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Global SMT & Packaging is fortunate to have a number of excellent columnists each issue. This year we're bringing these columnists into the spotlight. Our new Columns Focus newsletter also includes the latest industry and products news. Enjoy!
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  Keith Sweatman brings you "Fact and fiction in lead-free soldering". Yoshinobu Anbe explains solder spikes. Bob Willis (in the European edition) discusses stencil cleaning options, problems, and solutions.
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Bob Willis, leadfreesoldering.com
 The spots are visible on the surface of pads that have not been pasted prior to reflow. They are seen more commonly on... Read more... This column was taken from Global SMT & Packaging Vol.6 No. 3 - March 2006 |
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Dongkai Shangguan, Flextronics
This column was taken from Global SMT & Packaging Vol.6 No. 3 - March 2006 |
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MAKE SURE ALL IMAGES ARE LINKED FROM THE SITE It’s no coincidence that when the phrase “stress free” is used here, a dual meaning is absolutely intended: a stress free package and a stress free product development experience. As IC packages become increasingly complex, designing and building a cost-effective, robust product in a shrinking time-to-market window is, arguably, one of the biggest challenges facing packaging specialists today. Everyone is competing for the same piece of the pie, so getting product to market first is essential. But, being the first to introduce a new device isn’t enough on its own: the product must be proven reliable, robust and manufactured at the lowest cost possible. In most cases, today’s packaging OEMs take on an incredible amount of risk and investment resources when they put something into prototype production. |
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Joe Fjelstad, Silicon Pipe, Inc.
 This column was taken from Global SMT & Packaging Vol.6 No. 3 - March 2006 |
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Werner Engelmaier, Engelmaier Associates, L.C.
 This column was taken from Global SMT & Packaging Vol.6 No. 3 - March 2006 |
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Europlacer Appoints Linetech as Its Turkish Agent Indium Corporation Produces Wave Solder Fluxes In Europe Henkel announces strategic appointments for Asia-Pacific operations |
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NAND Flash Options Available With Latest BPWin Release Ovation Products Introduces Quik-Lok System for MPM printers RVSI Inspection Introduces Vision System for Defect Inspection
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%BASIC:FORWARDLINK% |
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Ultrapure® K100
A Low-Cost Lead-Free Solder Bar
Ultrapure® K100 is Kester's answer to the market's need for a low-cost, lead-free solder alloy with high reliability and shiny joints. K100 is a near-eutectic Tin/Copper alloy with metallic dopants to control the grain structure, reduce dross, provide excellent hole-fill, and lower dissolution of metals into the solder pot.
Your Immediate Benefits!
- Lower costs than typical lead-free alloys, such as SAC305
- Smooth, shiny surface without shrinkage effects
- Excellent wetting and hole-fill properties
- Reduced dissolution of copper from boards and components into solder pot
- Low drossing rate
For more information, visit Kester Ultrapure® K100
Get it in print!
Guarantee your monthly copy (10 issues) of Global SMT & Packaging with our Spring 2006 Special Offer.
From April to June, new readers will receive a 25% discount off our listed prices, plus a FREE copy of the Lead Free Guide and CD-ROM.
Our Price: $225.00
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Global SMT & Packaging is currently accepting submissions of original, previously unpublished technical articles, industry-related book reviews, and articles that offer insight into industry trends and developments. For more information, or to submit a query, contact Trevor Galbraith at editor@globalsmt.net.
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