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Good news--but you have to act fast. The 2006 Global Technology Awards entry deadline has been pushed back to July 28th. Visit the awards website for full details.

In this issue of Global SMT & Packaging's electronic edition, we have a preview of SEMICON West and some featured exhibits.

Trevor Galbraith
Editor-in-Chief
 

How much more or less effective is Sn/Ag/Cu solder paste than Sn/Pb when it comes to the self-alignment of misplaced fine pitch components? How significantly can cleanliness standards improve quality when working with fiber optic connectors? How necessary is underside wipe cleaning in the stencil printing process? What alternatives, besides solder paste, may be available for lead-free component attachment? Issue 6.6's featured articles answer these questions and more. You'll also find the latest from our regular columnists, industry news, new product reports, association news, a review of SMT/Hybrid/Packaging 2006, and an interview with Panasonic's Tom Bernhardt.

Download now.

SEMICON® West is the #1 annual destination for the global microelectronics industries in North America. Gain access to the people, products and information that drive the entire micro electronics supply chain—Get ready now for SEMICON West 2006.

SEMICON West will be held July 10 - 14 at the Moscone Center in San Francisco, CA.

Visit the official site for information and registration.

COMET – booth 8543
COMET will be demonstrating high-definition x-ray imaging in response to a growing need for visualization of hidden defects in high-density semiconductor packages. Featured in the booth will be the new HDCT-FOX 2D/3D X-Ray inspection system.

Everett Charles Technologies - Booth 7039
The next generation of high-performance spring pin has arrived.

Finetech – booth 7846
FINETECH’ Solder Ball Array Placement (BAP) Module is the newest application module for the FINETECH rework product range. It enables simultaneous high-precision placement of up to 200 solder balls directly onto a substrate or wafer up to 300mm diameter.

JPSA - Booth 5179
J.P. Sercel Associates (JPSA) will introduce the new IX-200 UV laser wafer processing and micromachining system.

Juki Automation Systems - Booth 8011
Juki Corporation will exhibit two CX-1 Advanced Placement Systems.

Kester - Booth 7462
Kester will introduce three new lead-free semiconductor packaging materials.

Kyzen - Booth 7850
Kyzen Corporation will introduce Micronox MX2188 low COD aqueous precision cleaner.

Lloyd Doyle - Booth No. 8147
Lloyd Doyle will be promoting the IBIS, the Interferometric Bump Inspection System, which inspect and report on the position, height and shape of solder bumps on the die-attach side of chip carriers, ensuring that the carriers are within specification for chip attachment.

Milara - Booth No. 9611
Milara Inc. will introduce AWPb 300 automatic wafer processing module with reflow oven and washer system. The system is capable of handling 150, 200 and 300 mm wafers with either a dual or single FOUP option or cassette load ports.

sp3 Diamond Technologies – booth 6143
sp3 Diamond Technologies will feature patented diamond-on-silicon (DoS) vapor deposition technology for semiconductor thermal management applications. lso displayed will be the company's diamond pin thermal dissipation technique for advanced semiconductor devices.

The SEMICON TechXPOTS ("tech spots") are four technology-focused shows within the SEMICON show. Each one features exhibits, technical presentations, Technology Innovation Showcase winners, special displays and more.

Emerging Technologies (West Hall, Level 3)
Covering exciting innovations in nanotechnology, MEMS and energy.

Test and Assembly/Packaging (West Hall, Level 2)
Featuring companies and technologies focused on front-end and final manufacturing test, assembly and packaging. Highlightsed topics include test roadmaps, design for test, packaging roadmaps, fabless roadmaps and materials for advanced packaging.

Manufacturing Productivity and Effectiveness (Esplanade Hall)
Improve your manufacturing productivity within the fab and through better device design. Featured highlights include advanced process control/advanced equipment control (APC/AEC), e-diagnostics, electronic design automation (EDA), IC design, printed circuit board design and design for manufacturing (DFM).

Challenges in Device Scaling to 45- and 32-nm (North Hall)
Content here is focused on equipment and materials challenges facing the semiconductor industry. Highlighted topics include mask infrastructure challenges, engineered substrates, interconnect, processes for advanced devices, lithography for 32 nm and metrology.

Read more...

Thirty-six courses, sponsored or co-sponsored by IEEE/CPMT, PTI, SEMI, SPIE, STEP and Standards Technology Group are scheduled for SEMICON West.

Some highlights:

Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics [IEEE/CPMT]
Ray Fillion, manager of Advanced Packaging Programs at GE Global Research, presents advanced packaging solutions for next generation microelectronics. This course will provide a strong historical background on the microelectronics industry; show the audience where packaging and interconnection are today and where they are going.

Fundamentals of MEMS Design and Fabrication [PTI]
This introductory course is designed to educate people from any background on the exciting new technologies and markets being developed in MEMS. The course begins with basic fabrication technologies, including traditional methods and the latest techniques. Next is an explanation of the governing equations of these devices, where many things are different from macro-scale electromechanical systems. Fabrication and design are illustrated with examples of existing and future products in inertial sensors, optical fiber switching, displays, and sensor networks.

Understanding and Using Cost of Ownership (COO/OEE) [SEMI]
This one-day, interactive workshop provides the attendee with an expert understanding of COO and OEE. From fundamentals and industry standards (E10, E35, E79), to applications and misuses, the attendee will gain practical knowledge they can immediately employ. Utilizing computer workstations, this laboratory workshop provides attendees with hands-on reinforcement of the sensitivities that drive costs. Use the latest generation of software* developed for International SEMATECH to examine your own equipment, materials, and fab conditions.

View the complete course list with registration information.

IMEC Research-Business Forum to focus on bringing two worlds closer

Mathias Heinrich appointed sales manager

Digi-Key Corporation amasses accolades at EDS

Tom Forsythe announces his candidacy for SMTA Board of Directors

More Industry News...
  

Hassle-free lead-free hand soldering

300mm silicon wafer singulation capability

Cost-effective grids for mass spectrometers, electron microscopes and more

Mild PCB cleaning agent VIGON® A 300 for sensitive materials

More New Products...
 

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Global SMT & Packaging magazine
email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com

Trafalgar Publications Limited
65 High Street
Glastonbury, Somerset
BA6 9DS United Kingdom

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Inside...


Download the June/July issue
SEMICON West preview
Featured Exhibitors
SEMICON TechXPOTs
Courses & Workshops
Hotel & Travel Info
Industry News
New Products Spotlight
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