Newsletter 2006.Jul.02

Hello!

During these slow summer months, we thought it might be fun to look back at the last year's worth of interviews we've run in the magazine. Hope you enjoy!

Trevor Galbraith
Editor-in-Chief

Download the June/July Issue (6.06)

How much more or less effective is Sn/Ag/Cu solder paste than Sn/Pb when it comes to the self-alignment of misplaced fine pitch components? How significantly can cleanliness standards improve quality when working with fiber optic connectors? How necessary is underside wipe cleaning in the stencil printing process? What alternatives, besides solder paste, may be available for lead-free component attachment? Issue 6.6's featured articles answer these questions and more. You'll also find the latest from our regular columnists, industry news, new product reports, association news, a review of SMT/Hybrid/Packaging 2006, and an interview with Panasonic's Tom Bernhardt.

Download now.

Henkel: Enhancing Pb-free Solder Joint Reliability

Enhancing Pb-free Solder Joint Reliability
by Brian Toleno, Ph.D. and Steve Dowds, the electronics group of Henkel

When the electronics industry first began to discuss the mandatory move to lead-free manufacturing, it was widely believed that the transition would also enable more reliable solder joints. Bulk testing of tin-silver-copper systems showed increased strength, which should deliver joints with higher strength –most notably creep strength-- as compared to SnPb solder joints. However, with certain package types, lead-free assemblies seem to be more vulnerable to failures. To find out why, one must examine why a solder joint fails and then analyze how to amend the problem.

Interview - Aqueous Technologies CEO Mike Konrad

From small beginnings to a global leader

Aqueous Technologies was formed in 1992 by the husband and wife team, Mike and Debbie Konrad. From small beginnings the company has grown to a multi-award winning, global leader in the field of aqueous cleaning systems, ultrasonic stencil cleaning systems, ionic contamination testers, and cleaning chemistries. Aqueous Technologies recently moved into a new multi-million dollar factory in Ranch Cucamonga, CA to provide the space required for it’s ambitious global expansion. Global SMT & Packaging attended the opening and spoke to CEO Mike Konrad about his plans for the future.

Read our interview with Mike Konrad

Interview - Essemtec Director Martin Ziehbrunner

Modularity key to this company's strategy

While many large suppliers of production equipment have struggled with the complexity of globalisation, the long-established Swiss manufacturer Essemtec AG has benefited from producing a wide range of small- to medium-sized production equipment that neatly fits into the new footprint of European and American manufacturers. Martin Ziehbrunner (Managing Director) explained the strategies that are propelling this dynamic company into the forefront of the electronics industry.

Read our interview with Martin Ziebrunner

Interview - OK International CEO Mark Cowell

Rebranding for the global market

On 1 June, OK International issued a press release announcing that ‘in response to the unique needs of the rapidly evolving global electronics manufacturing sector’ it was dropping its Metcal, Techcon Systems and Impell brand names and re-branding its product lines under the single global OK International brand. Here, OK International president Mark Cowell explains the driving forces behind the move and, just as importantly, the customer benefits.

Read our interview with Mark Cowell

Interview - Hover-Davis co-founder John Hover

Carving success out of a niche

There is an old adage: “You can tell the industry pioneers by the arrows sticking in their backs”. Hover-Davis has made a profession of specializing in the niche market of feeder technology and making them better than the original. Global SMT & Packaging caught up with company co-founder John Hover to find out how they did it.

Read our interview with John Hover

Interview - Messe Muenchen Director Klaus Dittrich

Bringing manufacturers & suppliers together

Messe Muenchen presides over the largest show in the electronics manufacturing industry. As Productronica 2005 looms on the horizon, Global SMT & Packaging asked MMI director, Klaus Dittrich what the future holds for manufacturing exhibitions in the west.

Read our interview with Klaus Dittrich

Interview - Juki Automation Systems CEO Bob Black

New markets, new challenges

JUKI boasts one of the largest installed bases of pick-and-place equipment in the world, with more than 15,000 machines in operation. The U.S. company’s charismatic CEO Bob Black has worked in the placement industry since its infancy 25 years ago, but still finds the passion to keep driving the business into new markets and manufacturing challenges. Global SMT & Packaging Editor, Trevor Galbraith, visited Bob at JUKI’s North Carolina headquarters to find out more about one of the industry’s larger-than-life characters.

Read our interview with Bob Black

Interview - Kyzen Corporation CEO Kyle Doyel

Global expansion serves this company well

Kyzen Corporation is universally acknowledged as the leading supplier of cleaning chemistry in the United States. During the last few years, the company has expanded globally with regional offices in Singapore to address the Asian market and more recently in Spain for the European market. Global SMT& Packaging Editor, Trevor Galbraith spoke to Kyle Doyel, Kyzen’s CEO about their current and future plans.

