Greetings!

Here's a titbit I picked up at Productronica: many suppliers of equipment and materials are stockpiling supplies ahead of an expected surge in demand around the RoHS deadline in July, (except in the UK, where this has been extended).

Despite all the hype around lead free over the past 2-3 years, it appears that most manufacturers are waiting on their customers to demand lead-free boards before they react. A dangerous strategy? Maybe. According to Peter Biocca (see page 20 in issue 6.02, downloadable below), late adopters may actually find the most economic and tried and tested solutions.

Food for thought.


Trevor Galbraith
Editor-in-Chief
 

 Download the February Issue (6.02)

Stencil printing techniques and technologies are the focus of the February issue of Global SMT & Packaging magazine with "Understanding stencil requirements for a lead-free mass-imaging process" by Clive Ashmore and "Developing the 01005 stencil printing process" by Joe Belemonte.

February is also our huge at-a-glance guide to the APEX show. Also not to miss: our interview with Kyzen's Kyle Doyle, our technology focus on surface mount solder ball assembly, our regular columnists, and a feature by Peter Biocca about beating the RoHS deadline even if you haven't started planning for lead-free yet. Download now.

 

   
 Featured Article
Challenges in 01005 placement
Parminder Singh


As demand for lighter and more compact products in the field of mobile phones, PDAs and other devices continues,
use of 01005 components - at 50% the weight and one quarter the area of 0201 components - will grow in coming years. New product designs will become yet more compact. Companies can also add new features into existing designs by introducing 01005. Compare the 01005 against the 0201.... Read more...


This article was taken from Global SMT & Packaging Vol.6 No. 1 – January 2006 
 
   
 Walt & Jon Custer's Market Update
2006: Off & running

Globally, 2005 was a decent year, driven by consumer devices (cell phones, personal
computers and new video games) plus a rebound in the telecom/datacom sector.
World electronic equipment production grew over 8%, printed circuit boards were up 6% and semiconductors 7%. Only the capital equipment suppliers (SEMI and PCB CAPEX) continued their normal ‘trailing indicator’ position in the business cycle. SEMI equipment was down 11% in 2005, but a 9% recovery is predicted for 2006.

Looking forward, reasonably optimistic forecasts are the norm. In November the SIA predicted modest... Read more...

This article was taken from Global SMT & Packaging Vol.6 No. 2– February 2006


 Featured Article
Contamination control in lead-free hand soldering
Ray Cirimele, BEST, Inc.


Can lead-free solder joints be completed using a soldering iron and tip that were previously used for tin/lead soldering? Contamination of one type of solder with another can have consequences on solder joint reliability. As many facilities transition to lead-free soldering, there will probably be a phase where both tin/lead and lead-free solders will be used at the same time. This will require that material controls are in place to prevent cross contamination of the solders.

Some facilities are considering, or implementing, the complete physical separation...Read more...


This article was taken from Global SMT & Packaging Vol.6 No. 1 – January 2006
 
 Interview
Bob Black - JUKI


JUKI boasts one of the largest installed bases of pick-and-place equipment in the world, with more than 15,000 machines in operation. The U.S. company’s charismatic CEO Bob Black has worked in the placement industry since its infancy 25 years ago, but still finds the passion to keep driving the business into new markets and manufacturing challenges. Global SMT & Packaging Editor, Trevor Galbraith, visited Bob at JUKI’s North Carolina headquarters to find out more about one of the industry’s larger-than-life characters.
Read more...


This article was taken from Global SMT & Packaging Vol.6 No. 1 – January 2006
 
 Industry News

First EU prosecution of WEEE regulations succeeds
Boots Retail (Ireland) has become the first company in Ireland and the EU to be prosecuted for offences under the Waste Electrical and Electronic Equipment (WEEE) Regulations. Read more...

Dr. Rita Mohanty Appointed to Lead Speedline Technologies' Advanced Development Group
Dr. Rita Mohanty has been appointed to lead Speedline Technologies, Advanced Development Group (ADG), a team of engineers and resources dedicated to the research and development of technological and process innovations in... Read more...

