Hello!

Assembly Technology Expo 2006 is right around the corner. We're very much looking forward to the awards ceremony to be held there for the 2006 Global Technology awards.

We'll also be doing something new at ATE this year: video footage from the show. If you'd like to give our readers a product demonstration from the show, contact your local rep.

Trevor Galbraith
Editor-in-Chief
 

The current status of RoHS exemptions is featured this month in a comprehensive article by John Lau. It should clear up any confusion you have about what is and is not exempt--and what you shouldn't rely on as being exempt. Meanwhile, in his regular column, Bob Willis tackles practical RoHS compliance, step by step. Also in this issue: François Monette brings us a survey of RFID case studies. Dr. Manfred Suppa discusses evaluating new polyurethane systems in micro optics and optical casting. Joe Fjelstad talks about embedded passive device (EPD) technology. Dr. Dongkai Shangguan covers technology roadmaps.

Download now.

New Conductive Adhesive Technology Lights the Way for
Efficient Manufacturing
by Dave Brand, the electronics group of Henkel

You’ve heard it before: “revolutionary”, “one of a kind”, “ground-breaking”. All of these terms are frequently used to describe new technologies introduced to the marketplace. And while the claims are often true—there is some new feature or unique application—in many cases the product benefits come with a tradeoff. There are a few instances, however, where what you see is what you get—neither performance nor ease of use nor cost efficiencies have to be sacrificed. Read more...
 

This column originally appeared in Global SMT & Packaging issue 6.6, June/July 2006
 

BP Microsystems – Booth 52C01
BP Microsystems, a leading supplier of device programming systems worldwide, will highlight the latest addition to its Helix automated device programmer.

BTU – Booth #2D21
BTU International, Inc. will showcase its Pyramax 125 solder reflow.

CyberOptics – Booth #2D21
CyberOptics Corporation will display its Flex Ultra automated optical inspection system (AOI).

DEK - Booth #2M08
DEK International will launch the latest addition to its market-leading printer range, the Horizon APi, while also showcasing the recently introduced DEK Photon printer.

ESSEMTEC – Booth 2C50
ESSEMTEC AG, a leading manufacturer of surface mount technology production equipment, will showcase EXPERT-SAFP universal prototyping station.

Europlacer – Booth 2M05
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, will display the new TornadoTM head.

FINETECH – booth #2G7
Offering innovative equipment solutions for rework and micro assembly challenges, FINETECH will highlight the compact rework system FINEPLACER® CRS10.

ICON Technologies – Booth 2C01
ICON Technologies, a leading screen printing company, will showcase the Icon i8 fully automatic screen printer.

Kester – Booth 2A41
Kester will exhibit UltraPure® K100LD, a lead-free bar solder alloy for the electronics industry in booth 2A41.

KIC – Booth 2D58
KIC, the leader of thermal process development and control products and winner of multiple industry awards, will showcase its 24/7 Process Monitor.

Kyzen Corporation – Booth 2D21
Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, will exhibit LONOX L5610 aqueous electronics and stencil cleaning solution.

Seica - Booth #2H50
Seica SpA will showcase, amongst others, their new functional test system Strategy VL, their pilot VIP flying probe system, and their Fireful selective soldering system.

Speedprint Technology – Booth 2D21
Speedprint Technology Ltd., a division of Blakell Europlacer Group, will showcase the SPRINTavi automatic inline stencil printer in Kasion Automation Ltd.’s (KAL) booth.

Tyco Electronics – Booth 3C01
Tyco Electronics’ Global Application Tooling Division (GATD) will exhibit SEP 3T servo electric press.
 
 

BP Microsystems changes its name to BPM Microsystems
The name change became effective August 28, 2006, and coincided with the opening of BPM Microsystems’ new headquarters building in Houston, Texas.

Kester presents at IPCWorks 2006
Kester announces that Peter Biocca will present at IPCWorks 2006, scheduled to take place September 10 to 14, 2006, at the American Airlines Training and Conference Center in Fort Worth, Texas.

European Semiconductor Distribution Market (DMASS) continues double digit trend
With a sales growth of almost 20%, the 2nd quarter of 2006 has been another positive surprise for the European semiconductor distribution market. Germany (regional) and Standard Analog (product-wise) took again the lead.

More Industry News...
  

JewelBox 90T delivers high-magnification, real-time x-ray images
Glenbrook Technologies announces the new JewelBox 90T, the most compact microfocus high-magnification real-time x-ray inspection system available, for advanced laboratory research and development applications.

KIC releases improved software version for KIC 24/7
KIC announces the availability of version 2.3.0.0 of its award winning KIC 24/7 thermal process monitoring system.

ESSEMTEC to unveil its HLX8200 pick & place at Globaltronics 06
ESSEMTEC AG will display its new HLX8200 pick and place at booth #D31 at the upcoming GLOBALTRONICS exhibition, scheduled to take place from October 10 to 13 in Singapore.

More New Products...
 

Next month in Global SMT & Packaging's e-newsletter we will preview Assembly Technology Expo 2006.

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Global SMT & Packaging magazine
email: tgalbraith@globalsmt.net
phone: 01458 833207
web: http://www.trafalgarpublications.com

Trafalgar Publications Limited
65 High Street
Glastonbury, Somerset
BA6 9DS United Kingdom

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Inside...

Download the August issue
Column: Werner Engelmaier
Henkel: Conductive adhesives
Column: Joe Fjelstad
Column: Bob Willis
NEPCON South China
Industry News
New Products Spotlight
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