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Call for papers - Smart Systems Integration 2008 PDF Print E-mail
 

Posted by Global SMT & Packaging on 22 June 2007 at 10:54

The second SMART SYSTEMS INTEGRATION, European Conference & Exhibition on integration issues of miniaturized systems – MEMS, MOEMS, ICs and electronic components, takes place from 9 – 10 April 2008 in Barcelona. The Call for Papers is published. Speakers can submit their abstracts on www.smartsystemsintegration.com until 18 August 2007.

Call for Papers
European industry and science experts will discuss current issues, applications and visions related to Smart Systems Integration in an international environment. Abstracts can be submitted online to the following  topics:

  • Design of smart systems, component design and simulation
  • Microsystems packaging and system integration
  • Advanced MEMS and MOEMS technologies
  • Assembly and interconnect technologies
  • Smart systems related nano structures and devices
  • Reliability, testing and quality of components and systems
  • Materials for smart systems
  • Special aspects of integration for automotive, aeronautics, logistics, life science, RF and bio applications
  • Theoretical aspects of smart systems
  • Smart systems energizing
  • Smart communication and sensor networks

Structure and target groups
SMART SYSTEMS INTEGRATION is the international communication platform for R&D in industry and science. Its objective is to exchange know-how on integration issues of miniaturized systems and to create a basis for successful research co-operations with focus on Europe. Important target groups are the application industries such as automation, automotive, aeronautics, telecommunication, medical technology, logistics, RFID, life sciences and the underlying technologies such as microsystem technology, nanotechnology, sensors and actuators, optics, fluidics, biotechnology, chemistry, communication technologies and others.

Significance of intelligent system integration
The economic success of manufacturers and users from the different application branches is largely dependent upon system-oriented design, microsystem  and component development and miniaturized packaging of electronic products. In this environment a high level of technology is a requirement for remaining competitive in the long-term. A multitude of technologies and materials have to contribute via system integration to produce a complete new product. Intelligent system integration is thus required over all the links of the value-added chain in order to realize product developments in increasingly short development times and to be able to achieve added value in the future, too.

Organizer and supporting organizations
The international committee of SMART SYSTEMS INTEGRATION consists of scientific and industrial members. It is chaired by Prof. Dr. Thomas Gessner, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany. Co-Chair is Dr. Günter Lugert, Siemens AG and Chairman Steering Committee EPoSS. The role of Local Co-Chair 2008 is assumed by Dr. Carles Cané, Centro Nacional de Microelectrónica (CNM-IMB), Spain. SMART SYSTEMS INTEGRATION is part of the activities of EPoSS. Mesago Messe Frankfurt GmbH is the organizer of SMART SYSTEMS INTEGRATION.

For more information on conference and exhibition please visit www.smartsystemsintegration.com or contact Mesago Messe Frankfurt GmbH via phone: +49 711 61946-86 or mailto: smart@mesago.messefrankfurt.com

   
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