IPC Press Conference to Highlight New RoHS Lead Free Facility Certification Program
IPC has announced a program for IPC Certification for RoHS Lead Free Electronics Assembly Process Capability. This in-depth audit program will examine electronics.... Read more...

More Industry News...
  

 New Products Spotlight

 

SEHO USA presents the micro brush
The novel and patented MicroBrush series by SEHO USA allows, for the first time, the ability to mechanically remove persistent contamination from particularly remote areas. Read more...

Cogiscan introduces new offline feeder storage
The Cogiscan RFID Smart Feeder Cart expands the concept of intelligent feeders from SMT placement machines and feeder banks to storage carts. Read more...

Flexible new chipshooter for high speed
Assembléon further extends its advanced M-Series range of mid- to high-volume SMD placers with the new MG-2 chipshooter. The MG-2 will be launched on the Assembléon booth 2117 at Apex 2006. Read more...

QTEK launches a unique splicing solution
QTEK announces the launch of two new and exciting products in the QTEK range, the QTEK Combined Splice Clip and Tape, and the QTEK Splice Station. Read more...

More New Products...
 

 Our New Look Gets Your Message Out There

The Global SMT & Packaging newsletter now offers better advertising opportunities than ever before--place a large banner ad at the top or bottom of the newsletter, run advertising banners in multiple slots between the articles, or run an information text + image sidebar ad down our right-hand column. We bring up-to-the minute news and information to over 30,000 industry professionals every month. Contact your local advertising rep (listed at right) to see how we can include your message in upcoming newsletters.
 



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Global SMT & Packaging magazine

email: tgalbraith@globalsmt.net
phone: 01458 833207
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Issue 2006.02 / Feb 3, 2006

Inside...

Download the February issue
Feature: 01005 placement
Walt & Jon Custer's Market Update
Feature: Contamination control
Interview - Bob Black
Industry News
New Products Spotlight
%BASIC:FORWARDLINK%
 

ECD Exhibits Industry's First RoHS Compliant Thermal Profiler at APEX

Visitors to ECD's booth #2211 at upcoming IPC APEX tradeshow February 8-10, 2006 will be amongst the first to see the latest development in Lead-Free soldering process control, the new RoHS Compliant SuperM.O.L.E.® Gold thermal profiler. Learn more at www.ecd.com


Lead-Free Profiling Leader


QFP Lead Straightening Tool

Repair bent leads in a jiffy.
All sizes QFP and TQFP. Pitch 0.4mm to 1.0mm. Stainless steel template with 46 different patterns. Use dental picks & tweezers to adjust pins to align in precision recessed template slots. Cheap way to recover expensive parts. Essential workbench tool for the serious tech. Also use for incoming QA inspection. US Design Patent D,512,970.

www.QFPTOOL.com


Online Auction of Late Model Surface Mount Assembly Equipment

Sale Closing:
16 Feb 2006 at 16:00 CET

Location of Assets:
Le Mans, France

Assets include:
Philips FCM 'Base 1' Chip Shooters (Qty 3), Universal GSM I & II Flex Placement Machines (Qty 4), Asymtek M620 and Camalot 3100 Glue Dispensers, Board Handling Equipment, Large Qty of Universal and Philips Feeders (Over 750) and Machine Spares

More information


Must See Kester Activities at APEX 2006

Kester cares about its customers and lead-free RoHS implementation. It is because of this that we have dedicated our booth 1085 at APEX to be Best Lead-Free RoHS information Center. It's the one booth at APEX designed to get you all the latest implementation information at one place. Please click on the button below to learn more about Kester's activities at APEX 2006 or visit Kester at www.kester.com.

[ click here to view ]



Get it in print!


Guarantee your monthly copy (10 issues) of Global SMT & Packaging with our Winter 2006 Special Offer.

From January to March, new readers will receive a 25% discount off our listed prices, plus a FREE copy of the Lead Free Guide and CD-ROM.
Our Price: $225.00

Subscribe now.....


Have something to say?

Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.


Global SMT & Packaging

E-mail: news@globalsmt.net
Website: www.globalsmt.net

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