The industry is expecting that IC package developers will furnish innovative solutions to expand functionality and assure higher performance with each new generation of product offering. Simultaneously, companies supplying
electronic components to the International market are making a number of material changes in order to achieve compliance with the European Union’s‘ Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment’ (The RoHS Directive). Foremost in achieving compliance, manufacturers will need to adapt solder processes that use alloy compositions that are, to the most part, free of lead.

This article originally appeared in Global SMT & Packaging magazine 6.5 - May 2006.

Download the full article (free) in PDF format.

Vern Solberg is the senior applications engineer with Tessera. Vern has served the industry for more than twenty-five years in areas related to design and manufacturing of electronic products including seven years with Tessera.

In addition, Solberg holds several patents for IC packaging innovations (including the folded-flex 3D package technology) and represents the company in several industry organizations including IPC, SMTA, IMAPS and he is a US delegate to IEC and the JISSO International Council (JIC).
 

Keywords : BGA, CSP, Stack Packaging, Lead-Free Soldering, Micro-contact

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