| Posted by Bob Willis on 29 August 2006 at 14:18
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(This column, which originally appeared in Global SMT & Packaging magazine 6.6 (June/July 2006), is also available as a free PDF.)
The LEADOUT
Project is not just about LEAD and assembly problems, remember that the main
objective of WEEE and RoHS is the environment. Is there a benefit or not from
all these effort? This month we again take a look at the LEADOUT project
Different
industries have for several years been subject to increasing legislative
requirements towards the development of ‘Cleaning Technologies’. This is the
situation of electric and electronic industries and the imperative
implementation of lead-free soldering processes. This change has been caused by
the European Directive 2002/95/EC RoHS. According to it, the use of lead,
mercury, hexavalent chromium, cadmium and others will be banned from July 2006
Although
the main objective of the LEADOUT project is to provide technical support to
the European electric and electronic SMEs during the removal and change of lead
from the tin/lead solder used to join electronic components to the PCB, the principal
reasons of this project should be taken into account:
• The importance of the potential environmental impact (the lead waste
from the manufacturing process and the disposal of lead containing electronic
equipments at the end-of-life could contaminate the landfills and subsequently,
the Environment) and,
• The relevance of the social issues (it is mandatory the maintenance and
preservation of the involved soldering process worker’s health)
Removal of
this source of contamination will have, therefore, a considerable positive
impact in terms of quality of the working conditions and, also, in the environment
as a whole. Effectively, the threat to human health by lead accumulation in the
body due to the occupational exposure is becoming a greater concern. The
continuous inhalation of gases containing lead over limits causes chronic intoxication
affecting mainly the central neuronal and peripheral neuronal systems. Also
anaemia and renal and cardiovascular problems can be produced.
Although
the use of lead in the electronic industry seems to be minimal, the
contamination potential for lead exposure during soldering processes through
the inhalation of lead vapours is the reason to perform generated emissions
measurements. The aim is, therefore, to determine the emissions of hazardous
substances susceptible of being inhaled by the workers at the assembling
companies that use tin-lead alloys and, after this, to make a comparison to the
emissions from the industries that use lead-free solders.
With this
aim and within the framework of the LEADOUT project, several measurements of
the chemical agent emissions generated during the soldering process have been
performed. Also, a further analysis and evaluation of its potential hazardous
characteristics for the workers’ health have been made. As has been mentioned, measurements
at different companies participating in the LEADOUT project have been carried
out. These enterprises used, until now, tin-lead based pastes and solders. Once
lead free processes (mainly wave and reflow) are implemented and running at the
optimal conditions, measurements of emissions using lead-free solders will be
done.
Research centres
participating in this LEADOUT Project are in close contact with different SMEs
participating in the project and have made the measurements during a habitual
work-day. For this purpose, sampling pumps (see photos 1 and 2) are put
on the own worker close to the breathing zone. The usual activity and the
movement of worker at the soldering facility are allowed by the pump, which
gets samples of the breathed air by workers as they perform their tasks.
The organic
compounds from the fluxes (formaldehyde, isopropyl alcohol and methanol) and
the lead vapours are picked-up by the personal pump during the different steps
of the process (at reflow and wave soldering). The samples are analyzed at the
laboratories of the research centres according to the corresponding standards
NIOSH and the composition of the gaseous emissions inhaled by the worker during
the soldering process is determined. In all cases, it has been demonstrated
that the measurements performed at facilities using tin-lead alloys have values
under the levels allowed by the German normative TA LUFT as it can be seen in
following table:
NIOSH values.
TLV-TWA: average for 8h/day, TLV-C: peak
(1) Used fluxes does not contain
formaldehyde
Measurements
of the emissions at the same facilities when the change to lead-free solder has
been made will allow quantifying the change of those values after the conversion
to lead-free soldering process. As the fluxes to be used with lead-free solder
will be very similar to the ones used for present SnPb alloys, results of
Occupational Exposure Measurements are expected very comparable.
If you are
interested or you have a question about these measurements, do not hesitate to
contact
Dr.
Patricio Aguirre
, paguirre@inasmet.es
.Don’t
forget to see the webpage of the Project: www.leadoutproject.com
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