Market Report: Preparing for the 'busy season' seasonal upturn
Tuesday, 15 August 2006
The SIA’s July 3 release of May global chip shipments sounded quite
optimistic with May’05/May’04 sales up 9.4%.growth appears to have
accelerated in the current silicon business cycle with all geographies
enjoying an expansion. However looking at the actual monthly (not
3-month average) data T it is obvious that SE Asia remains the growth
driver.
SEMI CAPEX benefited from strong first quarter chip demand as spending
for semiconductor fab, assembly and test equipment reached +7% growth
on a 3-month (3/12) basis. My guess is that chip equipment CAPEX will
cool mid year and then resume growth in 2007.
Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.