Read our interview with Kyle Doyel

Interview - Everett Charles Technologies CEO Pat Flynn

Producing best-in-class test equipment

Everett Charles Technologies (ECT) is the test end of the Dover Technologies Group and comprises six operating companies. It grew significantly during the 90s through multiple acquisitions to become a strong and consistent provider of best-in-class test equipment from bare PCB through to semiconductor test. Global SMT & Packaging editor Trevor Galbraith discussed ECT's future strategy with CEO Pat Flynn.

Read our interview with Pat Flynn

Interview - TYCO Electronics GM George Szekely

Creating niches in assembly automation

The PC board assembly automation business of TYCO Electronics is a multifaceted machine that grew mainly through acquisitions such as Quad and several others, including ASG and Wand Singulation. Today the company has a product offering in virtually every stage of the assembly process, but more importantly, it has created some significant niches it can call its own. Trevor Galbraith interviews TYCO Assembly Automation’s General Manager, George Szekely.

Read our interview with George Szekely

Industry News

DOVER Corporation announces Vitronics Soltec up for Sale

Dover reports Q2 results and planned divestiture of seven businesses

Dr. Ning-Cheng Lee appointed to CPMT Board of Governors

Kester acquired by Illinois Tool Works Inc.

Flip chip substrate supply may be tight through end of 2006

More Industry News...

New Products Spotlight

Easy transition to lead-free soldering

Affordable package design verification from FocalSpot

Intertronics rocks your world!

More New Products...

%BASIC:FORWARDLINK%

Global SMT & Packaging magazine
email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com

Trafalgar Publications Limited
65 High Street
Glastonbury, Somerset
BA6 9DS United Kingdom

%BASIC:UNSUBLINK%

July XX, 2006

Inside...

Download the June/July issue
Enhancing Pb-free reliability
Interviews:
Aqueous' Mike Konrad
Essemtec's Martin Ziehbrunner
OK Int'l's Mark Cowell
Hover-Davis's John Hover
MMI's Klaus Dittrich
Juki's Bob Black
Kyzen's Kyle Doyel
ECT's Pat Flynn
TYCO's George Szekely
News:
Industry News
New Products Spotlight
%BASIC:FORWARDLINK%

Reflow oven energy savings documented at 15%.

Read the full report from tier one EMS company at www.kicthermal.com

QFP Lead Straightening Tool

Repair bent leads in a jiffy.
All sizes QFP and TQFP. Pitch 0.4mm to 1.0mm. Stainless steel template with 46 different patterns. Use dental picks & tweezers to adjust pins to align in precision recessed template slots. Cheap way to recover expensive parts. Essential workbench tool for the serious tech. Also use for incoming QA inspection. US Design Patent D,512,970.

www.QFPTOOL.com

Ultrapure® K100
A Low-Cost Lead-Free Solder Bar

Ultrapure® K100 is Kester's answer to the market's need for a low-cost, lead-free solder alloy with high reliability and shiny joints. K100 is a near-eutectic Tin/Copper alloy with metallic dopants to control the grain structure, reduce dross, provide excellent hole-fill, and lower dissolution of metals into the solder pot.

Your Immediate Benefits!

Lower costs than typical lead-free alloys, such as SAC305
Smooth, shiny surface without shrinkage effects
Excellent wetting and hole-fill properties
Reduced dissolution of copper from boards and components into solder pot
Low drossing rate

For more information, visit Kester Ultrapure® K100

Have something to say?

Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.

Global SMT & Packaging

E-mail: news@globalsmt.net
Website: www.globalsmt.net

Editorial Staff

Editor-in-Chief
Trevor Galbraith
Tel: +44 020 7871 7305 (EU)
Tel: +1 239 567 9736 (US)

China Regional Editor
Lu Shuzhen
Tel: +86 (351) 652 3813

Managing Editor
Heather Lackey
Tel: +1 (828) 278 0192

Circulation and Subscriptions
Tel: +44 (0)1458 832137
subscriptions@globalsmt.net

Typesetting & Design
Matt Hirst

Advertising
Europe
David Garnsworthy
Tel: +44 (0)1458 833207

United States - East Coast
Ron Friedman
Tel: (860) 232 8337

United States - Mid West
Bob Casey
Tel: +1 (847) 223-5225

United States - West Coast
Liz Richards
Tel: +1 (815) 363 3497

China
Crystal Luo
Tel: +86 (21) 54181366