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Market Report: Preparing for the 'busy season' seasonal upturn PDF Print E-mail
Tuesday, 15 August 2006

The SIA’s July 3 release of May global chip shipments sounded quite optimistic with May’05/May’04 sales up 9.4%.growth appears to have accelerated in the current silicon business cycle with all geographies enjoying an expansion. However looking at the actual monthly (not 3-month average) data T it is obvious that SE Asia remains the growth driver.

SEMI CAPEX benefited from strong first quarter chip demand as spending for semiconductor fab, assembly and test equipment reached +7% growth on a 3-month (3/12) basis. My guess is that chip equipment CAPEX will cool mid year and then resume growth in 2007. 

Download the Augst 2006 Market Update (PDF)

From Global SMT & Packaging magazine

Vol. 6 No. 7 - August 2006

 

Featured Interview

Interview - Terry Heilman, Sunstone Circuits
Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
 

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

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