Industry Blogs

Top blogs

Syndicate

6.6 - June/July 2006
 

Posted by Global SMT & Packaging on 01 June 2006 at 00:00


Download the full magazine as a PDF for FREE:

European Version PDF

North American Version PDF

Issue 6.6 / June/July 2006

- Editorial -

Business good but attendance poor at UK's leading show
Trevor Galbraith

- Technology Focus -

Standardizing cleanliness criteria for fiber optic connectors cuts costs, improves quality
Tatiana Berdinskikh, Sun-Yuan Huang, Heather Tkalec, Douglas H. Wilson, Frank (Yi) Zhang

Fine pitch component self-alignment with Sn/Pb and Sn/Ag/Cu solders
Minna Arra, David Geiger, Dongkai Shangguan and Jonas Sjöberg

Conductive adhesives and nanotechnology - alternatives for lead-free soldering
Frank Liotine, Jr.

 

- Special Features -

Tom Bernhardt interview (Panasonic)

SMT/Hybrid/Packaging 2006 - Review

 

- Regular Columns -

Impact of emissions from soldering processes (European edition)
Bob Willis

Reasoning with RoHS (North American edition)
Joe Fjelstad

Nonfunctional lands: keep vs. remove them
Werner Engelmaier

2006 outlook improves
Jon and Walt Custer


- Other regular features -

Industry news
Appointments
Association news
International diary

 

   
Quote this article in website
Favoured
Send to friend
Related articles
Save this to del.icio.us

Keywords : Trevor Galbraith, IC packaging, qualification testing, lead-free soldering, Solberg, thermal process opitimization, energy consumption, piotr kanica, flip-chip, copper pillar bumping, Kloeser, Weissbach, NEPCON Shanghai, SMT Nuremberg


Users' Comments  RSS feed comment
 

Average user rating

   (0 vote)

 


Add your comment
Name
E-mail
Title  
Comment
   Notify me of follow-up comments
   
   

No comment posted



mXcomment 1.0.9 © 2007-2008 - visualclinic.fr
License Creative Commons - Some rights reserved

Featured Interview

Breakfast with John Hartner

John Hartner is one of the most switched on and dynamic CEOs in our industry.

 

Small Matters

Sustainable manufacturing for electronics—nice idea or moral imperative?

The electronics industry has, over the course of the last half century, transformed the world in a way that only science fiction writers could have imagined when the industry was still in its infancy.

 

Lead-Free Matters

Hot air solder levelling—is it a HASL?

have said it many times in articles and seminars, Nothing Solders Like Solder, but design and manufacturing engineers need to understand all the different process options available.

 

Global Business

Sober outlook . . . Not a big surprise

Forecasts have recently been slashed for the entire global electronics food chain.

 

Industry Blogs

Keep your finger on the pulse of the industry. Stay up to date. Gain new insights. Visit industry-related blogs handpicked by the Global SMT staff