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Next month we will be preparing for our annual awards ceremony, which will be held at the Sofitel O’Hare Hotel, Rosemount, Chicago, coinciding with ATE Expo. This year we have the biggest field of entries of any award contest, reflecting the fact that the Global Technology Awards are the only true international award and the importance attached to winning a contest presided over by a global panel of judges from all corners of our industry. We would like to thank all the contestants that entered and wish them all the very best of luck in what will be a true test of excellence.
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  The current status of RoHS exemptions is featured this month in a comprehensive article by John Lau. It should clear up any confusion you have about what is and is not exempt--and what you shouldn't rely on as being exempt. Meanwhile, in his regular column, Bob Willis tackles practical RoHS compliance, step by step. Also in this issue: François Monette brings us a survey of RFID case studies. Dr. Manfred Suppa discusses evaluating new polyurethane systems in micro optics and optical casting. Joe Fjelstad talks about embedded passive device (EPD) technology. Dr. Dongkai Shangguan covers technology roadmaps. | |
Tatiana Berdinskikh, Sun-Yuan Huang, Heather Tkalec, Douglas H. Wilson, Frank (Yi) Zhang
 Experimental results and statistical analysis were used to develop an inspection criteria matrix for 1.25 mm ferrule and 2.5 mm SM UPC connectors. This article discusses iNEMI’s research results and the team’s recommendations, which provided a baseline for IPC-8497-1, “Cleaning Methods and Contamination Assessment of Optical Assembly.” Read more... This article was taken from Global SMT & Packaging Vol. 6 No. 6 - June/July 2006 |
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 shipments sounded quite optimistic with May’05/May’04 sales up 9.4%. Growth appears to have accelerated in the current silicon business cycle with all geographies enjoying an expansion. However looking at the actual monthly (not 3-month average) data T it is obvious that SE Asia remains the growth driver. SEMI CAPEX benefitedfrom strong first quarter chipdemand as spending for semiconductor fab, assembly and test equipment reached +7% growth on a 3-month (3/12) basis. My guess is that chip equipment CAPEX will cool mid year and then resume growth in 2007. Read more... This article was taken from Global SMT & Packaging Vol.6 No. 7 – August 2006 | |
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Assemble it faster, better, for less. Attend ATExpo, September 26-28 in Rosemont, IL. 600 top suppliers and the Electronics Assembly Pavilion, the Midwest’s largest electronics manufacturing showcase. Free keynotes from Dilbert creator, Scott Adams and Robotics Innovator, iRobot. SMTA International Conference. Register today for free exhibit hall admission. Visit www.ATExpo.com for details. |
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Minna Arra, David Geiger, Dongkai Shangguan and Jonas Sjöberg
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 This article was taken from Global SMT & Packaging Vol. 6 No. 6 - June/July 2006 |
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Speedline Technologies reports positive second quarter results Flex circuit
based chip-to-chip interconnection concept validated by Intel team Contax
supplies new production line for Clofield Digi-Key
signs agreements with Fox Electronics, Future Designs and Quatech Polyonics opens office in Shenzhen, China | |
 EFD & Leister
join in marketing effort for reflow system Opti-tec 7020:
clear and simple potting Henkel develops
Pb-free die attach and mold compound material set | |
The Global SMT & Packaging newsletter now offers better advertising opportunities than ever before--place a large banner ad at the top or bottom of the newsletter, run advertising banners in multiple slots between the articles, or run an information text + image sidebar ad down our right-hand column. We bring up-to-the minute news and information to over 30,000 industry professionals every month. Contact your local advertising rep (listed at right) to see how we can include your message in upcoming newsletters.
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| Inside... |
Two more reasons to rely on Juki Automation Systems
Plus, Lowest-Cost-of-Ownership
The Lowest Cost of Ownership - Period
The ultimate in flux meets the ultimate in customized technical support.
Your resources just got bigger. Heraeus offers unrivaled technical support plus an expanded product line which includes our new line of TF Series Fluxes. These high-performance fluxes are for ball and chip attach. They are compatible with a wide range of underfills and available for high speed printing, standard printing and dispense applications.
Learn more at: www.4cmd.com
Over the last few years, ESSEMTEC has invested in R&D on all of its equipment. One specific area is Reflow.
Popular opinion is you need a large oven; say 7 to 14 zones to perform lead free soldering.
This is not necessarily correct. Lead free soldering can be accomplished with a single zone oven with the correct temperature profile.
The decision of how many zones you require depends on your production throughput requirements.
The solder paste manufacture specification sheet dictates your belt speed (Heated tunnel length / time in the oven). A longer oven provides you with a higher belt speed for a higher throughput.
With all the concern with the lead free compliance on your production floor, make sure you purchase an oven that suits your needs. Essemtec has the right oven to suit your specific needs. Call us.
See us at
Assembly Tech Expo
booth #5701.
Ultrapure® K100
A Low-Cost Lead-Free Solder Bar
Ultrapure® K100 is Kester's answer to the market's need for a low-cost, lead-free solder alloy with high reliability and shiny joints. K100 is a near-eutectic Tin/Copper alloy with metallic dopants to control the grain structure, reduce dross, provide excellent hole-fill, and lower dissolution of metals into the solder pot.
Your Immediate Benefits!
- Lower costs than typical lead-free alloys, such as SAC305
- Smooth, shiny surface without shrinkage effects
- Excellent wetting and hole-fill properties
- Reduced dissolution of copper from boards and components into solder pot
- Low drossing rate
For more information, visit Kester Ultrapure® K100
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Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
Global SMT & Packaging
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