| Posted by Paul Wood on 11 May 2007 at 08:43
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 This paper will help you understand the process of lead-free rework of package-on-package (POP) mounted on a PCB, which is new technology already being used in high-end graphics cards and mobile phones. Because most PCBs are double-sided, it is important not to reflow or damage opposite side packages when reworking POP.
Herein, POP rework will be discussed, including issues with lead-free processes, processing double-sided boards and advantages versus limitations of various process options. Read the full article (PDF)...
This article was taken from Global SMT & Packaging Vol. 7 No. 4 - April 2007 |
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The term/concept of synergy seems very apt when applied to the
interaction of the Occam process solderless assembly concept in
combination with a unique PCB interconnection technology called twisted
wire interconnect or TWI. 
Fortunately even the most conservative most prognosticators now see at least a subdued “recovery” in 2010. 