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Market Report: 2006 outlook improves PDF Print E-mail
Tuesday, 27 June 2006

End market demand is improving. Using three countries that report monthly data as examples, the USA, Japan and Taiwan/China all showed an upward trend in recent months. The post-holiday seasonal downturn in Asia appears to have reversed, and U.S. electronic equipment orders rose significantly in March. The largest chip-consuming end markets (mobile phones and personal computers) both had a good first quarter. Cellphone shipments rose 26% in 1Q’06 vs. 1Q’05 and component suppliers for mobile handsets saw an upturn in March following a brief seasonal ‘correction.’ (The full report is available for download for free using the link below.)

Download the June/July 2006 Market Update (PDF)

From Global SMT & Packaging magazine

Vol. 6 No. 6 - June/July 2006

 

Featured Interview

Interview - Terry Heilman, Sunstone Circuits
Trevor Galbraith spoke to president and CEO Terry Heilman about what makes Sunstone different from your average board shop.
 

Small Matters

IC Packaging Technology Retrospective – Part 4

The electronics industry’s mantra has for many years been "Smaller, Faster, Lighter, Better and Cheaper."

 

Lead-Free Matters

Measuring package on package-possible procedure, comments welcome

Package on package assembly features paste-only assembly or a combination of solder paste at board level and dip flux on the top row of ball terminations.

 

Global Business

Year end assessment: the path to recovery
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010.
 

Industry Blogs

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