The SMTA’s annual conference, SMTA International, will be held at the Gaylord Palms Resort and Convention Center in Orlando, Florida (Conference: October 7-11; Exhibits: October 9-11). The program will consist of over 100 technical papers, 26 tutorials, an Evolving Technologies Summit, and three focused symposia across six tracks: Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Process Control, and Contract Manufacturing/Business Issues.

Over 130 leading edge suppliers will be featured in the first annual SMTAI Electronics Exhibition, which will be held Tuesday and Wednesday, October 9-10. Exhibitor space sold out seven months in advance of the show.

The technical sessions will be held on Tuesday and Wednesday. The tutorials are full- and half-day educational courses offered on Sunday, Monday, and Thursday. Sixteen of these tutorials are new.

The Evolving Technologies Summit on Monday will feature sessions on Advanced Materials, Embedded Chip Packaging, and Package Interconnect Reliability. The Summit will conclude with an Evolving Technologies Panel consisting of experts from the user and supplier segments of the electronics industry.

The Contract Manufacturing and Lead-Free Symposiums will be held on Tuesday and Thursday, respectively. The Contract Manufacturing Symposium will consist of two paper sessions on Cutting Costs in the Supply Chain and Optimizing EMS Service Delivery. The Lead-free Symposium will feature paper sessions on Solder Joint Reliability of SAC Alloy Variants, Lead-Free iNEMI Projects, Advances in Lead-Free Solder Joint Reliability, and Lead-Free Case Studies. Additionally, a plenary session will be held on a China RoHS Update.

Also on Monday, a new Global RoHS Symposium will address the RoHS Revolution and Environmental Compliance.

Many additional events at SMTA International are free to all attendees. These include:

• The Opening Session on SMTA’s End Game: Lead-Out, Labels-On, Reliability-In
• SMTA International Live Chat Rooms
• Process Advice and Defect Clinic
• iNEMI Roadmaps
• Evolving Technologies Panel Discussion
• Thermal Management Panel Discussion
• The Case for Revenue Based Recycling
• Substrate Challenges
• Regulatory Marking of Boards and Components for a Pb-Free World
• Quality Assurance Methods for High Density Package and PCBA

Rounding out the program is the Keynote Address during the Annual Meeting and Luncheon on Wednesday that will feature Andrew Alduino, Senior Optical Researcher in the Photonics Technology Lab, Intel Corporation, who will speak on Implementation Challenges of Future Optical Interconnects.

For full details and to register for SMTA International, visit smta.org/smtai.

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