Lead-free legislation is now law in Europe and China, forcing most manufacturers to move to lead-free manufacturing to comply with the legislation, or simply to avoid the rising cost of traditional SnPb components. The majority of printed circuit assemblies use SAC alloys that require reflow temperatures around 240°C and peak temperatures of 260°C.

These higher reflow temperatures have created a narrower process window and an increased need for more accurate temperature measurement data. This article analyzes different thermocouple products and their suitability for modern lead-free manufacturing. Read the full article (PDF)...

This article was taken from Global SMT & Packaging Vol. 7 No. 5 - May 2007

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