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2006 is ending with a bang. Sales of electronic consumer goods were sluggish
in the run-up to Christmas, but the stores are packed with bargain hunters
soaking up the excess inventory - phew!
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  The November/December 2006 issue spotlights the 21 winners of Global Technology Awards, the awards having been presented at ATExpo in the fall. The technology focus for this issue brings timely information on verifying chip authenticity, inventory management, modern AOI systems and tin-copper based solder options for lead-free assembly. Regular columnists Walt & Jon Custer offer their prognostications for 2006 through 2008. In the European edition, Bob Willis covers lead-free component removal. In the North American edition, Joe Fjelstad discusses reincarnations of past IC packaging solutions. Juki's Bob Black offers a guest column on component placement throughputs, and Editor-in-Chief Trevor Galbraith interviews Speedline Technologies' (which was recently acquired by ITW) Pierre de Villemejane. Download now.
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Werner Engelmaier
 This column originally appeared in Global SMT & Packaging issue 6.9, October 2006 |
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Lead-free solder
joint voiding: While there are conflicting opinions on the effect of voiding in lead-free
solder joints in relation to how much is too much and whether or not voiding
causes any long-term reliability issues, one thing remains clear: Pb-free solder
joints are more prone to voiding than tin-lead joints and there are a variety
of contributing factors. Read
more... |
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Joe Fjelstad
This column originally appeared in Global SMT & Packaging issue 6.9,
October
2006 |
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Bob Willis
 This column originally appeared in Global SMT & Packaging issue 6.9, October 2006 |
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Tyco announces executive team to lead Tyco Electronics as independent
company Indium Corporation
receives fourth Frost & Sullivan award phoenix|x-ray introduces new website |
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 I&J Fisnar Inc. launch I&J7900
RoHS compliant dispensing robot EFD's tabletop automation system streamlines repetitive fluid dispensing
applications Transition Automation extends Permalex product family
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Forward to
a colleague |
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Two
more reasons to rely on Juki Automation Systems
Plus, Lowest Cost of Ownership
Whether you need batch, semi-automatic or
high speed automated selective soldering, leaded or lead-free, Juki
has the right system with the Lowest Cost of Ownership. Learn
why...
Reflow oven energy savings documented at 15%.
Read the full report from tier one EMS company at www.kicthermal.com
The Only Lead-Free Alloy that Diminishes the 5 D ’s
1. Lowest
dissolution of copper
2. Low dullness
3. Low defects
4. Low dross
5. Low dollars
For more information, visit
Kester
Ultrapure® K100LD
Have something to say?
Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
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Global SMT& Packaging Editorial Staff Editor-in-Chief
Trevor Galbraith Tel: +44 020 7871 7305 (EU) Tel: +1 239 567 9736 (US) China Regional Editor Lu Shuzhen Tel: +86 (351) 652 3813 Managing Editor Heather Lackey Tel: +1 (828) 278 0192 Circulation and Subscriptions Tel: +44 (0)1458 832137 subscriptions @globalsmt.net Typesetting & Design Matt Hirst Advertising Europe
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phone: 01458 833207
web: http://www.trafalgarpublications.com
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