliness standards improve quality when working with fiber optic connectors? How necessary is underside wipe cleaning in the stencil printing process? What alternatives, besides solder paste, may be available for lead-free component attachment? Issue 6.6's featured articles answer these questions and more. You'll also find the latest from our regular columnists, industry news, new product reports, association news, a review of SMT/Hybrid/Packaging 2006, and an interview with Panasonic's Tom Bernhardt.
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Joe Fjelstad, Silicon Pipe, Inc.
 Over the last decade and a half there has been a major shift in electronic packing technology away from peripherally leaded though-hole and surface mounted components to area array packages such as the BGA. Over that same time period there has been a nearly simultaneous trend to reduce the size of these packages. This is because one of the intrinsic advantages of area array.... Read more... This column was taken from Global SMT & Packaging Vol.6 No. 5 - May 2006 |
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Macromelt® Provides Solution for Auto Safety System Fueled by technology development and increased device functionality, significant advances in automotive technology are occurring at a rapid pace. Over the last several years, automotive electronics has experienced dramatic growth – between 10% and 15% per year. And, with advances in automotive safety and comfort devices, the total electronics content of modern vehicles will only continue its upward climb. |
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Alan Rae, NanoDynamics
 This column was taken from Global SMT & Packaging Vol.6 No. 5 - May 2006 |
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Bob Willis, leadfreesoldering.com
 It is now open to external companies. Information on how your company can participate can be found at the end of this column, but first some background and information on the LEADOUT benchmarking project.... Read more... This column was taken from Global SMT & Packaging Vol.6 No. 5 - May 2006 |
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3,000 new Flextronics jobs in Hungary Kyzen’s Applications Laboratory grows 50% Everett Charles Technologies announces consolidation of atgTest Systems and Luther Maelzer |
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ESSEMTEC introduces SP900 automatic in-line printer Lead Detector Kit instantly finds lead residue Dispensing workstation applies same amount every time
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%BASIC:FORWARDLINK% |
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Ultrapure® K100
A Low-Cost Lead-Free Solder Bar
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Your Immediate Benefits!
- Lower costs than typical lead-free alloys, such as SAC305
- Smooth, shiny surface without shrinkage effects
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- Reduced dissolution of copper from boards and components into solder pot
- Low drossing rate
For more information, visit Kester Ultrapure® K100
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Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
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